Abstract: A microelectronic device includes a deep trench test structure in semiconductor material of a substrate. The deep trench test structure has pad trench segments with a liner of electrically non-conductive material and a trench fill material on the liner, extending to tops of the pad trench segments. The pad trench segments extend across a probe pad region; at least 20 microns in every lateral direction. The trench fill material at the top of the pad trench segments occupies at least 25 percent of the probe pad region. The liner may electrically isolate the trench fill material from the semiconductor material, or the deep trench test structure may include a contact trench segment wherein the trench fill material contacts the semiconductor material. The deep trench test structure may be probed on the pad trench segments to measure an impedance between the trench fill material and the semiconductor material.

Abstract: A microelectronic device includes a deep trench test structure in semiconductor material of a substrate. The deep trench test structure has pad trench segments with a liner of electrically non-conductive material and a trench fill material on the liner, extending to tops of the pad trench segments. The pad trench segments extend across a probe pad region; at least 20 microns in every lateral direction. The trench fill material at the top of the pad trench segments occupies at least 25 percent of the probe pad region. The liner may electrically isolate the trench fill material from the semiconductor material, or the deep trench test structure may include a contact trench segment wherein the trench fill material contacts the semiconductor material. The deep trench test structure may be probed on the pad trench segments to measure an impedance between the trench fill material and the semiconductor material.

Abstract: An integrated circuit (IC) includes a semiconductor surface layer on a substrate including functional circuitry having circuit elements configured together with a metal-to-polysilicon capacitor on the semiconductor surface layer for realizing at least one circuit function. The metal-to-polysilicon capacitor includes a bottom plate including polysilicon, a capacitor dielectric including at least one capacitor dielectric layer on the bottom plate, a top plate on the capacitor dielectric, and contacts through a pre-metal dielectric layer that contact the top plate and contact the bottom plate. In lateral regions relative to the capacitor the capacitor dielectric layer has a thickness in a range between about 5% and about 50% of a thickness of the capacitor dielectric of the metal-to-polysilicon capacitor.

Abstract: An integrated circuit (IC) includes a semiconductor surface layer on a substrate including functional circuitry having circuit elements configured together with a metal-to-polysilicon capacitor on the semiconductor surface layer for realizing at least one circuit function. The metal-to-polysilicon capacitor includes a bottom plate including polysilicon, a capacitor dielectric including at least one capacitor dielectric layer on the bottom plate, a top plate on the capacitor dielectric, and contacts through a pre-metal dielectric layer that contact the top plate and contact the bottom plate. In lateral regions relative to the capacitor the capacitor dielectric layer has a thickness in a range between about 5% and about 50% of a thickness of the capacitor dielectric of the metal-to-polysilicon capacitor.

Abstract: In some examples, a method includes etching a substrate to form a trench, wherein the trench includes sidewalls. The method further includes forming a first isolation region in the trench by growing a first layer of a first thickness on the sidewalls using a dry oxidation technique and depositing a second layer to fill a portion of the trench, the second layer contacting the first layer. The method further includes etching third and fourth layers atop the substrate to expose a first portion of the substrate. The method further includes growing a second isolation region in the substrate through the first portion by using a dry-wet-dry oxidation technique.