Patents by Inventor Nestor Librado Castro Leyva

Nestor Librado Castro Leyva has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Template that improves solder-paste stenciling and production method thereof
    Patent number: 11297719
    Abstract: A template or stencil with perforations, which improves solder-paste stencilling on an object, includes: a first area treated with precision powder on a bottom laminar face of the template, the treated face covering at least an area where perforations are distributed; a second area treated with precision powder on a top laminar surface of the template, the second treated area encircling the perforations; and a third area treated twice with precision powder on the bottom laminar surface, the third area encircling the perforations of the template. A method for producing a template that improves solder-paste stencilling on an object is also provided, as is and to a method for the improved application of solder-paste on an object, such as a printed circuit board.
    Type: Grant
    Filed: March 6, 2019
    Date of Patent: April 5, 2022
    Assignee: INTERLATIN S DE RL DE CV
    Inventors: Jimmy Villalvazo, Nestor Librado Castro Leyva
  • TEMPLATE THAT IMPROVES SOLDER-PASTE STENCILLING AND PRODUCTION METHOD THEREOF
    Publication number: 20200396844
    Abstract: The invention relates to a template or stencil with perforations, which improves solder-paste stencilling on an object and comprises: a first area treated with precision powder on a bottom laminar face of the template, said treated face covering at least an area where perforations are distributed; a second area treated with precision powder on a top laminar surface of the template, said second treated area encircling the perforations; and a third area treated twice with precision powder on the bottom laminar surface, said third area encircling the perforations of the template. The invention also relates to a method for producing a template that improves solder-paste stencilling on an object, and to a method for the improved application of solder-paste on an object, such as a printed circuit board.
    Type: Application
    Filed: March 6, 2019
    Publication date: December 17, 2020
    Inventors: Jimmy Villalvazo, Nestor Librado Castro Leyva