Abstract: A wafer probe system includes a plurality of vertical-parallel probe pins having a spring formed in a center portion thereof to provide a contact force control area. The spring being formed according to a predetermined shape having a known stress-strain profile. In one embodiment, a first spring shape results in a probe tip contact force that is approximately constant after an initial vertical displacement of the probe tip. In an alternate embodiment, a second spring shape formed in the probe pin results in decreasing probe tip contact force with increasing vertical displacement of the probe tip. A canted probe tip end permits creation of an X-Y force component to facilitate penetration of the passivation layer. The canted tip portion also permits non-rotatable alignment of the probe pins in a probe card to thereby prevent contact of one probe pin with another.