Patents by Inventor Neil McClellan

Neil McClellan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Enhanced leadless chip carrier
    Patent number: 6545347
    Abstract: A plastic integrated circuit package includes a lead frame having numerous leads, a die attach pad and a ground ring. In one embodiment, the plastic integrated circuit package is provided as a plastic leadless chip carrier. Slots provided between the die attach pad and the ground ring provides support and prevent delamination from the plastic molding compound and enhanced moisture-resistance, thus resulting in a highly reliable integrated circuit package, even in the face of high temperature cycles, such as solder reflows.
    Type: Grant
    Filed: March 6, 2001
    Date of Patent: April 8, 2003
    Assignee: ASAT, Limited
    Inventor: Neil McClellan