Abstract: A 3D vapor chamber includes a lower body defining an evaporator region, a header positioned above the lower body, conduits extending between the lower body and the header, a condenser region, and a working fluid located within at least one of the lower body, the header, or the conduits. The conduits are configured to direct a flow of the working fluid to and from the lower body and the header. A portion of the working fluid is configured to be in vaporized form during use, and another portion of the working fluid is configured to be in liquid form during use. The conduits are arranged such that the vaporized working fluid and the liquid working fluid are configured to flow in a same direction in at least one of the conduits.

Abstract: A heat transfer system includes a housing, an annealed heat pipe coupled to the housing, and a heat source coupled to the housing. The heat pipe exerts a biasing force in a direction toward the heat source when the heat pipe is in thermal communication with the heat source.

Abstract: A heat transfer device includes a hollow metal body. The hollow body defines a wall having a thickness, an internal chamber defined at least in part by the wall, a vacuum defined in the internal chamber, a seam defined between two different portions of the wall and extending through the thickness of the wall, a brazing material applied to the seam to hermetically seal the internal chamber and maintain the vacuum in the internal chamber, an evaporation region in which heat is received in the hollow metal body, and a condenser region from which heat is discharged from the hollow metal body. The heat transfer device further includes a charge of ice within the internal chamber, the charge of ice sufficiently large to define, when in a thawed state, a working fluid drawing heat from the evaporator region and discharging heat from the condenser region in a working cycle of the heat transfer device.

Abstract: A thermal management system includes a heat transport component and a water-based azeotropic mixture disposed within the heat transport component to move heat from one portion of the heat transport component to another. The mixture includes at least 50% water.

Abstract: A heat pipe system for conducting thermal energy. The heat pipe system includes a sealed tube having along its length a reservoir region, an evaporator region, and a condenser region, the tube having a first end and a second end and an inside wall. The system also includes a wick disposed adjacent the inside wall of the tube, the wick including a first portion at the first end of the tube and a second portion adjacent the first portion, wherein the first portion of the wick is thicker than the second portion of the wick, and wherein the second portion of the wick does not extend to the second end of the tube. The system also includes a working fluid contained within the tube.

Abstract: A thermal management system includes a heat transport component and a water-based azeotropic mixture disposed within the heat transport component to move heat from one portion of the heat transport component to another. The mixture includes at least 50% water.

Abstract: A heat pipe system for conducting thermal energy. The heat pipe system includes a sealed tube having along its length a reservoir region, an evaporator region, and a condenser region, the tube having a first end and a second end and an inside wall. The system also includes a wick disposed adjacent the inside wall of the tube, the wick including a first portion at the first end of the tube and a second portion adjacent the first portion, wherein the first portion of the wick is thicker than the second portion of the wick, and wherein the second portion of the wick does not extend to the second end of the tube. The system also includes a working fluid contained within the tube.

Abstract: A heat pipe system for conducting thermal energy. The heat pipe system includes a sealed tube having along its length a reservoir region, an evaporator region, and a condenser region, the tube having a first end and a second end and an inside wall. The system also includes a wick disposed adjacent the inside wall of the tube, the wick including a first portion at the first end of the tube and a second portion adjacent the first portion, wherein the first portion of the wick is thicker than the second portion of the wick, and wherein the second portion of the wick does not extend to the second end of the tube. The system also includes a working fluid contained within the tube.

Abstract: A system for cooling a canister has first, second and third heat pipes. The first heat pipe has an evaporator and a condenser. The first heat pipe is mounted with its evaporator inside the canister and its condenser outside the canister. The second heat pipe has an evaporator conductively coupled to the condenser of the first heat pipe. The second heat pipe has a condenser. The third heat pipe has an evaporator conductively coupled to the condenser of the second heat pipe. The third heat pipe has a condenser with a plurality of fins on the condenser of the third heat pipe.

Abstract: A system for cooling a canister has first, second and third heat pipes. The first heat pipe has an evaporator and a condenser. The first heat pipe is mounted with its evaporator inside the canister and its condenser outside the canister. The second heat pipe has an evaporator conductively coupled to the condenser of the first heat pipe. The second heat pipe has a condenser. The third heat pipe has an evaporator conductively coupled to the condenser of the second heat pipe. The third heat pipe has a condenser with a plurality of fins on the condenser of the third heat pipe.

Abstract: An improved electronic chip package is disclosed, which may include an electrical insulator, top and bottom metallization layers associated with said insulator, an integrated circuit (IC) device, and a heat pipe placed between the electrical insulator and the IC device, and soldered to the IC device, wherein the wall of the heat pipe may be constructed so that thermal stresses in the IC device are reduced.

Abstract: A cooling system is provided for cooling a canister. A first heat pipe is mounted around the perimeter of the canister. The first heat pipe has a condenser. A second heat pipe has an evaporator conductively coupled to the condenser of the first heat pipe. The second heat pipe has a condenser. A heat sink is conductively coupled to the condenser of the second heat pipe.

Abstract: A system for cooling a canister has first, second and third heat pipes. The first heat pipe has an evaporator and a condenser. The first heat pipe is mounted with its evaporator inside the canister and its condenser outside the canister. The second heat pipe has an evaporator conductively coupled to the condenser of the first heat pipe. The second heat pipe has a condenser. The third heat pipe has an evaporator conductively coupled to the condenser of the second heat pipe. The third heat pipe has a condenser with a plurality of fins on the condenser of the third heat pipe.

Abstract: A cooling system is provided for cooling a canister. A first heat pipe is mounted around the perimeter of the canister. The first heat pipe has a condenser. A second heat pipe has an evaporator conductively coupled to the condenser of the first heat pipe. The second heat pipe has a condenser. A heat sink is conductively coupled to the condenser of the second heat pipe.

Abstract: An improved electronic chip package is disclosed, which may include an electrical insulator, top and bottom metallization layers associated with said insulator, an integrated circuit (IC) device, and a heat pipe placed between the electrical insulator and the IC device, and soldered to the IC device, wherein the wall of the heat pipe may be constructed so that thermal stresses in the IC device are reduced.

Abstract: The invention is a very flexible heat pipe which is constructed of multiple layers of material laminated into the final structure. The center of the symmetrical structure is a coarse screen which creates a vapor space. The layers on either side of the screen are copper felt pads, and the outer casing is two layers of metal foil and a layer of polypropylene. The heat pipe constructed in this manner is so a flexible that when one outside surface is covered with adhesive, the heat pipe can essentially be used as tape or a stick-on heat transfer surface which conforms to a body being cooled.

Abstract: The disclosure is for a capacitor cooled by a heat pipe. The capacitor casing is constructed with an open tube inserted through the casing wall and into which is inserted a simple cylindrical heat pipe. The heat pipe may terminate at the casing wall which then acts as a heat transfer surface, or a portion of the heat pipe which extends beyond the end of the capacitor can be attached to an external heat transfer device, such as a heat conductive mounting plate or a cooling fin assembly.

Abstract: The disclosure is for a capacitor cooled by a heat pipe. The capacitor casing is constructed with an open tube inserted through the casing wall and into which is inserted a simple cylindrical heat pipe. The heat pipe may terminate at the casing wall which then acts as a heat transfer surface, or a portion of the heat pipe which extends beyond the end of the capacitor can be attached to an external heat transfer device, such as a heat conductive mounting plate or a cooling fin assembly.

Abstract: The invention is an integrated circuit cooler in which a heat spreader is mounted atop a weight sensitive integrated circuit package, and at least one heat pipe is attached to the heat spreader and to a cooling fin assembly remote from the heat spreader. To accommodate to the tolerances, the potential tilt of the installed integrated circuit package, and the weight of the fins, the heat spreader is mounted on the integrated circuit package using springs on posts attached to the circuit mounting board, and the heat pipe has an annealed section of the casing located between the heat spreader and the fins to relieve the potential stress on the thermal connection or the integrated circuit package. Another feature of the assembly is that the fins are mounted on the heat pipe using only spring clamps formed into the fins.

Abstract: A heater which uses the electrolysis of a liquid to produce heat from electricity and transfers the heat from the electrolyte by means of a heat exchanger. One embodiment includes electrodes of nickel and platinum and an electrolyte of potassium carbonate with a heat exchanger immersed in and transferring heat from the electrolyte.