Abstract: A laminate glass structure comprising a first glass sheet and a second glass sheet bonded together is provided. The first glass sheet of the laminate glass structure may include tuned light imaging detection and ranging sensor optical transmission characteristics and the second glass sheet may include a void area disposed in a portion thereof. The laminate glass structure can correspond to a laminate vehicle windshield that separates an interior cabin of the vehicle from an exterior of the vehicle. The laminate glass structure allows a light detection and ranging sensor to be mounted inside the interior cabin of the vehicle behind the void area providing a field of view of the sensor that is unobstructed by the second glass sheet. Light emitted and received by the sensor may only pass through the first glass sheet and not the second glass sheet.

Abstract: An electronics thermal conduction package is provided. The package may include a housing and an interior space, or envelope, configured to receive a printed circuit board assembly (“PCBA”) with one or more microprocessors or other heat generating elements. The package can be elastically deformed to open a dimension of the envelope, or receiving cavity, such that a complete PCBA can be inserted inside the interior space of the package. Once inserted, the package may be returned to its undeformed, or substantially undeformed, state such that surfaces in the interior space of the package contact one or more of the heat generating elements on the PCBA creating a conductive thermal path from the heat generating elements to the housing of the package.

Abstract: An electronics thermal conduction package is provided. The package may include a housing and an interior space, or envelope, configured to receive a printed circuit board assembly (“PCBA”) with one or more microprocessors or other heat generating elements. The package can be elastically deformed to open a dimension of the envelope, or receiving cavity, such that a complete PCBA can be inserted inside the interior space of the package. Once inserted, the package may be returned to its undeformed, or substantially undeformed, state such that surfaces in the interior space of the package contact one or more of the heat generating elements on the PCBA creating a conductive thermal path from the heat generating elements to the housing of the package.

Abstract: An electronics thermal conduction package is provided. The package may include a housing and an interior space, or envelope, configured to receive a printed circuit board assembly (“PCBA”) with one or more microprocessors or other heat generating elements. The package can be elastically deformed to open a dimension of the envelope, or receiving cavity, such that a complete PCBA can be inserted inside the interior space of the package. Once inserted, the package may be returned to its undeformed, or substantially undeformed, state such that surfaces in the interior space of the package contact one or more of the heat generating elements on the PCBA creating a conductive thermal path from the heat generating elements to the housing of the package.

Abstract: A compliant electronics assembly mount frame and package are provided. The compliant frame may include a number of spring features configured to flexibly maintain and/or orient an attached PCBA inside a thermal conduction package. These spring features disposed in the compliant frame may be shaped, sized, and even tuned, to bias heat generating components attached to the PCBA evenly against a thermally controlled surface of the thermal package. The frame may be made or stamped from metal, such as sheet metal, and may be formed to include one or more integral spring features.

Abstract: A self-contained hinge mechanism is provided including a hinge movement control assembly. The hinge movement control assembly includes a number of stacked alternating friction rings and pressure disks providing a tunable pivoting resistance. As the hinge mechanism is actuated, an internal shaft and a set of friction rings rotationally-locked to the internal shaft and door moves relative to a set of pressure disks rotationally-locked to a fixed hinge mechanism housing and mount frame. A resistance to the pivoting of the hinge mechanism elements is provided by the clamping force of multiple force members moving the pressure disks along axial translation guides of the housing closer to one another and sandwiching the friction rings closer together.

Abstract: Methods and systems are disclosed for joining A-class panels with a body of a vehicle without the use of hemming. Vehicle outer panels are bonded to the vehicle structure (whether body structure or door/liftgate/hood structure) via an inductively cured adhesive joint. The process enables the body in white to be painted one color thereby minimizing painting costs and reducing any process risks. It also enables the outer panels to be painted separately and efficiently which increases throughput. The present disclosure does not require hemming at all. The present disclosure does not require spot-welds. A specialized structural epoxy adhesive filled with glass beads is laid onto the inner panel. The outer panel is then mounted onto the inner panel whereby the glass beads control the gap. The fixture used for this process incorporates an automated arm which swings the induction curing equipment over the outer panel to a precise gap.

Abstract: A self-contained hinge mechanism is provided including a hinge movement control assembly. The hinge movement control assembly includes a number of stacked alternating friction rings and pressure disks providing a tunable pivoting resistance. As the hinge mechanism is actuated, an internal shaft and a set of friction rings rotationally-locked to the internal shaft and door moves relative to a set of pressure disks rotationally-locked to a fixed hinge mechanism housing and mount frame. A resistance to the pivoting of the hinge mechanism elements is provided by the clamping force of multiple force members moving the pressure disks along axial translation guides of the housing closer to one another and sandwiching the friction rings closer together.

Abstract: A closure system for a vehicle comprises: a dual-hinge closure comprising a first portion hinged to the vehicle by a first hinge, and a second portion hinged to the first portion by a second hinge; a frame that at least in part surrounds an opening in the vehicle; an adjustable bump stop subassembly mounted to the first portion, wherein the adjustable bump stop subassembly rests on the frame when the first portion is in a closed position; and a latch system comprising a latch configured to engage a horizontal striker, the latch system configured so that an end of the second portion opposite the second hinge latches to and unlatches from a distal portion of the frame by essentially horizontal motion.