Abstract: A process for preparing a dispersion comprising the stages: i) providing a dispersion comprising a particulate solid, a liquid medium and a dispersant having cross-linkable groups and a weight averaged molecular weight of from 1,000 to 70,000; and ii) cross-linking the dispersant in the presence of the particulate solid and the liquid medium thereby preparing a dispersion of an encapsulated particulate solid, wherein the cross-linking is performed such that 0.01 to 0.5 mmoles of cross-linkable groups in the dispersant are cross-linked per g of dispersant; said process also comprising at any stage: iii) adding a metal chelating agent to the dispersion; and after stage iii) the stage of: iv) removing at least some of the metal chelating agent from the dispersion.

Abstract: A process for preparing a dispersion comprising the stages: i) providing a dispersion comprising a particulate solid, a liquid medium and a dispersant having cross-linkable groups and a weight averaged molecular weight of from 1,000 to 70,000; and ii) cross-linking the dispersant in the presence of the particulate solid and the liquid medium thereby preparing a dispersion of an encapsulated particulate solid, wherein the cross-linking is performed such that 0.01 to 0.5 mmoles of cross-linkable groups in the dispersant are cross-linked per g of dispersant; said process also comprising at any stage: iii) adding a metal chelating agent to the dispersion; and after stage iii) the stage of: iv) removing at least some of the metal chelating agent from the dispersion.

Abstract: The present invention relates to liquid compositions, in particular solutions, of at least one organic semiconductor which emits light from the triplet state, in an organic solvent or solvent mixture, which are characterised in that the content of certain compounds is below a certain limit value, and to the use thereof for the production of layers of the organic semiconductors on substrates, in particular for the electronics industry.

Abstract: The invention relates to solutions of at least one organic semiconductor containing at least one high-molecular constituent, in a solvent mixture of at least three different organic solvents A, B and C. The invention is characterized in that the solvents A and B are good solvents for the organic semiconductor, the solvent C is a bad solvent for the organic semiconductor, and Sdp.(A)<Sdp.(C)<Sdp.(B) holds good for the boiling points (Sdp.) of the solvents. The invention also relates to the use of said solutions in printing methods for producing layers of the organic semiconductor on substrates, especially in the electronics industry.

Abstract: The invention relates to solutions of at least one organic semiconductor containing at least one high-molecular constituent, in a solvent mixture of at least three different organic solvents A, B and C. The invention is characterised in that the solvents A and B are good solvents for the organic semiconductor, the solvent C is a bad solvent for the organic semiconductor, and Sdp.(A)<Sdp.(C)<Sdp.(B) holds good for the boiling points (Sdp.) of the solvents. The invention also relates to the use of said solutions in printing methods for producing layers of the organic semiconductor on substrates, especially in the electronics industry.

Abstract: The present invention relates to solutions of organic semiconductors and their use in the production of electronic components.

Abstract: The present invention relates to solutions of organic semiconductors and their use in the production of electronic components.