Abstract: A polisher head backing film that resists slipping relative to a backing plate. In one embodiment, a polisher head backing film/backing plate assembly is provided. The backing film/backing plate assembly includes a backing film with a hole pattern as well as holding pins that protrudes from one of the film's surfaces. The backing film/backing plate assembly also includes a backing plate that has a corresponding hole pattern and receiving holes such that the hole patterns on the backing film and backing plate can be aligned. The receiving holes can receive the holding pins of the backing film such that when the hole patterns are aligned, the holding pins and the receiving holes are also aligned. The holding pins can thus be inserted into the receiving holes upon alignment such that the backing film is prevented from moving relative to the backing plate once the holding pins are properly inserted.

Abstract: A method of conditioning a polish pad at the point of polish and for dispensing slurry at the point of polish. In one embodiment, the method comprises several steps. In the first step, polishing slurry is received at a CMP machine. Next, a polish pad is rotated. Then, the polishing slurry is dispensed onto a portion of said polish pad located proximately around a location designated for holding a wafer.