Patents by Inventor Nguyen T. Nguyen

Nguyen T. Nguyen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7492598
    Abstract: Methods and apparatus for supporting heatsinks used to cool components of a board are disclosed. According to one aspect of the present invention, a carrier plate assembly that is arranged to be secured over a structure which has a first structure hole and a first component includes a carrier plate and a first heatsink. The carrier plate has a first plate mounting hole and a first opening defined therein. The first plate mounting hole is arranged to be aligned with the first structure hole such that a first axis is defined through the first plate mounting hole and the first structure hole. The first opening is arranged to be positioned over the first component. The first heatsink is positioned such that a first portion of the first heatsink protrudes through the opening and a second portion of the first heatsink is supported on the carrier plate.
    Type: Grant
    Filed: September 20, 2006
    Date of Patent: February 17, 2009
    Assignee: Cisco Technology, Inc.
    Inventors: Susheela Narasimhan, Nguyen T. Nguyen, Saeed Sayed, Mohammad Reza Danesh Kadivar
  • Publication number: 20080068809
    Abstract: Methods and apparatus for supporting heatsinks used to cool components of a board are disclosed. According to one aspect of the present invention, a carrier plate assembly that is arranged to be secured over a structure which has a first structure hole and a first component includes a carrier plate and a first heatsink. The carrier plate has a first plate mounting hole and a first opening defined therein. The first plate mounting hole is arranged to be aligned with the first structure hole such that a first axis is defined through the first plate mounting hole and the first structure hole. The first opening is arranged to be positioned over the first component. The first heatsink is positioned such that a first portion of the first heatsink protrudes through the opening and a second portion of the first heatsink is supported on the carrier plate.
    Type: Application
    Filed: September 20, 2006
    Publication date: March 20, 2008
    Applicant: CISCO TECHNOLOGY, INC.
    Inventors: Susheela Narasimhan, Nguyen T. Nguyen, Saeed Sayed, Mohammad Reza Danesh Kadivar
  • Patent number: 5196712
    Abstract: A printed circuit board apparatus includes a handle which has an extension plate which extends into an optical switch so as to prevent communication between an optical emitter and optical receiver. To remove the printed circuit board apparatus from its associated rack housing, rotation of the handle is first required which moves the plate and which causes the detector to go HIGH and signal to a telecommunications system that the board is soon to be removed so that a graceful switch can be made from that board to a redundant copy thereof. The printed circuit board apparatus further includes a deflectable lever which contacts to ground the rack housing upon inserting the printed circuit board apparatus into its associated rack housing so as to provide electrostatic discharge protection.
    Type: Grant
    Filed: December 20, 1991
    Date of Patent: March 23, 1993
    Assignee: Raynet Corporation
    Inventors: Nguyen T. Nguyen, Sharon Pellerin, Steven P. Saneski