Abstract: An ablation method including a steps of ablating a region of a substrate (1) by a laser beam (3); and removing debris ablated from the region (1) by a flow of a fluid (7), namely, a gas or vapor, a liquid or a combination of the fluids. The flow of fluid (7) is directed to flow over the region so as to entrap debris and thereafter remove the entrapped debris from the region by directing the flow of fluid, with any entrapped debris, away from region along a predetermined path (6) avoiding subsequent deposition of entrapped debris on the substrate.

Abstract: A positioning device of the type described characterised by the incorporation of the puck into a closed circuit gas system from which the puck establishes the flow of fluid to provide the fluid cushion. Typically the positioning device is characterised by the provision of a heat transfer mechanism incorporated in the closed circuit to provide for heat exchange between the heat transfer mechanism and gas flowing around the system. The puck is coupled to a lens and a mask to provide for close following of a surface of a work-piece so as to keep a magnified image of the mask stable; the combination of puck, lens and mask forming a unit counterbalanced by a counterweight acting to provide for adjustment of focus of the laser beam relative to the surface of the work-piece.

Abstract: The invention firstly comprises a method of ablation processing including a step of ablating a region of a substrate (1) by way of a laser beam (3) characterized by a further step of removing debris ablated from the region (1) by way of a flow of a fluid (7), namely a gas or vapour, a liquid or a combination of these, wherein the flow of fluid (7) is directed to flow over the region so as to entrap debris and thereafter to remove the entrapped debris from the region by directing the flow of fluid with any entrapped debris away from region along a predetermined path (6) avoiding subsequent deposition of entrapped debris on the substrate.

Abstract: A method of laser micro-machining, by means of a laser, a work piece (31) of the type described comprising the steps of: locating the workpiece on a carrier forming a part of a transport system whereby the carrier can be displaced along a path (P) parallel to an X-axis of the workpiece, a Y-axis lying transverse the path, and a Z-axis lying transverse the path; focusing an image generated by means of an output beam from the laser at a working datum position (A) defined relative to the path which path is established by means of the transport system to traverse the first datum position; a plane defined by the X- and Y-Axis lying substantially perpendicular to the output beam; and displacing the workpiece along the path by way of the transport system so as to enable the work-piece to be subject to micro-machining by way of the laser characterized by the steps of: maintaining distance between the datum position and a current first surface position of the work-piece in the vicinity of the datum position; and varyi

Abstract: Laser scribing can be performed on a workpiece such as a substrate with layers formed thereon for use in a solar cell without need to move the workpiece during the scribing process. A series of lasers can be used to concurrently remove material from multiple positions on the workpiece. These laser outputs are directed to the workpiece using an optical system partially attached to a gantry. The gantry can be moved longitudinally and the portion of the optical system attached to the gantry can be moved laterally so that the combined outputs of all lasers can be directed to substantially any position on the workpiece without moving the workpiece.

Abstract: A method for forming a regularly repeating pattern on to a substrate comprising the steps of: applying a resist on a surface of a substrate to be processed; imprinting on the applied resist a pattern formed by exposing it to a beam of ultra violet (‘UV’) light, which has been caused to pass through a suitable mask delineating the pattern and then trough a focusing lens on to the resist, so as to cause chemical changes in the resist which makes it more or less soluble in a suitable developer solution; the imprinting step being carried out: in a repetitive series of discrete exposure steps using a mask held stationery with respect to the beam and the lens that represents only a small area of the total area of the substrate and using a single short pulse of UV radiation at each step to illuminate the mask, the radiation pulse having such an energy density at the substrate that it is below the threshold value for ablation of the resist; and the series of discrete exposure steps being repeated over the full area o

Abstract: A method of laser micro-machining, by means of a laser, a work piece (31) of the type described comprising the steps of: locating the workpiece on a carrier forming a part of a transport system whereby the carrier can be displaced along a path (P) parallel to an X-axis of the workpiece, a Y-axis lying transverse the path, and a Z-axis lying transverse the path; focusing an image generated by means of an output beam from the laser at a working datum position (A) defined relative to the path which path is established by means of the transport system to traverse the first datum position; a plane defined by the X- and Y-Axis lying substantially perpendicular to the output beam; and displacing the workpiece along the path by way of the transport system so as to enable the work-piece to be subject to micro-machining by way of the laser characterized by the steps of: maintaining distance between the datum position and a current first surface position of the work-piece in the vicinity of the datum position; and varyi

Abstract: A positioning device of the type described characterised by the incorporation of the puck into a closed circuit gas system from which the puck establishes the flow of fluid to provide the fluid cushion. Typically the positioning device is characterised by the provision of a heat transfer mechanism incorporated in the closed circuit to provide for heat exchange between the heat transfer mechanism and gas flowing around the system. The puck is coupled to a lens and a mask to provide for close following of a surface of a work-piece so as to keep a magnified image of the mask stable; the combination of puck, lens and mask forming a unit counterbalanced by a counterweight acting to provide for adjustment of focus of the laser beam relative to the surface of the work-piece.

Abstract: A method of laser micro-machining a work piece, with a laser, including the steps of: locating the workpiece on a carrier forming a part of a transport system, the carrier can be displaced along a path parallel to an X-axis of the workpiece, a Y-axis lying transverse the path, and a Z-axis lying transverse the path; focusing an image generated by an output beam from the laser at a working datum position defined relative to the path which path is established by the transport system to traverse the first datum position; a plane defined by the X- and Y-axis lying substantially perpendicular to the output beam; and displacing the workpiece along the path by way of the transport system so as to enable the work-piece to be subject to micro-machining by way of the laser.

Abstract: The invention firstly comprises a method of ablation processing including a step of ablating a region of a substrate (1) by way of a laser beam (3) characterised by a further step of removing debris ablated from the region (1) by way of a flow of a fluid (7), namely a gas or vapour, a liquid or a combination of these, wherein the flow of fluid (7) is directed to flow over the region so as to entrap debris and thereafter to remove the entrapped debris from the region by directing the flow of fluid with any entrapped debris away from region along a predetermined path (6) avoiding subsequent deposition of entrapped debris on the substrate.

Abstract: A method of laser micro-machining a work piece, with a laser, including the steps of: locating the workpiece on a carrier forming a part of a transport system, the carrier can be displaced along a path parallel to an X-axis of the workpiece, a Y-axis lying transverse the path, and a Z-axis lying transverse the path; focusing an image generated by an output beam from the laser at a working datum position defined relative to the path which path is established by the transport system to traverse the first datum position; a plane defined by the X- and Y-axis lying substantially perpendicular to the output beam; and displacing the workpiece along the path by way of the transport system so as to enable the work-piece to be subject to micro-machining by way of the laser.