Patents by Inventor Neil Schlegel

Neil Schlegel has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Modular chassis providing scalable mechanical, electrical and environmental functionality for MicroTCA and Advanced TCA boards
    Patent number: 7821790
    Abstract: A modular chassis arrangement for electronic modules that is configurable into a mechanically and electrically interconnected structure capable of delivering scalable mechanical, electrical and environmental functionality for a multiplicity of electronic modules. In one embodiment, the electronic modules are compliant with AdvancedTCA or MicroTCA standards in a modular Pico-Shelf configuration that support stackable and/or back-to-back multiple unit chassis.
    Type: Grant
    Filed: March 26, 2007
    Date of Patent: October 26, 2010
    Assignee: SLT Logic, LLC
    Inventors: Viswa N. Sharma, William Chu, Allen D. James, Ming Siu Tseng, Neil Schlegel, David Lentz, Christopher D. Sonnek
  • Modular chassis providing scalable mechanical, electrical and environmental functionality for MicroTCA and advanced TCA boards
    Publication number: 20080037218
    Abstract: A modular chassis arrangement for electronic modules that is configurable into a mechanically and electrically interconnected structure capable of delivering scalable mechanical, electrical and environmental functionality for a multiplicity of electronic modules. In one embodiment, the electronic modules are compliant with AdvancedTCA or MicroTCA standards in a modular Pico-Shelf configuration that support stackable and/or back-to-back multiple unit chassis.
    Type: Application
    Filed: March 26, 2007
    Publication date: February 14, 2008
    Inventors: Viswa Sharma, William Chu, Allen James, Ming Tseng, Neil Schlegel, David Lentz, Christopher Sonnek