Abstract: The present invention relates to a method for forming a polymeric nanocoating on a substrate as well as substrates bearing the polymeric nanocoating. The method comprises exposing the substrate to a plasma comprising one or more unsaturated monomeric species for a period of time sufficient to allow the coating to form on the substrate. The one or more unsaturated monomeric species comprise (i) an aromatic moiety and (ii) a carbonyl moiety. The one or more unsaturated monomeric species also comprise a crosslinking reagent.

Abstract: An electronic or electrical device or component thereof having a coating formed thereon by exposing said electronic or electrical device or component thereof to a plasma comprising one or more monomer compounds for a sufficient period of time to allow a protective polymeric coating to form on a surface thereof; wherein the protective polymeric coating forms a physical barrier over a surface of the electronic or electrical device or component thereof; wherein each monomer is a compound of formula I(a): or a compound of formula I(b)

Abstract: A method of forming a protected connection between a first connecting element, optionally mounted on a support (202), and a second connecting element, the method comprising: (i) depositing a protective material (210) on the first connecting element and/or on the support; (ii) optionally depositing an overlying coating (212) on the protective material; and (iii) pushing the second connecting element and establishing a connection between the first connecting element and the second connecting element, the connection being protected by the protective material.

Abstract: An electronic or electrical device or component thereof having a coating formed thereon by exposing said electronic or electrical device or component thereof to a plasma comprising one or more monomer compounds for a sufficient period of time to allow a protective polymeric coating to form on a surface thereof; wherein the protective polymeric coating forms a physical barrier over a surface of the electronic or electrical device or component thereof; wherein each monomer is a compound of formula I(a): or a compound of formula I(b) wherein each of R1 to R9 is independently selected from hydrogen or halogen or an optionally substituted C1-C6 branched or straight chain alkyl group; each X is independently selected from hydrogen or halogen; a is from 0-6; b is from 2 to 14; and c is 0 or 1; and wherein when each X is F or when at least one X is halogen, in particular F, the FTIR/ATR intensity ratio of CX3/C?O of the coating is less than (c+1)0.6e?0.

Abstract: The present invention relates to methods for forming antimicrobial coatings, and to compounds suitable for forming the antimicrobial coatings, and to substrates coated with the antimicrobial coatings. The coatings are formed by vapour phase plasma polymerisation of metal ion complexes each having at least one polymerisable ligand, which includes a polymerisable moiety such as a C—C double bond or a C—C triple bond.