Patents by Inventor Neng-Huang Chu

Neng-Huang Chu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • High heat dissipation stacked chip package structure and the manufacture method thereof
    Patent number: 10014283
    Abstract: The present invention provides a semiconductor device including a first glass substrate, a first integrated chip, a first anisotropic conductive film, a second glass substrate, a second integrated chip, a second anisotropic conductive film, and a packaging body.
    Type: Grant
    Filed: October 12, 2017
    Date of Patent: July 3, 2018
    Assignee: Jing Qiao Corporation Limited
    Inventors: Chin-Liang Chiang, Neng-Huang Chu, Yi-Lun Wu