Patents by Inventor Neil Miyamoto

Neil Miyamoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Bispecific monoclonal antibodies to IL-12 and IL-18
    Publication number: 20060088529
    Abstract: A bispecific monoclonal antibody is described which comprises two moieties, one of which comprises an antigen-binding region which is specific for either the IL-12R?1 or the IL-12R?2 subunit of an IL-12 receptor, and the other of which comprises an antigen-binding region which is specific for either the IL-18R or the AcPL subunit of an IL-18 receptor.
    Type: Application
    Filed: September 8, 2005
    Publication date: April 27, 2006
    Inventors: Stewart Leung, H. Perez, Neil Miyamoto
  • High affinity soluble interleukin-18 receptor
    Publication number: 20020052475
    Abstract: A soluble, heterodimeric interleukin 18 (IL-18) receptor molecule is described which comprises two subunits, one of which comprises an extracelluar domain, or a fragment thereof, of IL-18R, and the other of which comprises an extracelluar domain, or a fragment thereof, of AcPL. Preferably, the soluble, heterodimeric receptor binds to IL-18 with higher affinity than does either IL-18R or AcPL alone.
    Type: Application
    Filed: July 19, 2001
    Publication date: May 2, 2002
    Applicant: Schering AG
    Inventors: Stewart Leung, H. Daniel Perez, Neil Miyamoto
  • Bispecific monoclonal antibodies to IL-12 and IL-18
    Publication number: 20020025317
    Abstract: A bispecific monoclonal antibody is described which comprises two moieties, one of which comprises an antigen-binding region which is specific for either the IL-12R&bgr;1 or the IL-12R&bgr;2 subunit of an IL-12 receptor, and the other of which comprises an antigen-binding region which is specific for either the IL-18R or the AcPL subunit of an IL-18 receptor.
    Type: Application
    Filed: July 19, 2001
    Publication date: February 28, 2002
    Applicant: Schering AG
    Inventors: Stewart Leung, H. Daniel Perez, Neil Miyamoto