Patents by Inventor Ngak Thong Teo

Ngak Thong Teo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device with plated through holes
    Patent number: 9165862
    Abstract: A semiconductor device package such a as Ball Grid Array (BGA), includes a die attached to a substrate. The substrate has a series of plated through holes (PTH) that include a copper pad at each of their ends. The PTH are located in a mold gate region at a corner of the substrate beyond the periphery of the die. Each PTH contains a rivet. The PTH with the pads and rivets stabilize the substrate at the mold gate region, which reduces the possibility of substrate delamination upon degating following an encapsulation process.
    Type: Grant
    Filed: September 5, 2014
    Date of Patent: October 20, 2015
    Assignee: FREESCALE SEMICONDUCTOR, INC.
    Inventors: Boon Yew Low, Ngak Thong Teo