Patents by Inventor Neng Dai

Neng Dai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9078312
    Abstract: A multichip package structure includes a substrate unit, a light-emitting unit, a control module, a frame unit and a package unit. The substrate unit includes a first chip-placing region and a second chip-placing region. The light-emitting unit includes a plurality of light-emitting chips electrically connected to the first chip-placing region. The control module includes at least one current-limiting unit and the rectifier unit electrically connected to the second chip-placing region and the light-emitting unit. The frame unit includes a first annular colloid frame surrounding the light-emitting chips and a second annular colloid frame surrounding the current-limiting unit and the rectifier unit. The package unit includes a first package colloid body surrounded by the first annular colloid frame to cover the light-emitting chips and a second package colloid body surrounded by the second annular colloid frame to cover the current-limiting unit and the rectifier unit.
    Type: Grant
    Filed: December 9, 2010
    Date of Patent: July 7, 2015
    Assignee: PARAGON SEMICONDUCTOR LIGHTING TECHNOLOGY CO., LTD.
    Inventors: Shih-Neng Dai, Chia-Tin Chung
  • Patent number: 8743881
    Abstract: Link data transmission to a plurality of nodes includes: receiving data to be transmitted at a current node; obtaining, using one or more computer processors, first registration information by a plurality of child nodes of the current node; selecting, based on the first registration information, a first child node that is one of the plurality of child nodes to register with the current node; sending the data to be transmitted to the first child node; obtaining second registration information by a plurality of sibling nodes of the current node; selecting, based on the second registration information, a first sibling node that is one of the plurality of sibling nodes to register with the parent node; and sending the data to be transmitted to the first sibling node.
    Type: Grant
    Filed: January 14, 2013
    Date of Patent: June 3, 2014
    Assignee: Alibaba Group Holding Limited
    Inventors: Neng Dai, Zhen Li
  • Patent number: 8510099
    Abstract: The present disclosure discloses a method and apparatus of selecting a word sequence for a text written in a language without word boundary in order to solve the problem of having excessively large computation load when selecting an optimal word sequence in existing technologies. The disclosed method includes: segmenting a segment of the text to obtain different word sequences; determining a common word boundary for the word sequences; and performing optimal word sequence selection for portions of the word sequences prior to the common word boundary. Because optimal word sequence selection is performed for portions of word sequences prior to a common word boundary, shorter independent units can be obtained, thus reducing computation load of word segmentation.
    Type: Grant
    Filed: December 4, 2009
    Date of Patent: August 13, 2013
    Assignee: Alibaba Group Holding Limited
    Inventor: Neng Dai
  • Patent number: 8421373
    Abstract: A light-mixing multichip package structure includes a substrate unit, a light-emitting unit, a frame unit, and a package unit. The light-emitting unit includes at least one first light-emitting module with red light-emitting chips and at least one second light-emitting module with blue light-emitting chips. The frame unit includes at least one first continuous colloid frame and at least one second continuous colloid frame respectively surrounding the first light-emitting module and the second light-emitting module. The package unit includes a transparent colloid body and a phosphor colloid body respectively covering the first light-emitting module and the second light-emitting module. Hence, when the red light source generated by matching the red light-emitting chips and the transparent colloid body and the white light source generated by matching the blue light-emitting chips and the phosphor colloid body are mixed with each other, the CRI of the light-mixing multichip package structure can be increased.
    Type: Grant
    Filed: March 22, 2011
    Date of Patent: April 16, 2013
    Assignee: Paragon Semiconductor Lighting Technology Co., Ltd.
    Inventors: Chia-Tin Chung, Shih-Neng Dai, Chao-Chin Wu
  • Patent number: 8405118
    Abstract: A multichip package structure includes a substrate unit, a light-emitting unit, a current-limiting unit, a frame unit and a package unit. The substrate unit includes a first chip-placing region and a second chip-placing region. The light-emitting unit includes a plurality of light-emitting chips electrically connected to the first chip-placing region. The current-limiting unit includes at least one current-limiting chip electrically connected to the second chip-placing region and the light-emitting unit. The frame unit includes a first annular colloid frame surrounding the light-emitting chips and a second annular colloid frame surrounding the current-limiting chip. The package unit includes a first package colloid body surrounded by the first annular colloid frame to cover the light-emitting chips and a second package colloid body surrounded by the second annular colloid frame to cover the current-limiting chip.
    Type: Grant
    Filed: December 27, 2010
    Date of Patent: March 26, 2013
    Assignee: Paragon Semiconductor Lighting Technology Co., Ltd.
    Inventors: Chia-Tin Chung, Shih-Neng Dai
  • Patent number: 8379645
    Abstract: Link data transmission to a plurality of nodes includes: establishing a tree connection among the plurality of nodes; receiving data to be transmitted at a current node; in the event that the current node receiving the data to be transmitted has at least one child node; sending by the current node the data to be transmitted to one of the at least one child node, and in the event that the current node receiving the data to be transmitted has at least one sibling node that has not obtained the data to be transmitted, sending by the current node the data to be transmitted to one of the at least one sibling node.
    Type: Grant
    Filed: November 23, 2009
    Date of Patent: February 19, 2013
    Assignee: Alibaba Group Holding Limited
    Inventors: Neng Dai, Zhen Li
  • Publication number: 20120187865
    Abstract: A light-mixing multichip package structure includes a substrate unit, a light-emitting unit, a frame unit, and a package unit. The light-emitting unit includes at least one first light-emitting module with red light-emitting chips and at least one second light-emitting module with blue light-emitting chips. The frame unit includes at least one first continuous colloid frame and at least one second continuous colloid frame respectively surrounding the first light-emitting module and the second light-emitting module. The package unit includes a transparent colloid body and a phosphor colloid body respectively covering the first light-emitting module and the second light-emitting module. Hence, when the red light source generated by matching the red light-emitting chips and the transparent colloid body and the white light source generated by matching the blue light-emitting chips and the phosphor colloid body are mixed with each other, the CRI of the light-mixing multichip package structure can be increased.
    Type: Application
    Filed: March 22, 2011
    Publication date: July 26, 2012
    Applicant: PARAGON SEMICONDUCTOR LIGHTING TECHNOLOGY CO.,LTD.
    Inventors: CHIA-TIN CHUNG, Shih-Neng Dai, Chao-Chin Wu
  • Publication number: 20120097997
    Abstract: A multichip package structure includes a substrate unit, a light-emitting unit, a current-limiting unit, a frame unit and a package unit. The substrate unit includes a first chip-placing region and a second chip-placing region. The light-emitting unit includes a plurality of light-emitting chips electrically connected to the first chip-placing region. The current-limiting unit includes at least one current-limiting chip electrically connected to the second chip-placing region and the light-emitting unit. The frame unit includes a first annular colloid frame surrounding the light-emitting chips and a second annular colloid frame surrounding the current-limiting chip. The package unit includes a first package colloid body surrounded by the first annular colloid frame to cover the light-emitting chips and a second package colloid body surrounded by the second annular colloid frame to cover the current-limiting chip.
    Type: Application
    Filed: December 27, 2010
    Publication date: April 26, 2012
    Inventors: Chia-Tin CHUNG, Shih-Neng Dai
  • Publication number: 20120098458
    Abstract: A multichip package structure includes a substrate unit, a light-emitting unit, a control module, a frame unit and a package unit. The substrate unit includes a first chip-placing region and a second chip-placing region. The light-emitting unit includes a plurality of light-emitting chips electrically connected to the first chip-placing region. The control module includes at least one current-limiting unit and the rectifier unit electrically connected to the second chip-placing region and the light-emitting unit. The frame unit includes a first annular colloid frame surrounding the light-emitting chips and a second annular colloid frame surrounding the current-limiting unit and the rectifier unit. The package unit includes a first package colloid body surrounded by the first annular colloid frame to cover the light-emitting chips and a second package colloid body surrounded by the second annular colloid frame to cover the current-limiting unit and the rectifier unit.
    Type: Application
    Filed: December 9, 2010
    Publication date: April 26, 2012
    Inventors: Shih-Neng DAI, Chia-Tin CHUNG
  • Publication number: 20110252010
    Abstract: The present disclosure discloses a method and apparatus of selecting a word sequence for a text written in a language without word boundary in order to solve the problem of having excessively large computation load when selecting an optimal word sequence in existing technologies. The disclosed method includes: segmenting a segment of the text to obtain different word sequences; determining a common word boundary for the word sequences; and performing optimal word sequence selection for portions of the word sequences prior to the common word boundary. Because optimal word sequence selection is performed for portions of word sequences prior to a common word boundary, shorter independent units can be obtained, thus reducing computation load of word segmentation.
    Type: Application
    Filed: December 4, 2009
    Publication date: October 13, 2011
    Applicant: ALIBABA GROUP HOLDING LIMITED
    Inventor: Neng Dai
  • Publication number: 20100142547
    Abstract: Link data transmission to a plurality of nodes includes: establishing a tree connection among the plurality of nodes; receiving data to be transmitted at a current node; in the event that the current node receiving the data to be transmitted has at least one child node; sending by the current node the data to be transmitted to one of the at least one child node, and in the event that the current node receiving the data to be transmitted has at least one sibling node that has not obtained the data to be transmitted, sending by the current node the data to be transmitted to one of the at least one sibling node.
    Type: Application
    Filed: November 23, 2009
    Publication date: June 10, 2010
    Inventors: Neng Dai, Zhen Li