Patents by Inventor Nelson H. Oliver
Nelson H. Oliver has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8354773Abstract: A backing block composite is provided. A transducer is manufactured to include the backing block of composite material. One constituent material provides a skeleton or matrix for enclosing volumes or pockets of another material. The materials are incompatible for bonding, so do not adhere to each other. For example, silicone microspheres are mixed with a nonsilicone resin, forming silicone pockets within the resin. Since the silicone does not adhere to the resin, the silicone may vibrate or otherwise move relative to the cured resin matrix, causing friction between the two materials. As acoustic energy propagates into the backing material, the composite structure of incompatible materials attenuates the acoustic energy as frictionally generated heat between the two material, or through other processes.Type: GrantFiled: August 22, 2003Date of Patent: January 15, 2013Assignee: Siemens Medical Solutions USA, Inc.Inventors: Nelson H. Oliver, Diana M. Tasker
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Patent number: 8014231Abstract: A capacitive membrane is used as a digital sensor. Membranes act as binary devices, such as being in a collapsed or non-collapsed state. By providing drum heads (membranes and associated gaps) with different response characteristics, the drum heads of an element digitally indicate the amplitude of the acoustic force by which of the drum heads are triggered or change states. The digital transducer may be used for different types of sensors, such as a CMUT, an air pressure, a temperature, a humidity, a chemical or biological stimulus or other sensor.Type: GrantFiled: September 25, 2008Date of Patent: September 6, 2011Assignee: Siemens Medical Solutions USA, Inc.Inventors: Nelson H. Oliver, Worth B. Walters
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Patent number: 7923893Abstract: A capacitive membrane ultrasound transducer is provided. Membranes or other microelectromechanical devices are provided in a 3-1 geometry, allowing application of an electric field substantially perpendicular to a range dimension. The membranes are on a plurality of different respective planes more parallel than perpendicular with each other, and the planes are more perpendicular than parallel with the faces of the elements or transducer.Type: GrantFiled: September 26, 2005Date of Patent: April 12, 2011Assignee: Siemens Medical Solutions USA, Inc.Inventors: Nelson H. Oliver, Sean T. Hansen
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Patent number: 7599254Abstract: Light exposure may reduce the static charge inside a capacitive membrane transducer. For example, ultraviolet light shines on or in a cell. The light increases the energy of the charge carrier and/or ionizes gas in the cavity, allowing reverse migration or dissipation of the static charge.Type: GrantFiled: December 20, 2005Date of Patent: October 6, 2009Assignee: Siemens Medical Solutions USA, Inc.Inventor: Nelson H. Oliver
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Patent number: 7589456Abstract: A capacitive membrane is used as a digital sensor. Membranes act as binary devices, such as being in a collapsed or non-collapsed state. By providing drum heads (membranes and associated gaps) with different response characteristics, the drum heads of an element digitally indicate the amplitude of the acoustic force by which of the drum heads are triggered or change states. The digital transducer may be used for different types of sensors, such as a CMUT, an air pressure, a temperature, a humidity, a chemical or biological stimulus or other sensor.Type: GrantFiled: June 14, 2005Date of Patent: September 15, 2009Assignee: Siemens Medical Solutions USA, Inc.Inventors: Nelson H. Oliver, Worth B. Walters
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Patent number: 7545079Abstract: A photoetchable glass ceramic is used to form a three dimensional structure for a transducer component. This photostructurable material allows generation of various shapes or structures. For example, a matching layer is formed, in part, using photoetchable glass ceramics with an anechoic-shaped gradient structure. The gradient structures are then filled with materials having desired impedance properties. By allowing generation of desired structures within the matching layer, a desired acoustic impedance property may be provided. As another example, a hollow column is photo etched and used for providing air backing in a backing layer. As yet another example, a transducer layer is formed within a framework of photostructurable material. A plurality of holes with associated shelves is provided for pick-and-place locating of transducer elements within an array. The photostructurable material assists in manufacturing.Type: GrantFiled: March 28, 2005Date of Patent: June 9, 2009Assignee: Siemens Medical Solutions USA, Inc.Inventor: Nelson H. Oliver
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Publication number: 20090020001Abstract: A capacitive membrane is used as a digital sensor. Membranes act as binary devices, such as being in a collapsed or non-collapsed state. By providing drum heads (membranes and associated gaps) with different response characteristics, the drum heads of an element digitally indicate the amplitude of the acoustic force by which of the drum heads are triggered or change states. The digital transducer may be used for different types of sensors, such as a CMUT, an air pressure, a temperature, a humidity, a chemical or biological stimulus or other sensor.Type: ApplicationFiled: September 25, 2008Publication date: January 22, 2009Inventors: NELSON H. OLIVER, WORTH B. WALTERS
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Publication number: 20080189933Abstract: A photoetchable glass ceramic is used to form a three dimensional structure for a transducer component. This photostructurable material allows generation of various shapes or structures. For example, a matching layer is formed, in part, using photoetchable glass ceramics with an anechoic-shaped gradient structure. The gradient structures are then filled with materials having desired impedance properties. By allowing generation of desired structures within the matching layer, a desired acoustic impedance property may be provided. As another example, a hollow column is photo etched and used for providing air backing in a backing layer. As yet another example, a transducer layer is formed within a framework of photostructurable material. A plurality of holes with associated shelves is provided for pick-and-place locating of transducer elements within an array. The photostructurable material assists in manufacturing.Type: ApplicationFiled: April 14, 2008Publication date: August 14, 2008Applicant: SIEMENS MEDICAL SOLUTIONS USA, INC.Inventor: Nelson H. Oliver
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Patent number: 7368852Abstract: Matching layers are provided, including: electrically conductive acoustic matching layers, methods for conducting electric current through matching layers, methods for manufacturing multi-dimensional arrays using conductive matching layers, and multi-dimensional arrays with electrically conducting matching layers. Matching layers with conductors aligned for providing electrical conduction through the thickness or range dimension of the matching layer are provided. For example, vias, aligned magnetic particles, or conductive films at least partially or entirely within the matching layer of each element allow electrical conduction from the transducer material to a ground foil or flex circuit. By using multiple electrical conductive matching layers, a gradation in acoustic impedance for better matching is provided while allowing dicing of the entire stack, including the matching layers and the electroceramic material, in one step.Type: GrantFiled: August 22, 2003Date of Patent: May 6, 2008Assignee: Siemens Medical Solutions USA, Inc.Inventors: Gregg W. Frey, Todor Sheljaskow, Walt T. Wilser, Worth B. Walters, Nelson H. Oliver
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Patent number: 7022081Abstract: Transducers and methods of manufacturing transducers with at least one of environmental and electromagnetic protection are provided. Diced ultrasonic transducer stacks are covered with a shield layer or film. The shield layer is bonded to the transducer stack without adhesive. For example, a heat sealable amorphous surface is used to bond the shield layer to the ultrasound stack. The shield layer forms an environmental and/or electromagnetic barrier. Since adhesive is not used for bonding the shield layer, the kerfs are uniformly air filled.Type: GrantFiled: August 20, 2003Date of Patent: April 4, 2006Assignee: Siemens Medical Solutions USA, Inc.Inventor: Nelson H. Oliver