Patents by Inventor Neyoshi Ishida

Neyoshi Ishida has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20140296394
    Abstract: An adhesive that displays high adhesive strength to polyolefin materials, has a curing rate that is sufficiently fast for practical use, and also displays good adhesive strength to general use materials includes a moisture curing resin composition including a copolymer having a hydrolytic silyl group, the copolymer including a (meth)acrylic acid alkylester monomer unit with an alkyl group having from 1 to 8 carbons and a (meth)acrylic acid alkylester monomer unit with an alkyl group having not less than 10 carbons, and an oxyalkylene polymer having a hydrolytic silyl group; a chlorinated polyolefin; a hydrolytic silane having not less than two phenyl groups as organic groups; and a tackifying resin that has compatibility with the moisture curing resin composition and that is solid at 25° C. wherein a content of the hydrolytic silane is more than 0 parts by mass and not more than 9 parts by mass per 100 parts by mass of the moisture curing resin composition.
    Type: Application
    Filed: October 31, 2012
    Publication date: October 2, 2014
    Inventors: Neyoshi Ishida, Shigenori Ohashi
  • Publication number: 20100035057
    Abstract: To provide a primer for imparting high adhesive property and high heat resistance to the surface of a substrate. The primer composition is constructed to comprise (1) a maleic acid-modified polyolefin, (2) an organic diamine having a number average molecular weight of at least 150, and (3) a solvent.
    Type: Application
    Filed: January 4, 2008
    Publication date: February 11, 2010
    Inventor: Neyoshi Ishida
  • Patent number: D749957
    Type: Grant
    Filed: August 28, 2014
    Date of Patent: February 23, 2016
    Assignee: 3M Innovative Propeties Company
    Inventors: Neyoshi Ishida, Akifumi Asano