Abstract: A fan blade includes an arch-shaped body, a connecting portion, at least one sheet and at least one reinforcement component. The arch-shaped body has a pressure bearing surface and a negative pressure surface opposite to the pressure bearing surface. The connecting portion is connected to a first end portion of the arch-shaped body. The sheet is connected to the pressure bearing surface or the negative pressure surface. The reinforcement component is connected to the pressure bearing surface. An orthogonal projection of the sheet on the arch-shaped body and an orthogonal projection of the reinforcement component on the arch-shaped body are not overlapped with each other. A fan is also provided.

Abstract: A heat dissipation system of portable electronic device includes a body, at least one fan and at least one spacing member. At least one heat source of the portable electronic device is arranged in the body. The fan is a centrifugal fan disposed in the body. The fan has at least one flow inlet located in the axial direction and at least one flow outlet located in the radial direction. The spacing member is disposed on at least one of the body or the fan to form a stratified air flow in the body along the axial direction. The stratified air flows into the fan through the flow inlet and out of the fan through the flow outlet respectively.

Abstract: A heat dissipation device includes a heat dissipation member and a fan. The heat dissipation member includes a first heat dissipation fin group and a second heat dissipation fin group stacked on the first heat dissipation fin group. The first heat dissipation fin group includes a plurality of first heat dissipation fins, and the second heat dissipation fin group includes a plurality of second heat dissipation fins. The fan is stacked on the second heat dissipation fin group. The fan is configured to rotate around an axis. The first heat dissipation fins and the second heat dissipation fins are arranged around the axis.

Abstract: A heat dissipation fan suited for being assembled in an electronic device is provided. The heat dissipation fan includes a hub and a plurality of fan blades disposed at and surrounding the hub. The fan blade has ductility and flexibility, and any two fan blades next to each other are in different thickness.

Abstract: An axial flow fan includes a hub and a plurality of fan sets disposed around the hub. The hub rotates around a center axis and has a positive pressure side and a negative pressure side opposite to each other. Each of the fan sets includes at least two blades, and each blade has a wind inlet end, a wind outlet end opposite to the wind inlet end, a negative pressure surface, and a positive pressure surface opposite to the negative pressure surface. The wind outlet end of one of the adjacent two blades corresponds to the wind inlet end of the other one of the adjacent two blades. A gap is provided between the negative pressure surface of one of the adjacent two blades and the positive pressure surface of the other one of the adjacent two blades.

Abstract: A heat dissipation fan including a hub and a plurality of fan assemblies are provided. The fan assemblies are disposed around the hub, and each of the fan assemblies includes at least two blades. A runner is formed between the at least two blades. A width of the runner gradually reduces along a rotating axis of the hub.

Abstract: A fan and a balance ring for the fan are provided. The fan includes a housing, a hub disposed in the housing, blades connected to the side surface of the hub, and a balance ring connected to the hub. The balance ring includes a ring chamber and a balance liquid filled in the ring chamber. The volume of the balance liquid is less than the volume of the ring chamber.

Abstract: A vapor chamber structure for heat dissipation of a heat source is provided. The vapor chamber structure includes a housing having a heat absorption side and a heat dissipation side, a first capillary structure disposed in the housing, and a working fluid filled in the housing. The first capillary structure is formed into cavities isolated from each other, and each of the cavities is connected between the heat absorption side and the heat dissipation side. Heat generated by the heat source is absorbed by the heat absorption side, thereby transforming the working fluid from liquid state to vapor state. The working fluid in the vapor state is transmitted to the heat dissipation side via the cavities, and is transformed to the liquid state while the heat is dissipated. The working fluid in the liquid state returns to the heat absorption side via the first capillary structure.

Abstract: A head phone structure includes an earmuff casing and a speaker. The earmuff casing includes a first casing and a second casing. A first accommodating space and a first chamber are formed between the first casing and the second casing, and the first chamber is formed outside the first accommodating space. The speaker is disposed in the first accommodating space of the earmuff casing and at least includes a frame and a vibration system. A second chamber is defined and formed by the frame and the vibration system. An airflow is generated in the second chamber when the vibration system vibrates. The second chamber communicates with the first chamber of the earmuff casing.

Abstract: A fan including a hub and a plurality metal blades is provided. Each of the blades extends from the hub and is inclined relative to a radial direction of the hub. Each blade has a distal edge away from the hub, and has a pair of wingtips at the distal edge.

Abstract: A centrifugal heat dissipation fan including a housing and an impeller is provided. The housing has at least one flow inlet. The impeller assembled in the housing and rotating about an axial direction includes a hub and a plurality blades disposed around the hub. The flow inlet is located in the axial direction and faces the hub. Each of the blades has a wing tab next to the flow inlet, and the wing tab extends from a main surface of the blade to another blade. The wing tab has an inclined surface facing toward a periphery of the flow inlet along a radial direction of the impeller.

Abstract: A centrifugal heat dissipation fan including a housing and an impeller disposed in the housing on an axis is provided. The housing has at least one inlet on the axis and has a plurality of outlets in different radial directions. A heat dissipation system of an electronic device is also provided.

Abstract: A centrifugal heat dissipation fan including a housing and an impeller is provided. The housing has at least one inlet disposed along an axis and at least one first outlet and a second outlet located in different radial directions, wherein the first outlet and the second outlet are opposite to and separated from each other. The impeller is disposed in the housing along the axis. A heat dissipation system of an electronic device is also provided.

Abstract: A heat dissipation fan including a housing, a hub, and a plurality of blades is provided. The hub is rotatably disposed in the housing. The blades are disposed at a surrounding edge of the hub to be rotated with the hub. When the heat dissipation fan is operated, at least one flow path is formed by two adjacent blades, and the flow path has a reduction section away from the hub.

Abstract: A cycling heat dissipation module suited for dissipating heat generated from a heat source is provided. The cycling heat dissipation module includes an evaporator, a condenser, and a micro/nano-structure. The evaporator is thermal contacted with the heat source to absorb heat generated therefrom. The condenser is connected to the evaporator to form a loop, and a working fluid is filled in the loop. The working fluid in liquid state is transformed to vapor state by absorbing heat in the evaporator, and the working fluid in vapor state is transformed to liquid state by dissipating heat in the condenser. The micro/nano-structure is disposed in the condenser to destroy a boundary layer of the working fluid while passing through the condenser.

Abstract: A heat dissipation module including a first fan and a second fan is provided. The first fan has a first hub and a plurality of first fan blades disposed on the first hub. The second fan has a second hub and a plurality of second fan blades disposed on the second hub. Herein the first hub and the second hub are movably connected to each other in an axial direction such that the first fan and the second fan coincide or are separated from each other.

Abstract: A fan structure including a fan housing and a fan body is provided. The fan housing includes a base and a cover assembled on the base. The cover includes a main portion, a periphery portion, a plurality of connecting portions and a plurality of flow guiding portions. The connecting portions are connected to the main portion and the periphery portion. The cover has a plurality of air inlet openings among the main portion, the periphery portion and connecting portions, wherein each of the flow guiding portions protrudes from the main portion and is adjacent to an inner side of the corresponding air inlet opening. The fan body is rotatably disposed in the fan housing. An electronic assembly is also provided.

Abstract: A remote heat exchanging module is configured to dissipate heat of a heat source and includes a first heat conduction member, a second heat conduction member, and a heat dissipation member. The first heat conduction member includes a first metallic layer in thermal contact with the heat source, a second metallic layer including a first end and a second end opposite to each other, and a graphene layer located between the first and the second metallic layers. The first end is in thermal contact with the second metallic layer. The heat dissipation member is in thermal contact with the second end. Heat generated by the heat source is transferred to the second end sequentially through the first heat conduction member and the first end and is dissipated out of the remote heat exchanging module through the heat dissipation member. A composite thin-layered heat conduction structure is also provided.

Abstract: A cycling heat dissipation module suited for dissipating heat generated from a heat source is provided. The cycling heat dissipation module includes an evaporator, a condenser, and a micro/nano-structure. The evaporator is thermal contacted with the heat source to absorb heat generated therefrom. The condenser is connected to the evaporator to form a loop, and a working fluid is filled in the loop. The working fluid in liquid state is transformed to vapor state by absorbing heat in the evaporator, and the working fluid in vapor state is transformed to liquid state by dissipating heat in the condenser. The micro/nano-structure is disposed in the condenser to destroy a boundary layer of the working fluid while passing through the condenser.

Abstract: A hinge mechanism is provided. The hinge mechanism includes a base, a magnetic assembly, a torque assembly, and a calibration component. The magnetic assembly is disposed in the base. The torque assembly is connected to the base, and includes a substrate, a first cylinder, and a second cylinder. The substrate is disposed in the base. The first cylinder penetrates the substrate, and is rotatable relative to the substrate. The second cylinder penetrates the substrate, and is rotatable relative to the substrate and the first cylinder. The calibration component is disposed between the magnetic assembly and the torque assembly, and abuts an inner wall of the first cylinder, and an inner wall of the second cylinder.