Patents by Inventor Nestor VERGARA BICOMONG

Nestor VERGARA BICOMONG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Assembly for handling a semiconductor die and method of handling a semiconductor die
    Patent number: 10096508
    Abstract: In various embodiments, an assembly for handling a semiconductor die is provided. The assembly may include a carrier with a surface. The assembly may also include an adhesive tape fixed to the surface of the carrier. The adhesive tape may be configured to adhere to the semiconductor die. The adhesive tape may include adhesive, the adhesion of which can be reduced by means of electromagnetic waves. The assembly may further include an electromagnetic source configured to apply electromagnetic waves to the adhesive tape to reduce adhesion of the adhesive tape to the semiconductor die. The assembly may additionally include a die pick-up component configured to pick up the semiconductor die from the adhesive tape.
    Type: Grant
    Filed: August 14, 2015
    Date of Patent: October 9, 2018
    Assignee: Infineon Technologies AG
    Inventors: Ronald Paramio Joves, Thanabal Ganesh Kunamani, Kuang Ming Lee, Avelino Oliveros Sumagpoa, Kian Heong Tan, Nestor Vergara Bicomong, Jagen Krishnan, Soon Hock Tong
  • ASSEMBLY FOR HANDLING A SEMICONDUCTOR DIE AND METHOD OF HANDLING A SEMICONDUCTOR DIE
    Publication number: 20160049325
    Abstract: In various embodiments, an assembly for handling a semiconductor die is provided. The assembly may include a carrier with a surface. The assembly may also include an adhesive tape fixed to the surface of the carrier. The adhesive tape may be configured to adhere to the semiconductor die. The adhesive tape may include adhesive, the adhesion of which can be reduced by means of electromagnetic waves. The assembly may further include an electromagnetic source configured to apply electromagnetic waves to the adhesive tape to reduce adhesion of the adhesive tape to the semiconductor die. The assembly may additionally include a die pick-up component configured to pick up the semiconductor die from the adhesive tape.
    Type: Application
    Filed: August 14, 2015
    Publication date: February 18, 2016
    Inventors: Ronald PARAMIO JOVES, Thanabal Ganesh KUNAMANI, Kuang Ming LEE, Avelino OLIVEROS SUMAGPOA, Kian Heong TAN, Nestor VERGARA BICOMONG, Jagen KRISHNAN, Soon Hock TONG