Abstract: A temperature characteristic is detected with medical diagnostic ultrasound. Microbubble contrast agents have a phase change near 37 degrees Celsius. The phase change alters the pressure required to destroy the contrast agent or cause absorption of the contrast agent. Since the contrast agents are sensitive to local temperature, ultrasound may identify locations of elevated temperature, such as associated with inflammation.

Abstract: Light exposure may reduce the static charge inside a capacitive membrane transducer. For example, ultraviolet light shines on or in a cell. The light increases the energy of the charge carrier and/or ionizes gas in the cavity, allowing reverse migration or dissipation of the static charge.

Abstract: A capacitive membrane ultrasound transducer is provided. Membranes or other microelectromechanical devices are provided in a 3-1 geometry, allowing application of an electric field substantially perpendicular to a range dimension. The membranes are on a plurality of different respective planes more parallel than perpendicular with each other, and the planes are more perpendicular than parallel with the faces of the elements or transducer.

Abstract: One or more conductors within a transducer or element are anodized and/or electrochemically etched for electrical isolation. Anodization allows for simultaneous creation of many insulation layers on a selective basis. Electrochemical etching allows for simultaneous creation of many electrode gaps on a selective basis, which can be later filled with insulating material such as epoxy. Conductors may then be plated over the anodized material for interconnecting other conductors or electrodes together.

Abstract: A capacitive membrane is used as a digital sensor. Membranes act as binary devices, such as being in a collapsed or non-collapsed state. By providing drum heads (membranes and associated gaps) with different response characteristics, the drum heads of an element digitally indicate the amplitude of the acoustic force by which of the drum heads are triggered or change states. The digital transducer may be used for different types of sensors, such as a CMUT, an air pressure, a temperature, a humidity, a chemical or biological stimulus or other sensor.

Abstract: A photoetchable glass ceramic is used to form a three dimensional structure for a transducer component. This photostructurable material allows generation of various shapes or structures. For example, a matching layer is formed, in part, using photoetchable glass ceramics with an anechoic-shaped gradient structure. The gradient structures are then filled with materials having desired impedance properties. By allowing generation of desired structures within the matching layer, a desired acoustic impedance property may be provided. As another example, a hollow column is photo etched and used for providing air backing in a backing layer. As yet another example, a transducer layer is formed within a framework of photostructurable material. A plurality of holes with associated shelves is provided for pick-and-place locating of transducer elements within an array. The photostructurable material assists in manufacturing.

Abstract: Castable matching layers having a desired acoustic impedance are formed with hafnium compounds. For example, a low sound velocity matching layer with an acoustic impedance of about 5 MRayl is formed by mixing hafnia (HfO2) powder with a casting resin. The matching layer is used for low frequency operation, such as operation at four or fewer megahertz, while providing a matching layer with a thickness of 150 microns or less for easy dicing. Since a maximum dicing blade exposure to blade thickness ratio is about 30 to 1, higher velocity matching layers may lead to dicing depths requiring thicker dicing blades. By using hafnium compounds, a lesser thickness may be provided, avoiding a reduction in sensitivity and mechanical stability due to wider kerfs resulting from thicker dicing blades. Other thicknesses, frequencies, acoustic impedances or other characteristics may be provided.

Abstract: Electrical connection is provided in a transducer stack through a backing block. A flexible circuit is sandwiched between pieces of acoustic attenuating material. For example, 2 to 200 or more flexible circuits are stacked in alternating layers with pieces of acoustically attenuating material. The alternating layers are then connected together to form a backing block with Z-axis electrical connection. The top surface of the connected backing block includes a plurality of exposed electrical traces from the flex circuit. Since flex circuits are used, the electrical traces are precisely aligned along one dimension. Since pre-formed acoustic attenuating material pieces are used, precise alignment is provided along a second or orthogonal dimension. The substrate holding the electrical traces in the flexible circuits provides more stability and allows for easier connection to circuit boards as compared to individual strips of metal.

Abstract: Detecting damage risk or preventing damage in handheld electronics devices uses an integrated motion sensor. To detect damage risk, a shock sensor is positioned in a handheld electronics device, such as on or within a housing of the electronics device. Through a display, communication or other mechanism, shock information is provided to assess a type or amount of damage to a product. For preventing damage in a handheld electronics device, a drop is detected within the handheld electronics device. In response to the detected drop, a component within the handheld electronics device is positioned. For example, the component is moved from a position of risk during a shock to a position of lesser risk during a shock. The handheld electronics device is free of mechanical connection to other devices, such as a cell phone, a personal digital assistant, a CD player, a tape player, a radio or other device of handheld size that is carryable or worn by a person.

Abstract: Transducers and methods of manufacturing transducers with at least one of environmental and electromagnetic protection are provided. Diced ultrasonic transducer stacks are covered with a shield layer or film. The shield layer is bonded to the transducer stack without adhesive. For example, a heat sealable amorphous surface is used to bond the shield layer to the ultrasound stack. The shield layer forms an environmental and/or electromagnetic barrier. Since adhesive is not used for bonding the shield layer, the kerfs are uniformly air filled.

Abstract: A backing block composite is provided. A transducer is manufactured to include the backing block of composite material. One constituent material provides a skeleton or matrix for enclosing volumes or pockets of another material. The materials are incompatible for bonding, so do not adhere to each other. For example, silicone microspheres are mixed with a nonsilicone resin, forming silicone pockets within the resin. Since the silicone does not adhere to the resin, the silicone may vibrate or otherwise move relative to the cured resin matrix, causing friction between the two materials. As acoustic energy propagates into the backing material, the composite structure of incompatible materials attenuates the acoustic energy as frictionally generated heat between the two material, or through other processes.

Abstract: Matching layers are provided, including: electrically conductive acoustic matching layers, methods for conducting electric current through matching layers, methods for manufacturing multi-dimensional arrays using conductive matching layers, and multi-dimensional arrays with electrically conducting matching layers. Matching layers with conductors aligned for providing electrical conduction through the thickness or range dimension of the matching layer are provided. For example, vias, aligned magnetic particles, or conductive films at least partially or entirely within the matching layer of each element allow electrical conduction from the transducer material to a ground foil or flex circuit. By using multiple electrical conductive matching layers, a gradation in acoustic impedance for better matching is provided while allowing dicing of the entire stack, including the matching layers and the electroceramic material, in one step.