Patents by Inventor Neng Liu

Neng Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11966241
    Abstract: A circuit includes a voltage divider circuit configured to generate a feedback voltage according to an output voltage, an operational amplifier configured to output a driving signal according to the feedback voltage and a reference voltage and a pass gate circuit including multiple current paths. The current paths are controlled by the driving signal and connected in parallel between the voltage divider circuit and a power reference node.
    Type: Grant
    Filed: February 11, 2022
    Date of Patent: April 23, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Huan-Neng Chen, Yen-Lin Liu, Chia-Wei Hsu, Jo-Yu Wu, Chang-Fen Hu, Shao-Yu Li, Bo-Ting Chen
  • Patent number: 11917230
    Abstract: A system and method for maximizing bandwidth in an uplink for a 5G communication system is disclosed. Multiple end devices generate image streams. A gateway is coupled to the end devices. The gateway includes a gateway monitor agent collecting utilization rate data of the gateway and an image inspector collecting inspection data from the received image streams. An edge server is coupled to the gateway. The edge server includes an edge server monitor agent collecting utilization rate data of the edge server. An analytics manager is coupled to the gateway and the edge server. The analytics manager is configured to determine an allocation strategy based on the collected utilization rate data from the gateway and the edge server.
    Type: Grant
    Filed: October 6, 2021
    Date of Patent: February 27, 2024
    Assignee: Quanta Cloud Technology Inc.
    Inventors: Yi-Neng Zeng, Keng-Cheng Liu, Wei-Ming Huang, Shih-Hsun Lai, Ji-Jeng Lin, Chia-Jui Lee, Liao Jin Xiang
  • Publication number: 20230153286
    Abstract: The present invention discloses a method and a system for hybrid query based on a cloud analysis scene, and a storage medium. The method comprises the following steps: obtaining query information, and obtaining an index thereof based on the query information; obtaining meta-information of the index based on pre-computation, and comparing the obtained meta-information with the meta-information of an aggregate index; and determining a query mode corresponding to the meta-information based on a comparison result, the query mode including a query mode of storage-computation separation or a MPP architecture. The present invention solves the technical problem that in an ultra-high-dimensional environment, how to enable a pre-computation query system to most efficiently and more stably utilize the pre-computation result to respond to the query of a client most quickly and avoid generating a large amount of redundant data.
    Type: Application
    Filed: December 31, 2022
    Publication date: May 18, 2023
    Applicant: SHANGHAI KYLIGENCE INFORMATION TECHNOLOGY CO., LTD.
    Inventors: Chang CHEN, Neng LIU, Hongbin MA, Yang LI, Qing HAN
  • Patent number: 11636336
    Abstract: A training device and a training method for a neural network model. The training method includes: obtaining a data set; completing, according to the data set, a plurality of artificial intelligence (AI) model trainings to generate a plurality of models corresponding to the plurality of AI model trainings respectively; selecting, according to a first constraint, a first model set from the plurality of models; and selecting, according to a second constraint, the neural network model from the first model set.
    Type: Grant
    Filed: December 29, 2019
    Date of Patent: April 25, 2023
    Assignee: Industrial Technology Research Institute
    Inventors: Mao-Yu Huang, Po-Yen Hsieh, Chih-Neng Liu, Tsann-Tay Tang
  • Publication number: 20230118614
    Abstract: An electronic device and a method for training a neural network model are provided. The method includes: obtaining a first neural network model and a first pseudo-labeled data; inputting the first pseudo-labeled data into the first neural network model to obtain a second pseudo-labeled data; determining whether a second pseudo-label corresponding to the second pseudo-labeled data matching a first pseudo-label corresponding to the first pseudo-labeled data; in response to the second pseudo-label matching the first pseudo-label, adding the second pseudo-labeled data to a pseudo-labeled dataset; and training the first neural network model according to the pseudo-labeled dataset.
    Type: Application
    Filed: November 23, 2021
    Publication date: April 20, 2023
    Applicant: Industrial Technology Research Institute
    Inventors: Mao-Yu Huang, Sen-Chia Chang, Ming-Yu Shih, Tsann-Tay Tang, Chih-Neng Liu
  • Publication number: 20230066892
    Abstract: A production schedule estimation method and a production schedule estimation system are provided. The production schedule estimation method includes the following steps. Current-day work-in-process data, machine group cycle time data of a machine group, and productivity data of the machine group are obtained. The current-day work-in-process data, the cycle time data of the machine group, and the productivity data of the machine group are inputted into a prediction model. Current-day cycle time data and a current-day move volume for each of multiple stations in the machine group are calculated through the prediction model. And, current-day move data is calculated according to the current-day cycle time data and the current-day move volume for each of the multiple stations in the machine group.
    Type: Application
    Filed: September 30, 2021
    Publication date: March 2, 2023
    Applicant: Powerchip Semiconductor Manufacturing Corporation
    Inventors: Chih-Neng Liu, Chih-Chuen Huang, Chia-Jen Fu, Chih-Hsiang Chang
  • Patent number: 11562942
    Abstract: A chip carrier socket for an electronic-photonic integrated-circuit (EPIC) assembly comprises a carrier bottom and a carrier top configured to mate to the carrier bottom while enclosing the EPIC assembly within an enclosed cavity. The carrier bottom comprises one or more conductive vias passing from a first surface of the carrier bottom to an opposite second surface of the carrier bottom, each conductive via providing electrical connectivity between an electrically conductive pad on the first surface of the carrier bottom and a respective electrically conductive pad, solder ball, or electrically conductive spring on the second surface of the carrier bottom. One or both of the carrier bottom and the carrier top comprises a fluid inlet port and a fluid outlet port. Further, either or both of the carrier bottom and the bottom top comprises an optical via passing from one surface to another of the carrier bottom or carrier top.
    Type: Grant
    Filed: March 29, 2017
    Date of Patent: January 24, 2023
    Assignee: Telefonaktiebolaget LM Ericsson (publ)
    Inventors: Neng Liu, Robert Brunner, Stephane Lessard
  • Patent number: 11456523
    Abstract: A radio-frequency three-dimensional electronic-photonic integrated circuit (RF 3D EPIC) comprises a radio-frequency (RF) photonic integrated circuit (PIC) layer, the RF PIC layer comprising, in a single integrated circuit, at least one RF antenna and at least one photonic device coupling the RF antenna to an optical interface, and further comprises an electronic-photonic integrated circuit (EPIC) assembly optically coupled to the optical interface of the RF PIC layer, the EPIC assembly comprising two or more integrated-circuit dies bonded to one another so as to form a die stack, wherein at least one of the two or more integrated-circuit dies comprises one or more integrated photonic devices and wherein each of the two or more integrated-circuit dies is electrically connected to at least one other integrated-circuit die via an electrically conductive through-wafer interconnect or an electrically conductive through-wafer via.
    Type: Grant
    Filed: August 18, 2017
    Date of Patent: September 27, 2022
    Assignee: Telefonaktiebolaget LM Ericsson (publ)
    Inventors: Neng Liu, Robert Brunner, Stephane Lessard
  • Patent number: 11282182
    Abstract: Embodiments of this disclosure provide an image processing method and apparatus, a computer-readable medium, and an electronic device. The image processing method includes: obtaining a to-be-processed image; determining a to-be-processed object in the to-be-processed image, the to-be-processed object comprising at least one of a human face, an animal face, or a cartoon character face; selecting a reference animated image to be applied to the to-be-processed image; processing the to-be-processed image according to the reference animated image, to generate a plurality of frames of images, each frame of the plurality of frames of images comprising the to-be-processed object; and composing the plurality of frames of images into a target animated image.
    Type: Grant
    Filed: August 18, 2020
    Date of Patent: March 22, 2022
    Assignee: Tencent Technology (Shenzhen) Company Limited
    Inventors: Le Yu, Neng Liu, Huiying Zhu, Youwei Hua
  • Patent number: 11239635
    Abstract: According to an aspect, an optical system includes a laser diode configured to emit optical signals and at least two size-switchable broken racetrack ring resonators optically coupled to an optical waveguide, where each broken racetrack ring resonator is configured to exhibit a resonant wavelength. The optical system also includes a tuning arrangement associated with the broken racetrack ring resonators, where the tuning arrangement includes a micro electro-mechanical system (MEMS) or nano electro-mechanical system (NEMS) actuator mechanically coupled to a first portion of a first one of the broken racetrack ring resonators and configured to mechanically move the first portion so as to change the resonant wavelength of the first one of the broken racetrack ring resonators.
    Type: Grant
    Filed: August 16, 2018
    Date of Patent: February 1, 2022
    Assignee: Telefonaktiebolaget LM Ericsson (publ)
    Inventors: Neng Liu, Robert Brunner, Stephane Lessard
  • Patent number: 11171075
    Abstract: An electronic-photonic integrated-circuit assembly comprises a carrier substrate (310) and one or more integrated-circuit dies (330, 340) bonded to one another so as to form a die stack with exterior surfaces corresponding to an outer surface of a first one of the integrated-circuit dies and to an outer surface of a second one of the integrated-circuit dies, where at least one of the integrated-circuit dies includes one or more integrated photonic devices. One or more channels or passages (320) are formed into the outer surface of the first one of the integrated-circuit dies, and a first surface of the carrier substrate (310) is bonded to the outer surface of the first one of the integrated-circuit dies, thereby enclosing the one or more channels or passages (320), The integrated-circuit dies are electrically connected to each other via electrically conductive through-wafer interconnects or electrically conductive through-wafer vias.
    Type: Grant
    Filed: March 1, 2017
    Date of Patent: November 9, 2021
    Assignee: Telefonaktiebolaget LM Ericsson (publ)
    Inventors: Neng Liu, Robert Brunner, Stephane Lessard
  • Publication number: 20210239906
    Abstract: According to an aspect, an optical system includes a laser diode configured to emit optical signals and at least two size-switchable broken racetrack ring resonators optically coupled to an optical waveguide, where each broken racetrack ring resonator is configured to exhibit a resonant wavelength. The optical system also includes a tuning arrangement associated with the broken racetrack ring resonators, where the tuning arrangement includes a micro electro-mechanical system (MEMS) or nano electro-mechanical system (NEMS) actuator mechanically coupled to a first portion of a first one of the broken racetrack ring resonators and configured to mechanically move the first portion so as to change the resonant wavelength of the first one of the broken racetrack ring resonators.
    Type: Application
    Filed: August 16, 2018
    Publication date: August 5, 2021
    Inventors: Neng Liu, Robert Brunner, Stephane Lessard
  • Publication number: 20210174200
    Abstract: A training device and a training method for a neural network model are provided. The training method includes: obtaining a data set; completing, according to the data set, a plurality of artificial intelligence (AI) model trainings to generate a plurality of models corresponding to the plurality of AI model trainings respectively; selecting, according to a first constraint, a first model set from the plurality of models; and selecting, according to a second constraint, the neural network model from the first model set.
    Type: Application
    Filed: December 29, 2019
    Publication date: June 10, 2021
    Applicant: Industrial Technology Research Institute
    Inventors: Mao-Yu Huang, Po-Yen Hsieh, Chih-Neng Liu, Tsann-Tay Tang
  • Publication number: 20210166991
    Abstract: A chip carrier socket for an electronic-photonic integrated-circuit (EPIC) assembly comprises a carrier bottom and a carrier top configured to mate to the carrier bottom while enclosing the EPIC assembly within an enclosed cavity. The carrier bottom comprises one or more conductive vias passing from a first surface of the carrier bottom to an opposite second surface of the carrier bottom, each conductive via providing electrical connectivity between an electrically conductive pad on the first surface of the carrier bottom and a respective electrically conductive pad, solder ball, or electrically conductive spring on the second surface of the carrier bottom. One or both of the carrier bottom and the carrier top comprises a fluid inlet port and a fluid outlet port. Further, either or both of the carrier bottom and the bottom top comprises an optical via passing from one surface to another of the carrier bottom or carrier top.
    Type: Application
    Filed: March 29, 2017
    Publication date: June 3, 2021
    Inventors: Neng Liu, Robert Brunner, Stephane Lessard
  • Publication number: 20210028534
    Abstract: A radio-frequency three-dimensional electronic-photonic integrated circuit (RF 3D EPIC) comprises a radio-frequency (RF) photonic integrated circuit (PIC) layer, the RF PIC layer comprising, in a single integrated circuit, at least one RF antenna and at least one photonic device coupling the RF antenna to an optical interface, and further comprises an electronic-photonic integrated circuit (EPIC) assembly optically coupled to the optical interface of the RF PIC layer, the EPIC assembly comprising two or more integrated-circuit dies bonded to one another so as to form a die stack, wherein at least one of the two or more integrated-circuit dies comprises one or more integrated photonic devices and wherein each of the two or more integrated-circuit dies is electrically connected to at least one other integrated-circuit die via an electrically conductive through-wafer interconnect or an electrically conductive through-wafer via.
    Type: Application
    Filed: August 18, 2017
    Publication date: January 28, 2021
    Applicant: Telefonaktiebolaget LM Ericsson (publ)
    Inventors: Neng LIU, Robert BRUNNER, Stephane LESSARD
  • Publication number: 20200380660
    Abstract: Embodiments of this disclosure provide an image processing method and apparatus, a computer-readable medium, and an electronic device. The image processing method includes: obtaining a to-be-processed image; determining a to-be-processed object in the to-be-processed image, the to-be-processed object comprising at least one of a human face, an animal face, or a cartoon character face; selecting a reference animated image to be applied to the to-be-processed image; processing the to-be-processed image according to the reference animated image, to generate a plurality of frames of images, each frame of the plurality of frames of images comprising the to-be-processed object; and composing the plurality of frames of images into a target animated image.
    Type: Application
    Filed: August 18, 2020
    Publication date: December 3, 2020
    Applicant: Tencent Technology (Shenzhen) Company Limited
    Inventors: Le YU, Neng LIU, Huiying ZHU, Youwei HUA
  • Patent number: 10748053
    Abstract: A ticket authentication method and a ticket authentication device are provided. The ticket authentication method includes the following steps. A first electronic device outputs an e-ticket. A second electronic device acquires the e-ticket. The second electronic device outputs a visible light verification code. The first electronic device acquires the visible light verification code and generates a composite code according to a certification data and the verification code. The second electronic device acquires the visible light composite code, and determines whether the composite code matches the certification data and the verification code. When the composite code matches the certification data and the verification code, the second electronic determines that the authentication of the e-ticket is successful.
    Type: Grant
    Filed: December 29, 2016
    Date of Patent: August 18, 2020
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Yi-Yuan Chen, Xin-Lan Liao, Kun-Hsien Lin, Lih-Guong Jang, Chi-Neng Liu, Nien-Chu Wu, Po-Yu Huang
  • Publication number: 20200141184
    Abstract: The invention discloses a foot-assisted movable engineering ladder, comprising a herringbone ladder body, which comprises left and right ladder bodies hinged with each other at the top; the left body has a plurality of left steps in parallel from top to bottom, and the right body has right steps corresponding to the left steps; the bottom of left and the right bodies have guiding wheels. Advantageous: a power assist component is added, enabling that the direction and position of the ladder can be moved in construction, reducing the worker's movements to carry the ladder, which is labor and time consuming. The invention is mainly used for construction, water and electricity installation, decoration, oil painting, painting, etc.
    Type: Application
    Filed: October 31, 2019
    Publication date: May 7, 2020
    Inventor: Neng Liu
  • Patent number: 10572647
    Abstract: A touchscreen unlocking method and apparatus are disclosed. The method includes receiving an unlocking instruction triggered by a user by sliding a control on a touchscreen; reading a corresponding user-defined screen locking configuration file according to the unlocking instruction; and performing an unlocking operation on the touchscreen according to the corresponding user-defined screen locking configuration file. In the present disclosure, when a user triggers unlocking, an unlocking operation is performed on a touchscreen according to a user-defined screen locking configuration file; and an unlocking control on the touchscreen can be self-defined and randomly set by the user, and different effects such as animation, sound, and vibration may be displayed in different states, thereby greatly improving unlocking convenience and fun, and meeting the requirement that the user hopes to self-define an unlocking manner according to the preference of the user.
    Type: Grant
    Filed: August 28, 2017
    Date of Patent: February 25, 2020
    Assignee: TENCENT TECHNOLOGY (SHENZHEN) COMPANY LIMITED
    Inventors: Jing Zhang, Neng Liu
  • Publication number: 20200013699
    Abstract: An electronic-photonic integrated-circuit assembly comprises a carrier substrate (310) and one or more integrated-circuit dies (330, 340) bonded to one another so as to form a die stack with exterior surfaces corresponding to an outer surface of a first one of the integrated-circuit dies and to an outer surface of a second one of the integrated-circuit dies, where at least one of the integrated-circuit dies includes one or more integrated photonic devices. One or more channels or passages (320) are formed into the outer surface of the first one of the integrated-circuit dies, and a first surface of the carrier substrate (310) is bonded to the outer surface of the first one of the integrated-circuit dies, thereby enclosing the one or more channels or passages (320), The integrated-circuit dies are electrically connected to each other via electrically conductive through-wafer interconnects or electrically conductive through-wafer vias.
    Type: Application
    Filed: March 1, 2017
    Publication date: January 9, 2020
    Inventors: Neng Liu, Robert Brunner, Stephane Lessard