Patents by Inventor Neng-Bin Li

Neng-Bin Li has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7286363
    Abstract: A heat dissipation assembly includes a heat sink, a retention module and a clip for securing the heat sink to the retention module. The heat sink includes a base for contacting with a heat generating device. The retention module includes a bottom wall and a first sidewall defining a slot therein and extending from the bottom wall. The clip includes a connecting portion pivotably connected to the retention module. The heat sink rests on the bottom wall of the retention module with an end thereof fitting in the slot, and an opposite end thereof being pressed by the clip. The clip can be in a released position that the clip is pivotable, so that the heat sink is removable from the retention module, and a locked position that the clip presses the heat sink. Thus, the heat sink can be secured to the heat generating device expediently.
    Type: Grant
    Filed: June 28, 2005
    Date of Patent: October 23, 2007
    Assignees: Fu Zhun Precision Industry (Shenzhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Hsieh-Kun Lee, Wan-Lin Xia, Bao-Chun Chen, Neng-Bin Li
  • Patent number: 7190588
    Abstract: A heat-dissipating fin assembly (1) includes a plurality of individual fin plates (12) arranged side by side. Each fin plate includes a main body (14). First and second flanges (16, 18) extend perpendicularly from opposite edges of the main body of each fin plate. A pair of spaced first bridge-shaped tabs (20) extends perpendicularly from the first flange toward the second flange. A pair of spaced second bridge-shaped tabs (24) extends perpendicularly from the second flange toward the first flange. Projections (28) are stamped from the main body opposing to the first and second bridge-shaped tabs. The tabs of each fin plate are interlocked with the projections of an adjacent fin plate. In this manner, all the fin plates are assembled together. The heat-dissipating fin assembly is thus formed.
    Type: Grant
    Filed: May 23, 2005
    Date of Patent: March 13, 2007
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Hsieh-Kun Lee, Wan-Lin Xia, Bao-Chun Chen, Neng-Bin Li
  • Publication number: 20060018097
    Abstract: A heat dissipation assembly includes a heat sink, a retention module and a clip for securing the heat sink to the retention module. The heat sink includes a base for contacting with a heat generating device. The retention module includes a bottom wall and a first sidewall defining a slot therein and extending from the bottom wall. The clip includes a connecting portion pivotably connected to the retention module. The heat sink rests on the bottom wall of the retention module with an end thereof fitting in the slot, and an opposite end thereof being pressed by the clip. The clip can be in a released position that the clip is pivotable, so that the heat sink is removable from the retention module, and a locked position that the clip presses the heat sink. Thus, the heat sink can be secured to the heat generating device expediently.
    Type: Application
    Filed: June 28, 2005
    Publication date: January 26, 2006
    Applicant: Foxconn Technology Co., Ltd.
    Inventors: Hsieh-Kun Lee, Wan-Lin Xia, Bao-Chun Chen, Neng-Bin Li
  • Publication number: 20060012961
    Abstract: A heat-dissipating fin assembly (1) includes a plurality of individual fin plates (12) arranged side by side. Each fin plate includes a main body (14). First and second flanges (16, 18) extend perpendicularly from opposite edges of the main body of each fin plate. A pair of spaced first bridge-shaped tabs (20) extends perpendicularly from the first flange toward the second flange. A pair of spaced second bridge-shaped tabs (24) extends perpendicularly from the second flange toward the first flange. Projections (28) are stamped from the main body opposing to the first and second bridge-shaped tabs. The tabs of each fin plate are interlocked with the projections of an adjacent fin plate. In this manner, all the fin plates are assembled together. The heat-dissipating fin assembly is thus formed.
    Type: Application
    Filed: May 23, 2005
    Publication date: January 19, 2006
    Applicant: Foxconn Technology Co., Ltd.
    Inventors: Hsieh-Kun Lee, Wan-Lin Xia, Bao-Chun Chen, Neng-Bin Li