Patents by Inventor Neng Dai
Neng Dai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9078312Abstract: A multichip package structure includes a substrate unit, a light-emitting unit, a control module, a frame unit and a package unit. The substrate unit includes a first chip-placing region and a second chip-placing region. The light-emitting unit includes a plurality of light-emitting chips electrically connected to the first chip-placing region. The control module includes at least one current-limiting unit and the rectifier unit electrically connected to the second chip-placing region and the light-emitting unit. The frame unit includes a first annular colloid frame surrounding the light-emitting chips and a second annular colloid frame surrounding the current-limiting unit and the rectifier unit. The package unit includes a first package colloid body surrounded by the first annular colloid frame to cover the light-emitting chips and a second package colloid body surrounded by the second annular colloid frame to cover the current-limiting unit and the rectifier unit.Type: GrantFiled: December 9, 2010Date of Patent: July 7, 2015Assignee: PARAGON SEMICONDUCTOR LIGHTING TECHNOLOGY CO., LTD.Inventors: Shih-Neng Dai, Chia-Tin Chung
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Patent number: 8743881Abstract: Link data transmission to a plurality of nodes includes: receiving data to be transmitted at a current node; obtaining, using one or more computer processors, first registration information by a plurality of child nodes of the current node; selecting, based on the first registration information, a first child node that is one of the plurality of child nodes to register with the current node; sending the data to be transmitted to the first child node; obtaining second registration information by a plurality of sibling nodes of the current node; selecting, based on the second registration information, a first sibling node that is one of the plurality of sibling nodes to register with the parent node; and sending the data to be transmitted to the first sibling node.Type: GrantFiled: January 14, 2013Date of Patent: June 3, 2014Assignee: Alibaba Group Holding LimitedInventors: Neng Dai, Zhen Li
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Patent number: 8510099Abstract: The present disclosure discloses a method and apparatus of selecting a word sequence for a text written in a language without word boundary in order to solve the problem of having excessively large computation load when selecting an optimal word sequence in existing technologies. The disclosed method includes: segmenting a segment of the text to obtain different word sequences; determining a common word boundary for the word sequences; and performing optimal word sequence selection for portions of the word sequences prior to the common word boundary. Because optimal word sequence selection is performed for portions of word sequences prior to a common word boundary, shorter independent units can be obtained, thus reducing computation load of word segmentation.Type: GrantFiled: December 4, 2009Date of Patent: August 13, 2013Assignee: Alibaba Group Holding LimitedInventor: Neng Dai
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Patent number: 8421373Abstract: A light-mixing multichip package structure includes a substrate unit, a light-emitting unit, a frame unit, and a package unit. The light-emitting unit includes at least one first light-emitting module with red light-emitting chips and at least one second light-emitting module with blue light-emitting chips. The frame unit includes at least one first continuous colloid frame and at least one second continuous colloid frame respectively surrounding the first light-emitting module and the second light-emitting module. The package unit includes a transparent colloid body and a phosphor colloid body respectively covering the first light-emitting module and the second light-emitting module. Hence, when the red light source generated by matching the red light-emitting chips and the transparent colloid body and the white light source generated by matching the blue light-emitting chips and the phosphor colloid body are mixed with each other, the CRI of the light-mixing multichip package structure can be increased.Type: GrantFiled: March 22, 2011Date of Patent: April 16, 2013Assignee: Paragon Semiconductor Lighting Technology Co., Ltd.Inventors: Chia-Tin Chung, Shih-Neng Dai, Chao-Chin Wu
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Patent number: 8405118Abstract: A multichip package structure includes a substrate unit, a light-emitting unit, a current-limiting unit, a frame unit and a package unit. The substrate unit includes a first chip-placing region and a second chip-placing region. The light-emitting unit includes a plurality of light-emitting chips electrically connected to the first chip-placing region. The current-limiting unit includes at least one current-limiting chip electrically connected to the second chip-placing region and the light-emitting unit. The frame unit includes a first annular colloid frame surrounding the light-emitting chips and a second annular colloid frame surrounding the current-limiting chip. The package unit includes a first package colloid body surrounded by the first annular colloid frame to cover the light-emitting chips and a second package colloid body surrounded by the second annular colloid frame to cover the current-limiting chip.Type: GrantFiled: December 27, 2010Date of Patent: March 26, 2013Assignee: Paragon Semiconductor Lighting Technology Co., Ltd.Inventors: Chia-Tin Chung, Shih-Neng Dai
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Patent number: 8379645Abstract: Link data transmission to a plurality of nodes includes: establishing a tree connection among the plurality of nodes; receiving data to be transmitted at a current node; in the event that the current node receiving the data to be transmitted has at least one child node; sending by the current node the data to be transmitted to one of the at least one child node, and in the event that the current node receiving the data to be transmitted has at least one sibling node that has not obtained the data to be transmitted, sending by the current node the data to be transmitted to one of the at least one sibling node.Type: GrantFiled: November 23, 2009Date of Patent: February 19, 2013Assignee: Alibaba Group Holding LimitedInventors: Neng Dai, Zhen Li
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Publication number: 20120187865Abstract: A light-mixing multichip package structure includes a substrate unit, a light-emitting unit, a frame unit, and a package unit. The light-emitting unit includes at least one first light-emitting module with red light-emitting chips and at least one second light-emitting module with blue light-emitting chips. The frame unit includes at least one first continuous colloid frame and at least one second continuous colloid frame respectively surrounding the first light-emitting module and the second light-emitting module. The package unit includes a transparent colloid body and a phosphor colloid body respectively covering the first light-emitting module and the second light-emitting module. Hence, when the red light source generated by matching the red light-emitting chips and the transparent colloid body and the white light source generated by matching the blue light-emitting chips and the phosphor colloid body are mixed with each other, the CRI of the light-mixing multichip package structure can be increased.Type: ApplicationFiled: March 22, 2011Publication date: July 26, 2012Applicant: PARAGON SEMICONDUCTOR LIGHTING TECHNOLOGY CO.,LTD.Inventors: CHIA-TIN CHUNG, Shih-Neng Dai, Chao-Chin Wu
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Publication number: 20120097997Abstract: A multichip package structure includes a substrate unit, a light-emitting unit, a current-limiting unit, a frame unit and a package unit. The substrate unit includes a first chip-placing region and a second chip-placing region. The light-emitting unit includes a plurality of light-emitting chips electrically connected to the first chip-placing region. The current-limiting unit includes at least one current-limiting chip electrically connected to the second chip-placing region and the light-emitting unit. The frame unit includes a first annular colloid frame surrounding the light-emitting chips and a second annular colloid frame surrounding the current-limiting chip. The package unit includes a first package colloid body surrounded by the first annular colloid frame to cover the light-emitting chips and a second package colloid body surrounded by the second annular colloid frame to cover the current-limiting chip.Type: ApplicationFiled: December 27, 2010Publication date: April 26, 2012Inventors: Chia-Tin CHUNG, Shih-Neng Dai
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Publication number: 20120098458Abstract: A multichip package structure includes a substrate unit, a light-emitting unit, a control module, a frame unit and a package unit. The substrate unit includes a first chip-placing region and a second chip-placing region. The light-emitting unit includes a plurality of light-emitting chips electrically connected to the first chip-placing region. The control module includes at least one current-limiting unit and the rectifier unit electrically connected to the second chip-placing region and the light-emitting unit. The frame unit includes a first annular colloid frame surrounding the light-emitting chips and a second annular colloid frame surrounding the current-limiting unit and the rectifier unit. The package unit includes a first package colloid body surrounded by the first annular colloid frame to cover the light-emitting chips and a second package colloid body surrounded by the second annular colloid frame to cover the current-limiting unit and the rectifier unit.Type: ApplicationFiled: December 9, 2010Publication date: April 26, 2012Inventors: Shih-Neng DAI, Chia-Tin CHUNG
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Publication number: 20110252010Abstract: The present disclosure discloses a method and apparatus of selecting a word sequence for a text written in a language without word boundary in order to solve the problem of having excessively large computation load when selecting an optimal word sequence in existing technologies. The disclosed method includes: segmenting a segment of the text to obtain different word sequences; determining a common word boundary for the word sequences; and performing optimal word sequence selection for portions of the word sequences prior to the common word boundary. Because optimal word sequence selection is performed for portions of word sequences prior to a common word boundary, shorter independent units can be obtained, thus reducing computation load of word segmentation.Type: ApplicationFiled: December 4, 2009Publication date: October 13, 2011Applicant: ALIBABA GROUP HOLDING LIMITEDInventor: Neng Dai
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Publication number: 20100142547Abstract: Link data transmission to a plurality of nodes includes: establishing a tree connection among the plurality of nodes; receiving data to be transmitted at a current node; in the event that the current node receiving the data to be transmitted has at least one child node; sending by the current node the data to be transmitted to one of the at least one child node, and in the event that the current node receiving the data to be transmitted has at least one sibling node that has not obtained the data to be transmitted, sending by the current node the data to be transmitted to one of the at least one sibling node.Type: ApplicationFiled: November 23, 2009Publication date: June 10, 2010Inventors: Neng Dai, Zhen Li