Patents by Inventor Ngai Tsang

Ngai Tsang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9161455
    Abstract: A method of fabricating a circuit board is provided. An elastic bump material layer is formed on a substrate and then is patterned to form a plurality of first elastic bumps and a plurality of second elastic bumps, arranged in at least an array. A conductive layer is formed and then is patterned to form a patterned circuit layer to cover first plurality of elastic bumps and a portion of the substrate. An entirety of the plurality of second elastic bumps and another portion of the substrate are not covered by the patterned circuit layer. A protection layer is formed to cover a portion of the patterned circuit layer, a second number of the plurality of second elastic bumps entirely, a third number of the plurality of second elastic bumps partially and the another portion of the substrate, and expose the first number of the plurality of second elastic bumps.
    Type: Grant
    Filed: May 17, 2013
    Date of Patent: October 13, 2015
    Assignees: Taiwan TFT LCD Association, Chunghwa Picture Tubes, LTD., Au Optronics Corporation, Hannstar Display Corporation, Innolux Corporation, Industrial Technology Research Institute
    Inventors: Ngai Tsang, Kuo-Shu Kao
  • Publication number: 20130287935
    Abstract: A method of fabricating a circuit board is provided. An elastic bump material layer is formed on a substrate and then is patterned to form a plurality of first elastic bumps and a plurality of second elastic bumps, arranged in at least an array. A conductive layer is formed and then is patterned to form a patterned circuit layer to cover first plurality of elastic bumps and a portion of the substrate. An entirety of the plurality of second elastic bumps and another portion of the substrate are not covered by the patterned circuit layer. A protection layer is formed to cover a portion of the patterned circuit layer, a second number of the plurality of second elastic bumps entirely, a third number of the plurality of second elastic bumps partially and the another portion of the substrate, and expose the first number of the plurality of second elastic bumps.
    Type: Application
    Filed: May 17, 2013
    Publication date: October 31, 2013
    Applicants: TAIWAN TFT LCD ASSOCIATION, CHUNGHWA PICTURE TUBES, LTD., INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE, HANNSTAR DISPLAY CORPORATION, INNOLUX CORPORATION, AU OPTRONICS CORPORATION
    Inventors: Ngai Tsang, Kuo-Shu Kao
  • Patent number: 8466374
    Abstract: A base of circuit board, a circuit board, and a method of fabricating thereof are provided. The circuit board includes a substrate, a plurality of elastic bumps and a patterned circuit layer. The elastic bumps arranged in at least an array are located on the substrate. The patterned circuit layer is located on a portion of the elastic bumps and a portion of the substrate. The base of the circuit board and the method of fabricating thereof are also included in the present invention.
    Type: Grant
    Filed: June 3, 2009
    Date of Patent: June 18, 2013
    Assignees: Taiwan TFT LCD Association, Chunghwa Picture Tubes, Ltd., Au Optronics Corporation, Hannstar Display Corporation, Chi Mei Optoelectronics Corporation, Industrial Technology Research Institute
    Inventors: Ngai Tsang, Kuo-Shu Kao
  • Patent number: 7932600
    Abstract: An electrical connecting structure including a conductive pad, a polymer bump and a patterned conductive layer is provided. The conductive pad is on a substrate and the polymer bump is disposed over the substrate. The patterned conductive layer is disposed on the polymer bump and electrically connects to the conductive pad, wherein the patterned conductive layer covers a portion of the polymer bump and exposes another portion of the polymer bump.
    Type: Grant
    Filed: May 30, 2008
    Date of Patent: April 26, 2011
    Assignees: Taiwan TFT LCD Association, Chunghwa Picture Tubes, Ltd., Au Optronics Corporation, Hannstar Display Corporation, Chi Mei Optoelectronics Corporation, Industrial Technology Research Institute, TPO Dispalys Corp.
    Inventors: Ngai Tsang, Kuo-Shu Kao
  • Publication number: 20100163281
    Abstract: A base of circuit board, a circuit board, and a method of fabricating thereof are provided. The circuit board includes a substrate, a plurality of elastic bumps and a patterned circuit layer. The elastic bumps arranged in at least an array are located on the substrate. The patterned circuit layer is located on a portion of the elastic bumps and a portion of the substrate. The base of the circuit board and the method of fabricating thereof are also included in the present invention.
    Type: Application
    Filed: June 3, 2009
    Publication date: July 1, 2010
    Applicants: TAIWAN TFT LCD ASSOCIATION, CHUNGHWA PICTURE TUBES, LTD., AU OPTRONICS CORPORATION, HANNSTAR DISPLAY CORPORATION, CHI MEI OPTOELECTRONICS CORPORATION, INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Ngai Tsang, Kuo-Shu Kao
  • Publication number: 20090200686
    Abstract: A electrical connecting structure including a conductive pad, a polymer bump and a patterned conductive layer is provided. The conductive pad is on a substrate and the polymer bump is disposed over the substrate. The patterned conductive layer is disposed on the polymer bump and electrically connects to the conductive pad, wherein the patterned conductive layer covers a portion of the polymer bump and exposes another portion of the polymer bump.
    Type: Application
    Filed: May 30, 2008
    Publication date: August 13, 2009
    Applicants: TAIWAN TFT LCD ASSOCIATION, CHUNGHWA PICTURE TUBES, LTD., AU OPTRONICS CORPORATION, HANNSTAR DISPLAY CORPORATION, CHI MEI OPTOELECTRONICS CORPORATION, INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE, TPO DISPLAYS CORP.
    Inventors: Ngai Tsang, Kuo-Shu Kao
  • Publication number: 20080284011
    Abstract: A bump structure including at least one contact pad, at least one first polymer bump, at least one second polymer bump, and a conductive layer is provided. The contact pad is disposed on a substrate, and the first polymer bump is also disposed on the substrate. The second polymer bump is disposed on the substrate and is connected to the first polymer bump. The conductive layer covers the first polymer bump and electrically connects the contact pad.
    Type: Application
    Filed: August 7, 2007
    Publication date: November 20, 2008
    Applicants: TAIWAN TFT LCD ASSOCIATION, CHUNGHWA PICTURE TUBES, LTD., AU OPTRONICS CORPORATION, HANNSTAR DISPLAY CORPORATION, CHI MEI OPTOELECTRONICS CORPORATION, INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE, TPO DISPLAYS CORP.
    Inventors: Shyh-Ming Chang, Ngai Tsang, Kuo-Shu Kao
  • Patent number: 7449716
    Abstract: A bump structure on a substrate including at least one first electrode, at least one first bump, at least one second bump is provided. The first electrode is disposed on the substrate. The first bump is disposed on the first electrode. The second bump is disposed on the substrate. The height of the second bump is greater than that of the first bump. The elastic bump of the present invention can be used for measuring the bonding process quality.
    Type: Grant
    Filed: June 5, 2007
    Date of Patent: November 11, 2008
    Assignees: Taiwan TFT LCD Association, Chunghwa Picture Tubes, LTD., Au Optronics Corporation, Hannstar Display Corporation, Chi Mei Optoelectronics Corporation, Industrial Technology Research Institute, TPO Displays Corp.
    Inventors: Ming-Yao Chen, Sheng-Shu Yang, Shyh-Ming Chang, Ngai Tsang
  • Publication number: 20080197352
    Abstract: A bump structure on a substrate including at least one first electrode, at least one first bump, at least one second bump is provided. The first electrode is disposed on the substrate. The first bump is disposed on the first electrode. The second bump is disposed on the substrate. The height of the second bump is greater than that of the first bump. The elastic bump of the present invention can be used for measuring the bonding process quality.
    Type: Application
    Filed: June 5, 2007
    Publication date: August 21, 2008
    Applicants: TAIWAN TFT LCD ASSOCIATION, CHUNGHWA PICTURE TUBES, LTD., AU OPTRONICS CORPORATION, HANNSTAR DISPLAY CORPORATION, CHI MEI OPTOELECTRONICS CORPORATION, INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Ming-Yao Chen, Sheng-Shu Yang, Shyh-Ming Chang, Ngai Tsang
  • Publication number: 20060261938
    Abstract: A group of technologies related to RFID reader and tag are described, including: redundant networked multimedia RFID reader, auto-ranging RFID reader, auto-planning RFID reader, smart active antenna RFID reader and novel RFID tags. These enabling technologies bring RFID reader operations into a new level of automation, capability and ease of implementation.
    Type: Application
    Filed: June 16, 2005
    Publication date: November 23, 2006
    Inventors: Kin Lai, On Wong, Tak Wan, Hon Wong, Ngai Tsang, Pak Ma, Ping Ko, Chi Cheung