Patents by Inventor Neo Yong Lou

Neo Yong Lou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8115306
    Abstract: An apparatus comprises an integrated circuit die including a main body having a top layer, a bottom layer, and a peripheral edge surface extending between the top layer and the bottom layer. The integrated circuit die also includes a bond pad on the main body, an edge contact at the peripheral edge surface and a line connecting the bond pad to the edge contact. The edge contact includes a bottom surface that substantially in the same plane as a surface of an encapsulant encasing the die. Additional apparatus, systems, and methods are disclosed.
    Type: Grant
    Filed: February 12, 2010
    Date of Patent: February 14, 2012
    Assignee: Round Rock Research, LLC
    Inventors: Chia Yong Poo, Boon Suan Jeung, Low Siu Waf, Chan Min Yu, Neo Yong Lou, Eng Meow Koon, Ser Bok Leng, Chun Swee Kwang, So Chee Chung, Ho Kwok Song
  • Publication number: 20100140794
    Abstract: An apparatus comprises an integrated circuit die including a main body having a top layer, a bottom layer, and a peripheral edge surface extending between the top layer and the bottom layer. The integrated circuit die also includes a bond pad on the main body, an edge contact at the peripheral edge surface and a line connecting the bond pad to the edge contact. The edge contact includes a bottom surface that substantially in the same plane as a surface of an encapsulant encasing the die. Additional apparatus, systems, and methods are disclosed.
    Type: Application
    Filed: February 12, 2010
    Publication date: June 10, 2010
    Inventors: Chia Yong Poo, Boon Suan Jeung, Low Siu Waf, Chan Min Yu, Neo Yong Lou, Eng Meow Koon, Ser Bok Leng, Chun Swee Kwang, So Chee Chung, Ho Kwok Song