Patents by Inventor Ngai Tsui

Ngai Tsui has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Coating for enhancing adhesion of molding compound to semiconductor devices
    Publication number: 20060131720
    Abstract: A method is provided for enhancing adhesion between a molding compound and a semiconductor device comprising a semiconductor chip attached on a carrier, such as a lead frame, by coating the semiconductor device with a polymer primer prior to molding the semiconductor device. Such coating may be performed by dipping, dripping or spraying the semiconductor device in or with a polymer solution.
    Type: Application
    Filed: December 22, 2004
    Publication date: June 22, 2006
    Inventors: Jianxiong Li, Chi Chaw, Ngai Tsui, Deming Liu, Yiu Kwan, Wai Chan