Patents by Inventor Ngeow Khing Chia

Ngeow Khing Chia has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230398040
    Abstract: There is provided a multi-layered sheet mask comprising at least (a) a porous first layer having a first side and a second side, wherein the first side is opposite to the second side, and comprises a plurality of three-dimensional patterns extending therefrom; (b) a second layer attached to the second side of the porous first layer, the second layer comprising at least one pouch for receiving or containing at least one first active ingredient; a porous support structure; an air pouch that is sandwiched between the second side of the porous first layer and the porous support structure; and a plurality of microchannels that extend from the pouch and beyond the first side of the porous first layer when the air pouch is deflated; and (c) a third layer attached to the second layer for receiving or containing at least one second active ingredient.
    Type: Application
    Filed: November 9, 2021
    Publication date: December 14, 2023
    Applicant: NATIONAL UNIVERSITY OF SINGAPORE
    Inventors: Yin Chiang Freddy BOEY, Ngeow Khing CHIA, Tien Guan THNG
  • Publication number: 20230157896
    Abstract: The present invention relates to a device for repair of a region within an ear via a natural orifice, the device comprising a body. The body comprises a first port for visibly identifying the region to be sealed, the region being inside the ear; and a second port through which a seal can be introduced into the ear through the device. The region comprises a perforation of a tympanic membrane of the ear and the device is a speculum. The present invention also relates to method for repairing a perforation in a tympanic membrane using the same device.
    Type: Application
    Filed: March 11, 2021
    Publication date: May 25, 2023
    Applicants: National University of Singapore, Hadasit Medical Research Services And Development Ltd, Yissum Research Development Company of the Hebrew University of Jerusalem Ltd
    Inventors: Menachem Gross, Shlomo Magdassi, Yin Chiang Boey, Ngeow Khing Chia