Abstract: An apparatus senses a pressure of a fluid from a fluid medium. The apparatus has a port body with a peripheral wall surrounding an interior channel. The interior channel extends between a diaphragm on the port body and an opening for receiving the fluid. A strain gauge is disposed on the port body. The strain gauge has two or more resistors connected between input/output pads and ground pads. The resistors are spaced substantially equidistant from the ground pad to reduce mobile ion migration.

Abstract: An apparatus senses a pressure of a fluid from a fluid medium. The apparatus has a port body with a peripheral wall surrounding an interior channel. The interior channel extends between a diaphragm on the port body and an opening for receiving the fluid. A strain gauge is disposed on the port body. The strain gauge has two or more resistors connected between input/output pads and ground pads. The resistors are spaced substantially equidistant from the ground pad to reduce mobile ion migration.

Abstract: A circuit assembly includes one or more electrical conductors. Each of the electrical conductors has a first axial end and a second axial end; the first axial end is disposed opposite the second axial end. The assembly further comprises a non-electrically conductive retainer component operable to: i) retain the electrical conductor and ii) contact a lateral side and/or tip of the electrical conductor onto a conductive pad of a circuit board. The retainer component exerts an appropriate force with respect to the one or more electrical conductors such that, a respective lateral side and/or tip of each of the electrical conductors contact a corresponding electrically conductive pad on the circuit board.

Abstract: A stencil for applying a viscous material to a substrate includes a substantially planar plate affixed to the substrate, the plate having at least one aperture of a first dimension and at least one relief hole of a second dimension, the at least one aperture configured to align with a printing surface of the substrate and the at least one relief hole configured to align with a feature having a height greater than the printing surface; and a mask attached to a top surface of the plate and positioned over the at least one relief hole to protect the feature having the height greater than the printing surface from

Abstract: A circuit assembly includes one or more electrical conductors. Each of the electrical conductors has a first axial end and a second axial end; the first axial end is disposed opposite the second axial end. The assembly further comprises a non-electrically conductive retainer component operable to: i) retain the electrical conductor and ii) contact a lateral side and/or tip of the electrical conductor onto a conductive pad of a circuit board. The retainer component exerts an appropriate force with respect to the one or more electrical conductors such that, a respective lateral side and/or tip of each of the electrical conductors contact a corresponding electrically conductive pad on the circuit board.

Abstract: A pressure transducer assembly that includes a pressure-responsive diaphragm to which a sensing element is mounted and an electronic package that includes wire-bonding pads adapted be electrically connected to the sensing element by wire bonding equipment. The diaphragm and wire bonding pads are supported within the transducer so that they lie in proximity to each other and in non-intersecting planes.

Abstract: A pressure transducer assembly that includes a pressure-responsive diaphragm to which a sensing element is mounted and an electronic package that includes wire-bonding pads adapted be electrically connected to the sensing element by wire bonding equipment. The diaphragm and wire bonding pads are supported within the transducer so that they lie in proximity to each other and in non-intersecting planes.

Abstract: A pressure sensor assembly includes a base including a radially offset pressure port. An electronics package may be included within a housing generally alongside the offset pressure port. Accordingly, the pressure sensor assembly exhibits a substantially smaller diameter than previously achieved. Methods of fabrication are provided.