Patents by Inventor Netzer Moriya

Netzer Moriya has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6414745
    Abstract: An apparatus for determining the relative height between two targets is disclosed. The present invention also discloses a method for determining the relative height between two targets; the method is substantially similar to the operational aspects of the device of the present invention. The method requires no angular measurements in order to determine the different height between the two targets, but rather only distance measurements that can be performed simply and accurately. The apparatus for determining the relative height between two targets a disclosed.
    Type: Grant
    Filed: March 7, 2000
    Date of Patent: July 2, 2002
    Assignee: Netmor Ltd.
    Inventor: Netzer Moriya
  • Patent number: 5982480
    Abstract: A method for the real time determination of the three dimensional position of a movable target with respect to a fixed coordinate system, the method utilizing a responder mounted on the target, at least one primary transmitter/receiver of known position and a plurality of secondary transmitter/receivers of known positions.
    Type: Grant
    Filed: May 5, 1998
    Date of Patent: November 9, 1999
    Assignee: Netmor Ltd.
    Inventors: Moti Itzkovich, Netzer Moriya
  • Patent number: 5334306
    Abstract: A graphite path is formed along the surface of a diamond plate, preferably a CVD diamond plate, by means of a laser or ion-implantation induced conductivity. The path advantageously can be the surface of a sidewall of a via hole drilled by the laser through the plate or a path running along a side surface of the plate from top to bottom opposed major surfaces of the plate. The graphite path is metallized, as by electroplating or electroless plating. In this way, for example, an electrically conducting connection can be made between a metallized backplane located on the bottom surface of the plate and a wire-bonding pad located on the top surface of the plate.
    Type: Grant
    Filed: November 19, 1992
    Date of Patent: August 2, 1994
    Assignee: AT&T Bell Laboratories
    Inventors: William C. Dautremont-Smith, Leonard C. Feldman, Rafael Kalish, Avishay Katz, Barry Miller, Netzer Moriya