Patents by Inventor Ng Hwei

Ng Hwei has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Metal sandwich structure for MIM capacitor onto dual damascene
    Patent number: 6746914
    Abstract: A first and second damascene copper interconnect plug are created over the surface of a substrate. A MIM capacitor, which is aligned with the second damascene copper interconnect plug, is created by a one-time etch of a stack of layers comprising Ta/capacitor dielectric/Ta. Copper interconnects are then created aligned with the MIM capacitor and the second damascene interconnect plug.
    Type: Grant
    Filed: May 7, 2002
    Date of Patent: June 8, 2004
    Assignee: Chartered Semiconductor Manufacturing Ltd.
    Inventors: Shao Kai, Ng Hwei, Sanford Chu