Patents by Inventor Nena M. McCallum

Nena M. McCallum has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Process for electroplating electroactive polymers and articles derived therefrom
    Patent number: 5032467
    Abstract: The invention consists of a process for electroplating electroactive polymer substrates at potentials sufficient to cause reduction of the substrates. The inventive process can be used to make polymer-metal composites having one or more metal films. More specifically, it can be used to electroplate polyimide substrates with gold, or to electroplate gold over a copper plated polyimide substrate. These inventive composites exhibit improved polymer-metal adhesion when they are exposed to elevated temperatures and humidities, i.e., 85.degree. C. and 85% R.H.
    Type: Grant
    Filed: September 22, 1989
    Date of Patent: July 16, 1991
    Assignee: Minnesota Mining and Manufacturing Company
    Inventors: Larry J. Krause, Nena M. McCallum
  • Process for pulse electroplating electroactive polymers and articles derived therefrom
    Patent number: 5015538
    Abstract: The invention consists of a process for pulse electroplating electroactive polymer substrates at potentials sufficient to cause reduction of the substrates. The inventive process can be used to make polymer-metal composites having one or more metal films. More specifically, it can be used to electroplate polyimide substrates with gold, or to electroplate gold over a copper plated polyimide substrate. These inventive composites exhibit improved polymer-metal adhesion when they are exposed to elevated temperatures and humidities, i.e., 85.degree. C. and 85% R.H.
    Type: Grant
    Filed: September 22, 1989
    Date of Patent: May 14, 1991
    Assignee: Minnesota Mining and Manufacturing Company
    Inventors: Larry J. Krause, Nena M. McCallum