Patents by Inventor Neng H. Lu

Neng H. Lu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Process for the production of void-free prepreg sheets
    Patent number: 4690836
    Abstract: A method is disclosed for the manufacture of void-free prepregs formed by the impregnation of a reinforcing cloth (e.g. glass fiber cloth) with a solution of a thermosetting resin (e.g. epoxy resin). In the method, the reinforcing cloth is first prewetted with a liquid medium containing a solvent for the resin which has a viscosity less than that of the solution of thermosetting resin. The prewetted cloth is impregnated with a solution of the resin and then heated to remove the solvent and cure the resin. The prepregs are used in the manufacture of printed circuit boards.
    Type: Grant
    Filed: October 23, 1985
    Date of Patent: September 1, 1987
    Assignee: International Business Machines Corp.
    Inventors: Thomas C. Clarke, Neng H. Lu, Yaffa Tomkiewicz, Ho M. Tong