Abstract: A near field communication (NFC) reader module is provided for mounting over a metal panel of a vehicle. A housing of the module is configured to mount adjacent the metal panel. The housing contains a planar array of non-magnetic RF filter elements in the housing proximate to the metal panel. The housing contains a planar antenna coil configured to couple with an external NFC device carried by a user, wherein the array of RF filter elements is disposed between the planar antenna coil and the metal panel to magnetically decouple the planar antenna coil from the metal panel. The housing further contains receiver circuitry configured to decode NFC signals from the external NFC device.

Abstract: A near field communication (NFC) reader module is provided for mounting over a metal panel of a vehicle. A housing of the module is configured to mount adjacent the metal panel. The housing contains a planar array of non-magnetic RF filter elements in the housing proximate to the metal panel. The housing contains a planar antenna coil configured to couple with an external NFC device carried by a user, wherein the array of RF filter elements is disposed between the planar antenna coil and the metal panel to magnetically decouple the planar antenna coil from the metal panel. The housing further contains receiver circuitry configured to decode NFC signals from the external NFC device.

Abstract: A power module includes a packaging structure having a pair of side-by-side spaced apart busbars, each connected to a corresponding switch. The power module includes a conductive pad, between and electrically isolated from the busbars and the switches, and configured to, responsive to flow of current through the busbars generated by the switches and resulting in power loop magnetic flux between the busbars, generate magnetic flux that partially cancels the power loop magnetic flux.

Abstract: A power module includes a packaging structure having a pair of side-by-side spaced apart busbars, each connected to a corresponding switch. The power module includes a conductive pad, between and electrically isolated from the busbars and the switches, and configured to, responsive to flow of current through the busbars generated by the switches and resulting in power loop magnetic flux between the busbars, generate magnetic flux that partially cancels the power loop magnetic flux.

Abstract: A wireless power transfer system has a coil assembly including a ferrite pad and a pair of spaced apart inductive coils on the ferrite pad, and a switching network that, in response to an indication of a corresponding inductive coil assembly configuration, controls a direction of current flow through each of the coils to selectively operate the coils in a two-pole mode or a three-pole mode.

Abstract: A power module has upper and lower transistor dies carried by a lead frame assembly. The assembly has a positive DC paddle for the upper die and an AC paddle for the lower die. An upper plate interconnects a second side of the upper die with the AC paddle, and a lower plate interconnects a second side of the lower die with a negative power bar. Current flowing via positive and negative power bars defines a power loop creating a main magnetic flux with a first direction in a central region and a return direction outside the central region. The upper and lower plates have outer edges having respective notches to concentrate respective portions of a return magnetic flux. Each die has a gate pad connected in a gate loop, wherein the gate loops each overlap a respective concentrated return flux thereby enhancing a common source inductance for each transistor.

Abstract: A secondary side wireless power transfer compensation circuit includes a secondary coil, a capacitor in series with the secondary coil, and an inductor in parallel with the secondary coil and capacitor. The inductor has an impedance matching a reflected impedance of a load electrically connected thereacross such that the secondary coil achieves resonance with a primary coil coupled therewith at a predetermined frequency that depends on the impedance.

Abstract: A wireless power transfer system includes a coil assembly including a pair of spaced apart inductive coils positioned on a same side of a ferrite pad, and a switching network. The switching network, in response to an indication of a corresponding inductive coil assembly configuration, selectively operates the coils in a two-pole mode or a three-pole mode.

Abstract: A wireless vehicle charging system includes at least one controller configured to operate an inverter to control a voltage input to a power converter in a vehicle to drive an impedance phase angle at an output of the inverter toward a predetermined angle and achieve a power demand at an output of the vehicle power converter. The at least one controller is further configured to operate the vehicle power converter to achieve the power demand. The at least one controller may control a frequency output of the inverter to adjust the voltage input to the power converter based on a rate of change of an objective function that is configured to reduce an output power error of the power converter and an impedance phase angle error at the output of the inverter.

Abstract: A secondary side wireless power transfer compensation circuit includes a secondary coil, a capacitor in series with the secondary coil, and an inductor in parallel with the secondary coil and capacitor. The inductor has an impedance matching a reflected impedance of a load electrically connected thereacross such that the secondary coil achieves resonance with a primary coil coupled therewith at a predetermined frequency that depends on the impedance.

Abstract: Reliable microstrip routing arrangements for electronics components are described. In an example, a semiconductor apparatus includes a semiconductor die having a surface with an integrated circuit thereon coupled to contact pads of an uppermost metallization layer of a semiconductor package substrate by a plurality of conductive contacts. A plurality of discrete metal planes is disposed at the uppermost metallization layer of the semiconductor package substrate, each metal plane located, from a plan view perspective, at a corner of a perimeter of the semiconductor die. Microstrip routing is disposed at the uppermost metallization layer of the semiconductor package substrate, from the plan view perspective, outside of the perimeter of the semiconductor die.

Abstract: A wireless vehicle charging system includes at least one controller configured to operate an inverter to control a voltage input to a power converter in a vehicle to drive an impedance phase angle at an output of the inverter toward a predetermined angle and achieve a power demand at an output of the vehicle power converter. The at least one controller is further configured to operate the vehicle power converter to achieve the power demand. The at least one controller may control a frequency output of the inverter to adjust the voltage input to the power converter based on a rate of change of an objective function that is configured to reduce an output power error of the power converter and an impedance phase angle error at the output of the inverter.

Abstract: A vehicle includes an inductive charge coupling arrangement that can be electrically connected with a traction battery. The arrangement includes a charge coil and a plurality of permeable panels surrounding the charge coil. The vehicle further includes at least one controller that, in response to an inductive charge request, causes the panels to move to positions selected to minimize electromagnetic field leakage between the charge coil and a charge station.

Abstract: In accordance with one aspect of the present description, a transmission line such as a microstrip or stripline transmission line, has stub-shaped projections adapted to compensate simultaneously for both far-end crosstalk (FEXT) induced by inductive coupling between the transmission line and an adjacent transmission line, and also far-end crosstalk induced by inductive coupling between the vertical electrical interconnect at the far end of the transmission line and an adjacent vertical electrical interconnect electrically connected to the adjacent transmission line. In another aspect of the present description, a microstrip transmission line may have multiple stubby line sections having different resistances and impedances to more gradually transition from to the typically low impedance characteristics of vertical interconnects such as the PTH vias and socket connectors. Other aspects are described.

Abstract: Reliable microstrip routing arrangements for electronics components are described. In an example, a semiconductor apparatus includes a semiconductor die having a surface with an integrated circuit thereon coupled to contact pads of an uppermost metallization layer of a semiconductor package substrate by a plurality of conductive contacts. A plurality of discrete metal planes is disposed at the uppermost metallization layer of the semiconductor package substrate, each metal plane located, from a plan view perspective, at a corner of a perimeter of the semiconductor die. Microstrip routing is disposed at the uppermost metallization layer of the semiconductor package substrate, from the plan view perspective, outside of the perimeter of the semiconductor die.

Abstract: Reliable microstrip routing arrangements for electronics components are described. In an example, a semiconductor apparatus includes a semiconductor die having a surface with an integrated circuit thereon coupled to contact pads of an uppermost metallization layer of a semiconductor package substrate by a plurality of conductive contacts. A plurality of discrete metal planes is disposed at the uppermost metallization layer of the semiconductor package substrate, each metal plane located, from a plan view perspective, at a corner of a perimeter of the semiconductor die. Microstrip routing is disposed at the uppermost metallization layer of the semiconductor package substrate, from the plan view perspective, outside of the perimeter of the semiconductor die.

Abstract: A wireless power transfer system has a coil assembly including a ferrite pad and a pair of spaced apart inductive coils on the ferrite pad, and a switching network that, in response to an indication of a corresponding inductive coil assembly configuration, controls a direction of current flow through each of the coils to selectively operate the coils in a two-pole mode or a three-pole mode.

Abstract: A wireless power transfer system includes a coil assembly including a pair of spaced apart inductive coils positioned on a same side of a ferrite pad, and a switching network. The switching network, in response to an indication of a corresponding inductive coil assembly configuration, selectively operates the coils in a two-pole mode or a three-pole mode.

Abstract: A vehicle includes an inductive charge coupling arrangement that can be electrically connected with a traction battery. The arrangement includes a charge coil and a plurality of permeable panels surrounding the charge coil. The vehicle further includes at least one controller that, in response to an inductive charge request, causes the panels to move to positions selected to minimize electromagnetic field leakage between the charge coil and a charge station.

Abstract: Reliable microstrip routing arrangements for electronics components are described. In an example, a semiconductor apparatus includes a semiconductor die having a surface with an integrated circuit thereon coupled to contact pads of an uppermost metallization layer of a semiconductor package substrate by a plurality of conductive contacts. A plurality of discrete metal planes is disposed at the uppermost metallization layer of the semiconductor package substrate, each metal plane located, from a plan view perspective, at a corner of a perimeter of the semiconductor die. Microstrip routing is disposed at the uppermost metallization layer of the semiconductor package substrate, from the plan view perspective, outside of the perimeter of the semiconductor die.