Patents by Inventor Neil McLellen

Neil McLellen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of manufacturing an enhanced thermal dissipation integrated circuit package
    Publication number: 20050003585
    Abstract: The present invention relates to an integrated circuit package having a thermally conductive element thermally coupled to a semiconductor die and a heat sink, and a method of manufacturing said integrated circuit package. The thermally conductive element is integrated into the package to enhance thermal dissipation characteristics of the package.
    Type: Application
    Filed: March 18, 2004
    Publication date: January 6, 2005
    Inventors: Edward Combs, Robert Sheppard, Tai Pun, Hau Ng, Chun Fan, Neil McLellen