Abstract: An integrated sensor unit for estimating a quantity of fluid in a container includes a pressure sensor configured to measure a pressure at a physical location of the sensor unit, an acceleration sensor configured to measure at least three components of an acceleration vector at the physical location of the sensor unit, and a temperature sensor configured to measure a temperature at the physical location of the sensor unit. The sensor unit is configured to produce an output signal comprising the pressure, acceleration, and temperature measurements.

Abstract: Apparatus and associated methods relate to generating redundant measurement of pseudo differential pressure using two absolute-pressure sensors, each exposed to a different environment. Each of the two absolute-pressure sensors has complementary first and second output nodes. The first output node has a positive relation with and/or response to increasing pressure, while the second output node has a negative relation with and/or response to increasing pressure. A first difference measurement signal is calculated based on a difference between the positive relation output signals of the first and second absolute-pressure sensors. A second difference measurement signal is calculated based on a difference between the negative relation output signals of the first and second absolute-pressure sensors. Both the first and second difference measurement signals are indicative of a pressure difference between the first and second environments.

Abstract: A system for measuring an electrical current to a heater includes an electrical line between a first power source and the heater, a control sensor adjacent to the electrical line, a compensation sensor proximate the control sensor and an operational amplifier electrically connected to the control sensor and the compensation sensor. The control sensor is a Hall effect sensor to measure a first magnetic field induced by the electrical current and an ambient magnetic field and output a resulting first voltage. The compensation sensor is a Hall effect sensor with the same orientation as the control sensor to measure a second magnetic field induced by the ambient magnetic field and output a resulting second voltage. The operation amplifier is able to receive the first voltage and the second voltage and determine the electrical current flowing through the electrical line.

Abstract: A system for measuring an electrical current to a heater includes an electrical line between a first power source and the heater, a control sensor adjacent to the electrical line, a compensation sensor proximate the control sensor and an operational amplifier electrically connected to the control sensor and the compensation sensor. The control sensor is a Hall effect sensor to measure a first magnetic field induced by the electrical current and an ambient magnetic field and output a resulting first voltage. The compensation sensor is a Hall effect sensor with the same orientation as the control sensor to measure a second magnetic field induced by the ambient magnetic field and output a resulting second voltage. The operation amplifier is able to receive the first voltage and the second voltage and determine the electrical current flowing through the electrical line.

Abstract: An integrated sensor unit for estimating a quantity of fluid in a container includes a pressure sensor configured to measure a pressure at a physical location of the sensor unit, an acceleration sensor configured to measure at least three components of an acceleration vector at the physical location of the sensor unit, and a temperature sensor configured to measure a temperature at the physical location of the sensor unit. The sensor unit is configured to produce an output signal comprising the pressure, acceleration, and temperature measurements.

Abstract: Apparatus and associated methods relate to generating redundant measurement of pseudo differential pressure using two absolute-pressure sensors, each exposed to a different environment. Each of the two absolute-pressure sensors has complementary first and second output nodes. The first output node has a positive relation with and/or response to increasing pressure, while the second output node has a negative relation with and/or response to increasing pressure. A first difference measurement signal is calculated based on a difference between the positive relation output signals of the first and second absolute-pressure sensors. A second difference measurement signal is calculated based on a difference between the negative relation output signals of the first and second absolute-pressure sensors. Both the first and second difference measurement signals are indicative of a pressure difference between the first and second environments.

Abstract: A sensor assembly comprises a remote data concentrator (RDC) and an optically powered transducer module (OPTM). The RDC transmits a first optical pulse including a parameter request signal along an optical fiber. The OPTM is connected to the optical fiber, and comprises a photodiode, an energy storage device, a sensor, a processor, and a laser. The photodiode receives the first optical pulse, and the energy storage device is charged by the photodiode. The sensor, processor, and laser are powered by discharging the energy storage device. The sensor senses a parameter specified by the parameter request signal. The processor generates a signal packet from the output of the first sensor. The laser transmits a second optical pulse including the signal packet along the optical fiber to the RDC.

Abstract: A sensor assembly comprises a remote data concentrator (RDC) and an optically powered transducer module (OPTM). The RDC transmits a first optical pulse including a parameter request signal along an optical fiber. The OPTM is connected to the optical fiber, and comprises a photodiode, an energy storage device, a sensor, a processor, and a laser. The photodiode receives the first optical pulse, and the energy storage device is charged by the photodiode. The sensor, processor, and laser are powered by discharging the energy storage device. The sensor senses a parameter specified by the parameter request signal. The processor generates a signal packet from the output of the first sensor.

Abstract: A microstructure device package includes a package housing configured and adapted to house a microstructure device. A bracket is housed in the package housing. The bracket includes a bracket base with a first bracket arm and a second bracket arm each extending from the bracket base. A channel is defined between the first and second bracket arms. The first bracket aim defines a first mounting surface facing inward with respect to the channel. The second bracket aim defines a second mounting surface facing outward with respect to the channel. The second mounting surface of the bracket is mounted to the package housing. A microstructure device is mounted to the first mounting surface in the channel. The bracket is configured and adapted to isolate the microstructure device from packaging stress imparted from the package housing on the second mounting surface of the bracket.

Abstract: A microstructure device package includes a package housing configured and adapted to house a microstructure device. A bracket is housed in the package housing. The bracket includes a bracket base with a first bracket arm and a second bracket arm each extending from the bracket base. A channel is defined between the first and second bracket arms. The first bracket aim defines a first mounting surface facing inward with respect to the channel. The second bracket aim defines a second mounting surface facing outward with respect to the channel. The second mounting surface of the bracket is mounted to the package housing. A microstructure device is mounted to the first mounting surface in the channel. The bracket is configured and adapted to isolate the microstructure device from packaging stress imparted from the package housing on the second mounting surface of the bracket.

Abstract: An unattached, contained semiconductor device includes a semiconductor die, for example a MEMS pressure sensor die. The semiconductor die is unattached from the interior cavity of a surrounding containment body in that the semiconductor die is free of adherence to the containment body to mitigate packaging stress and strain between the containment body and the semiconductor die.

Abstract: An unattached, contained semiconductor device includes a semiconductor die, for example a MEMS pressure sensor die. The semiconductor die is unattached from the interior cavity of a surrounding containment body in that the semiconductor die is free of adherence to the containment body to mitigate packaging stress and strain between the containment body and the semiconductor die.