Abstract: A hermetically sealed electronic package may include a thermal panel having a panel interior surface and a panel exterior surface with electronic device(s) in thermal communication with the panel interior surface. An enclosure, isolating environmental communication from internal electronic devices and modules, may be coupled to the thermal panel, and the enclosure may have an enclosure interior surface and an enclosure exterior surface. A plurality of electrical feedthroughs may be coupled to the package enclosure for signal and data transmission, and the conducting pin(s) in every electrical feedthrough may be bonded by a hydrophobic sealing material for harsh environmental electrical signal, data and power transmission. The ratio of sealing length over sealing bead diameter in the electrical feedthrough subassembly may have a preferred value from 2 to 3; and the ratio of the sealing bead diameter over pin diameter in the electrical feedthrough subassembly may have a preferred value from 1.5 to 2.

Abstract: A hermetically sealed electronic package may include a thermal panel having a panel interior surface and a panel exterior surface with electronic device(s) in thermal communication with the panel interior surface. An enclosure, isolating environmental communication from internal electronic devices and modules, may be coupled to the thermal panel, and the enclosure may have an enclosure interior surface and an enclosure exterior surface. A plurality of electrical feedthroughs may be coupled to the package enclosure for signal and data transmission, and the conducting pin(s) in every electrical feedthrough may be bonded by a hydrophobic sealing material for harsh environmental electrical signal, data and power transmission. The ratio of sealing length over sealing bead diameter in the electrical feedthrough subassembly may have a preferred value from 2 to 3; and the ratio of the sealing bead diameter over pin diameter in the electrical feedthrough subassembly may have a preferred value from 1.5 to 2.

Abstract: A hermetically sealed electronic package may include a thermal panel having a panel interior surface and a panel exterior surface with electronic device(s) in thermal communication with the panel interior surface. An enclosure, isolating environmental communication from internal electronic devices and modules, may be coupled to the thermal panel, and the enclosure may have an enclosure interior surface and an enclosure exterior surface. A plurality of electrical feedthroughs may be coupled to the package enclosure for signal and data transmission, and the conducting pin(s) in every electrical feedthrough may be bonded by a hydrophobic sealing material for harsh environmental electrical signal, data and power transmission. The ratio of sealing length over sealing bead diameter in the electrical feedthrough subassembly may have a preferred value from 2 to 3; and the ratio of the sealing bead diameter over pin diameter in the electrical feedthrough subassembly may have a preferred value from 1.5 to 2.

Abstract: A hermetically sealed electronic package may include a thermal panel having a panel interior surface and a panel exterior surface with electronic device(s) in thermal communication with the panel interior surface. An enclosure, isolating environmental communication from internal electronic devices and modules, may be coupled to the thermal panel, and the enclosure may have an enclosure interior surface and an enclosure exterior surface. A plurality of electrical feedthroughs may be coupled to the package enclosure for signal and data transmission, and the conducting pin(s) in every electrical feedthrough may be bonded by a hydrophobic sealing material for harsh environmental electrical signal, data and power transmission. The ratio of sealing length over sealing bead diameter in the electrical feedthrough subassembly may have a preferred value from 2 to 3; and the ratio of the sealing bead diameter over pin diameter in the electrical feedthrough subassembly may have a preferred value from 1.5 to 2.

Abstract: A hydrophobic dielectric sealing material is provided that is especially suitable for use in extreme environments such as for enabling downhole electrical feedthrough integrated logging tools reliable operation, especially, in a water or water-mud filled wellbore as first scenario or in moisture-rich oil-mud filled wellbores. In some embodiments, a hydrophobic dielectric sealing material may include: H3BO3 10-60 mol %; Bi2O3 10-50 mol %; MO 10-50 mol %; SiO2 0-15 mol %; and optionally one or more rare earth oxides 0-5 mol %. A method for making hydrophobic sealing material includes selecting water insoluble raw materials, form tetragonal phase dominated phase, and enlarge band-gap with wide-band-gap material. The morphology of the sealing material is preferably a tetrahedral phase dominated covalent bond network for obtaining high electrical insulation resistance, dielectric strength and hydrophobicity, and high mechanical strength in against downhole 30,000 PSI/300° C. water-based hostile environments.

Abstract: A method for making a downhole electrical feedthrough package where the feedthrough package may include a metal shell forming a shell conduit. A metal web may be coupled to the metal shell, and the metal web may form a web conduit. A conducting pin may extend through the shell conduit and web conduit. A dielectric seal may electrically isolate the conducting pin from the metal web. The dielectric seal may be formed by a bismuth glass based dielectric sealing material system having at least two of the four components selected from Bi2O3, B2O3, MO, and optionally REO forming a bismuth glass system. MO may be selected from ZnO, BaO, TiO2, and Fe2O3, and their glass making pre-cursors. REO may be selected from CeO2, Y2O3, Sc2O3, Nd2O3, Pr2O3, and lanthanum series oxides. One or more isolators may be disposed within the shell conduit proximate to the dielectric seal and surrounding a portion of the conducting pin.

Abstract: A method for making a downhole electrical feedthrough package where the feedthrough package may include a metal shell forming a shell conduit. A metal web may be coupled to the metal shell, and the metal web may form a web conduit. A conducting pin may extend through the shell conduit and web conduit. A dielectric seal may electrically isolate the conducting pin from the metal web. The dielectric seal may be formed by a bismuth glass based dielectric sealing material system having at least two of the four components selected from Bi2O3, B2O3, MO, and optionally REO forming a bismuth glass system. MO may be selected from ZnO, BaO, TiO2, and Fe2O3, and their glass making pre-cursors. REO may be selected from CeO2, Y2O3, Sc2O3, Nd2O3, Pr2O3, and lanthanum series oxides. One or more isolators may be disposed within the shell conduit proximate to the dielectric seal and surrounding a portion of the conducting pin.

Abstract: A downhole electrical feedthrough package and method for making the same. The feedthrough package may include a metal shell forming a shell conduit. A metal web may be coupled to the metal shell, and the metal web may form a web conduit. A conducting pin may extend through the shell conduit and web conduit. A dielectric seal may electrically isolate the conducting pin from the metal web. The dielectric seal may be formed by a bismuth glass based dielectric sealing material system having at least two of the four components selected from Bi2O3, B2O3, MO, and optionally REO forming a bismuth glass system. MO may be selected from ZnO, BaO, TiO2, and Fe2O3, and their glass making pre-cursors. REO may be selected from CeO2, Y2O3, Sc2O3, Nd2O3, Pr2O3, and lanthanum series oxides. One or more isolators may be disposed within the shell conduit proximate to the dielectric seal and surrounding a portion of the conducting pin.

Abstract: Methods for use in the manufacture or assembly of an electrical feedthrough to provide a solution to the technical and operational challenges that may arise from use of a high-CTE metal/low-CTE sealing material based assembly or package. In some embodiments, the inventive method includes a thermal tempering and thermal quenching process that is used to create an interfacial layer of the sealing material in which there exists a CTE gradient from sealing material to the metal shell and pin(s). This enables the production of an electrical feedthrough assembly that can tolerate high-CTE mismatch induced mechanical stress over a wide operating temperature range.

Abstract: A downhole electrical feedthrough package and method for making the same. The feedthrough package may include a metal shell forming a shell conduit. A metal web may be coupled to the metal shell, and the metal web may form a web conduit. A conducting pin may extend through the shell conduit and web conduit. A dielectric seal may electrically isolate the conducting pin from the metal web. The dielectric seal may be formed by a bismuth glass based dielectric sealing material system having at least two of the four components selected from Bi2O3, B2O3, MO, and optionally REO forming a bismuth glass system. MO may be selected from ZnO, BaO, TiO2, and Fe2O3, and their glass making pre-cursors. REO may be selected from CeO2, Y2O3, Sc2O3, Nd2O3, Pr2O3, and lanthanum series oxides. One or more isolators may be disposed within the shell conduit proximate to the dielectric seal and surrounding a portion of the conducting pin.

Abstract: An integrated downhole electrical feedthrough package may include a metal shell having a metal web conduit disposed within the metal shell. A sealing channel may extend through the metal web conduit. One or more conducting pins may be disposed in the sealing channels. A dielectric seal may also be disposed in the metal web conduit, and the dielectric seal may electrically isolate the one or more conducting pins from the metal web conduit and metal shell. One or more isolators may also be disposed within the metal conduit and each isolator may surround a portion of each conducting pin disposed in the metal conduit. Each isolator may have a high coefficient of thermal expansion material, and a nonpolar surface which may be positioned proximate to a dielectric seal.