Patents by Inventor Neo Chee Peng
Neo Chee Peng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8058716Abstract: An IC device includes a die and a first package interposer stacked over a second package interposer. The IC device includes a first conductive connection from a first bond pad of the die directly to a bond pad of the first interposer and a second conductive connection from a second bond pad of the die directly to a bond pad of the second interposer. Another IC device includes a second die stacked over a separate first die and a first package interposer stacked over a separate second package interposer. The first die is stacked over the first interposer. A first conductive connection exists from a bond pad of the first die directly to a bond pad of the first interposer and a second conductive connection exists from a bond pad of the second die directly to a bond pad of the second interposer.Type: GrantFiled: November 24, 2009Date of Patent: November 15, 2011Assignee: Micron Technology, Inc.Inventors: Chew Beng Chye, Tan Kian Shing Michael, Tan Hock Chuan, Neo Chee Peng
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Publication number: 20100065955Abstract: An IC device includes a die and a first package interposer stacked over a second package interposer. The IC device includes a first conductive connection from a first bond pad of the die directly to a bond pad of the first interposer and a second conductive connection from a second bond pad of the die directly to a bond pad of the second interposer. Another IC device includes a second die stacked over a separate first die and a first package interposer stacked over a separate second package interposer. The first die is stacked over the first interposer. A first conductive connection exists from a bond pad of the first die directly to a bond pad of the first interposer and a second conductive connection exists from a bond pad of the second die directly to a bond pad of the second interposer.Type: ApplicationFiled: November 24, 2009Publication date: March 18, 2010Applicant: Micron Technology, Inc.Inventors: Chew Beng Chye, Tan Kian Shing Michael, Tan Hock Chuan, Neo Chee Peng
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Patent number: 7622798Abstract: An IC device includes a die and a first package interposer stacked over a second package interposer. The IC device includes a first conductive connection from a first bond pad of the die directly to a bond pad of the first interposer and a second conductive connection from a second bond pad of the die directly to a bond pad of the second interposer. Another IC device includes a second die stacked over a separate first die and a first package interposer stacked over a separate second package interposer. The first die is stacked over the first interposer. A first conductive connection exists from a bond pad of the first die directly to a bond pad of the first interposer and a second conductive connection exists from a bond pad of the second die directly to a bond pad of the second interposer.Type: GrantFiled: June 1, 2006Date of Patent: November 24, 2009Assignee: Micron Technology, Inc.Inventors: Chew Beng Chye, Tan Kian Shing Michael, Tan Hock Chuan, Neo Chee Peng
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Publication number: 20080308221Abstract: A method for removing tape from a substrate includes the step of detecting an actual distance between a peel head and the tape on the substrate, and a location of an edge of the substrate. The method also includes the steps of moving the peel head in a first direction by an amount equal to the distance to press the peel tape onto the tape on the substrate, moving the peel head in a second direction to the edge of the substrate, and then moving the peel head in an opposite second direction to peel the tape from the substrate. The detecting step can be performed using a sensor such as a capacitance probe sensor or an optical sensor. Alternately, rather than detecting the distance, a pressure sensing system can be used to press the peel head against the tape, and to maintain a predetermined pressure range during the peeling process.Type: ApplicationFiled: July 18, 2007Publication date: December 18, 2008Inventors: Tan Kian Shing Michael, Neo Chee Peng, Tan Chee Yong
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Publication number: 20080233684Abstract: The present disclosure suggests various microelectronic component assembly designs and methods for manufacturing microelectronic component assemblies. In one particular implementation, a microelectronic component assembly includes a microelectronic component, at least two leads, and at least two bond wires. Each of the leads may have a reduced-thickness inner length adjacent terminals of the microelectronic component and a body having an outer surface spaced farther from the microelectronic component than a bond surface of the inner length. Each of the bond wires couples the microelectronic component to one of the leads and has a maximum height outwardly from the microelectronic component that is no greater than the height of the outer surface of the lead.Type: ApplicationFiled: April 23, 2008Publication date: September 25, 2008Applicant: MICRON TECHNOLOGY, INC.Inventors: Neo Chee Peng, Tan Hock Chuan, Chew Beng Chye, David Chai Yih Ming, Michael Tan Kian Shing
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Patent number: 7425470Abstract: The present disclosure suggests various microelectronic component assembly designs and methods for manufacturing microelectronic component assemblies. In one particular implementation, a microelectronic component assembly includes a microelectronic component, at least two leads, and at least two bond wires. Each of the leads may have a reduced-thickness inner length adjacent terminals of the microelectronic component and a body having an outer surface spaced farther from the microelectronic component than a bond surface of the inner length. Each of the bond wires couples the microelectronic component to one of the leads and has a maximum height outwardly from the microelectronic component that is no greater than the height of the outer surface of the lead.Type: GrantFiled: August 17, 2004Date of Patent: September 16, 2008Assignee: Micron Technology, Inc.Inventors: Neo Chee Peng, Tan Hock Chuan, Chew Beng Chye, David Chai Yih Ming, Michael Tan Kian Shing
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Publication number: 20070246840Abstract: An IC device includes a die and a first package interposer stacked over a second package interposer. The IC device includes a first conductive connection from a first bond pad of the die directly to a bond pad of the first interposer and a second conductive connection from a second bond pad of the die directly to a bond pad of the second interposer. Another IC device includes a second die stacked over a separate first die and a first package interposer stacked over a separate second package interposer. The first die is stacked over the first interposer. A first conductive connection exists from a bond pad of the first die directly to a bond pad of the first interposer and a second conductive connection exists from a bond pad of the second die directly to a bond pad of the second interposer.Type: ApplicationFiled: June 1, 2006Publication date: October 25, 2007Inventors: Chew Beng Chye, Tan Kian Shing Michael, Tan Hock Chuan, Neo Chee Peng
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Patent number: 7057281Abstract: The present disclosure suggests various microelectronic component assembly designs and methods for manufacturing microelectronic component assemblies. In one particular implementation, a microelectronic component assembly includes a microelectronic component, at least two leads, and at least two bond wires. Each of the leads may have a reduced-thickness inner length adjacent terminals of the microelectronic component and a body having an outer surface spaced farther from the microelectronic component than a bond surface of the inner length. Each of the bond wires couples the microelectronic component to one of the leads and has a maximum height outwardly from the microelectronic component that is no greater than the height of the outer surface of the lead.Type: GrantFiled: April 28, 2003Date of Patent: June 6, 2006Assignee: Micron Technology Inc.Inventors: Neo Chee Peng, Tan Hock Chuan, Chew Beng Chye, David Chai Yih Ming, Michael Tan Kian Shing
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Patent number: 7018270Abstract: Improperly mounted wafer saw blades can damage wafers cut or diced with the blades. Embodiments of this invention employ sensors to measure a distance to the blade to help indicate if the blade is improperly mounted. In one method of the invention, a the distance to the blade face is measured as the blade is rotated and a variance in this measured distance is determined. If the variance is no greater than a predetermined maximum, the blade may be used to cut the wafer. In one apparatus of the invention, a wafer saw include a blade and a sensor. The sensor is adapted to monitor a distance to a face of the rotating blade. A processor coupled to the sensor may indicate if the distance to the face of the blade as it rotates deviates too far from a baseline position of the blade face.Type: GrantFiled: July 28, 2005Date of Patent: March 28, 2006Assignee: Micron Technology, Inc.Inventors: Neo Chee Peng, Tan Hock Chuan, Ho Kian Seng, Chew Beng Chye, Lim Guek Har, Tan Kok Chua
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Patent number: 7004054Abstract: The protective tape applied to the front surface of a semiconductor wafer to protect the wafer during backgrinding must be trimmed so that excess tape, known as tape bur, does not extend beyond the perimeter of the wafer. Tape bur may interfere with backgrinding by causing improper grinding, which may lead to wafer breakage. The tape cutter that trims the protective tape to eliminate tape bur is provided with a sensor which detects whether tape bur has been trimmed from the wafer. If tape bur has not been removed from the wafer, corrective action is taken to prevent the wafer from being backgrinded.Type: GrantFiled: March 14, 2001Date of Patent: February 28, 2006Assignee: Micron Technology, Inc.Inventor: Neo Chee Peng
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Patent number: 6939199Abstract: Improperly mounted wafer saw blades can damage wafers cut or diced with the blades. Embodiments of this invention employ sensors to measure a distance to the blade to help indicate if the blade is improperly mounted. In one method of the invention, a the distance to the blade face is measured as the blade is rotated and a variance in this measured distance is determined. If the variance is no greater than a predetermined maximum, the blade may be used to cut the wafer. In one apparatus of the invention, a wafer saw include a blade and a sensor. The sensor is adapted to monitor a distance to a face of the rotating blade. A processor coupled to the sensor may indicate if the distance to the face of the blade as it rotates deviates too far from a baseline position of the blade face.Type: GrantFiled: June 2, 2003Date of Patent: September 6, 2005Assignee: Micron Technology, Inc.Inventors: Neo Chee Peng, Tan Hock Chuan, Ho Kian Seng, Chew Beng Chye, Lim Guek Har, Tan Kok Chua
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Patent number: 6845695Abstract: The protective tape applied to the front surface of a semiconductor wafer to protect the wafer during backgrinding must be trimmed so that excess tape, known as tape bur, does not extend beyond the perimeter of the wafer. Tape bur may interfere with backgrinding by causing improper grinding, which may lead to wafer breakage. The tape cutter that trims the protective tape to eliminate tape bur is provided with a sensor which detects whether tape bur has been trimmed from the wafer. If tape bur has not been removed from the wafer, corrective action is taken to prevent the wafer from being backgrinded.Type: GrantFiled: May 29, 2003Date of Patent: January 25, 2005Assignee: Micron Technology, Inc.Inventor: Neo Chee Peng
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Publication number: 20040188400Abstract: Methods and devices for cutting workpieces, which include a laser adapted to at least partially cut a workpiece, are described. The workpiece is a wafer having a plurality dies each with an integrated circuit. A mechanical cutter follows the laser and engages the workpiece. An embodiment of the mechanical cutter includes a cutting blade adapted to complete a cut through a workpiece. A method includes a two-pass cutting procedure. The first pass is made by a laser, which scribes the workpiece. The second pass is made by the mechanical cutter. In an embodiment, the mechanical cutter follows the scribe created by the laser. In an embodiment, the workpiece is supported by a table. The workpiece moves relative to the laser and the mechanical cutter.Type: ApplicationFiled: April 13, 2004Publication date: September 30, 2004Applicant: Micron Technology, Inc.Inventors: Neo Chee Peng, Kian Shing Tan, Chew Beng Chyt, Tan Hock Chuan, Fong Chun Wai
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Publication number: 20040173899Abstract: The present disclosure suggests various microelectronic component assembly designs and methods for manufacturing microelectronic component assemblies. In one particular implementation, a microelectronic component assembly includes a microelectronic component, at least two leads, and at least two bond wires. Each of the leads may have a reduced-thickness inner length adjacent terminals of the microelectronic component and a body having an outer surface spaced farther from the microelectronic component than a bond surface of the inner length. Each of the bond wires couples the microelectronic component to one of the leads and has a maximum height outwardly from the microelectronic component that is no greater than the height of the outer surface of the lead.Type: ApplicationFiled: April 28, 2003Publication date: September 9, 2004Inventors: Neo Chee Peng, Tan Hock Chuan, Chew Beng Chye, David Chai Yih Ming, Michael Tan Kian Shing
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Patent number: 6737606Abstract: Methods and devices for cutting workpieces, which include a laser adapted to at least partially cut a workpiece, are described. The workpiece is a wafer having a plurality dies each with an integrated circuit. A mechanical cutter follows the laser and engages the workpiece. An embodiment of the mechanical cutter includes a cutting blade adapted to complete a cut through a workpiece. A method includes a two-pass cutting procedure. The first pass is made by a laser, which scribes the workpiece. The second pass is made by the mechanical cutter. In an embodiment, the mechanical cutter follows the scribe created by the laser. In an embodiment, the workpiece is supported by a table. The workpiece moves relative to the laser and the mechanical cutter.Type: GrantFiled: July 9, 2002Date of Patent: May 18, 2004Assignee: Micron Technology, Inc.Inventors: Neo Chee Peng, Kian Shing Tan, Chew Beng Chye, Tan Hock Chuan, Fong Chun Wai
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Publication number: 20030209117Abstract: The protective tape applied to the front surface of a semiconductor wafer to protect the wafer during backgrinding must be trimmed so that excess tape, known as tape bur, does not extend beyond the perimeter of the wafer. Tape bur may interfere with backgrinding by causing improper grinding, which may lead to wafer breakage. The tape cutter that trims the protective tape to eliminate tape bur is provided with a sensor which detects whether tape bur has been trimmed from the wafer. If tape bur has not been removed from the wafer, corrective action is taken to prevent the wafer from being backgrinded.Type: ApplicationFiled: May 29, 2003Publication date: November 13, 2003Inventor: Neo Chee Peng
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Publication number: 20030203538Abstract: Improperly mounted wafer saw blades can damage wafers cut or diced with the blades. Embodiments of this invention employ sensors to measure a distance to the blade to help indicate if the blade is improperly mounted. In one method of the invention, a the distance to the blade face is measured as the blade is rotated and a variance in this measured distance is determined. If the variance is no greater than a predetermined maximum, the blade may be used to cut the wafer. In one apparatus of the invention, a wafer saw include a blade and a sensor. The sensor is adapted to monitor a distance to a face of the rotating blade. A processor coupled to the sensor may indicate if the distance to the face of the blade as it rotates deviates too far from a baseline position of the blade face.Type: ApplicationFiled: June 2, 2003Publication date: October 30, 2003Inventors: Neo Chee Peng, Tan Hock Chuan, Ho Kian Seng, Chew Beng Chye, Lim Guek Har, Tan Kok Chua
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Patent number: 6576531Abstract: Improperly mounted wafer saw blades can damage wafers cut or diced with the blades. Embodiments of this invention employ sensors to measure a distance to the blade to help indicate if the blade is improperly mounted. In one method of the invention, the distance to the blade face is measured as the blade is rotated and a variance in this measured distance is determined. If the variance is no greater than a predetermined maximum, the blade may be used to cut the wafer. In one apparatus of the invention, a wafer saw include a blade and a sensor. The sensor is adapted to monitor a distance to a face of the rotating blade. A processor coupled to the sensor may indicate if the distance to the face of the blade as it rotates deviates too far from a baseline position of the blade face.Type: GrantFiled: August 30, 2001Date of Patent: June 10, 2003Assignee: Micron Technology, Inc.Inventors: Neo Chee Peng, Tan Hock Chuan, Ho Kian Seng, Chew Beng Chye, Lim Guek Har, Tan Kok Chua
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Publication number: 20030060022Abstract: Improperly mounted wafer saw blades can damage wafers cut or diced with the blades. Embodiments of this invention employ sensors to measure a distance to the blade to help indicate if the blade is improperly mounted. In one method of the invention, a the distance to the blade face is measured as the blade is rotated and a variance in this measured distance is determined. If the variance is no greater than a predetermined maximum, the blade may be used to cut the wafer. In one apparatus of the invention, a wafer saw include a blade and a sensor. The sensor is adapted to monitor a distance to a face of the rotating blade. A processor coupled to the sensor may indicate if the distance to the face of the blade as it rotates deviates too far from a baseline position of the blade face.Type: ApplicationFiled: August 30, 2001Publication date: March 27, 2003Inventors: Neo Chee Peng, Tan Hock Chuan, Ho Kian Seng, Chew Beng Chye, Lim Guek Har, Tan kok Chua
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Publication number: 20030047543Abstract: Methods and devices for cutting workpieces, which include a laser adapted to at least partially cut a workpiece, are described. The workpiece is a wafer having a plurality dies each with an integrated circuit. A mechanical cutter follows the laser and engages the workpiece. An embodiment of the mechanical cutter includes a cutting blade adapted to complete a cut through a workpiece. A method includes a two-pass cutting procedure. The first pass is made by a laser, which scribes the workpiece. The second pass is made by the mechanical cutter. In an embodiment, the mechanical cutter follows the scribe created by the laser. In an embodiment, the workpiece is supported by a table. The workpiece moves relative to the laser and the mechanical cutter.Type: ApplicationFiled: July 9, 2002Publication date: March 13, 2003Applicant: Micron Technology, Inc.Inventors: Neo Chee Peng, Kian Shing Tan, Chew Beng Chye, Tan Hock Chuan, Fong Chun Wai