Patents by Inventor Ngai Kin Tsui

Ngai Kin Tsui has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7329617
    Abstract: A method is provided for enhancing adhesion between a molding compound and a semiconductor device comprising a semiconductor chip attached on a carrier, such as a lead frame, by coating the semiconductor device with a polymer primer prior to molding the semiconductor device. Such coating may be performed by dipping, dripping or spraying the semiconductor device in or with a polymer solution.
    Type: Grant
    Filed: December 22, 2004
    Date of Patent: February 12, 2008
    Assignee: ASM Assembly Automation Ltd.
    Inventors: Jianxiong Li, Chi Chuen Chaw, Ngai Kin Tsui, Deming Liu, Yiu Fai Kwan, Wai Chan