Abstract: A display device includes an LCD panel comprising blue color filters, green color filters and red color filters, and a light source for providing light to the LCD panel. The light has a spectrum with first, second and third components. The first component has at least one peak wavelength in a first wavelength range from about 480.1 nm to about 510 nm. The second component has a second wavelength range that is perceived as a green color. The third component has a third wavelength range that is perceived as a red or orange-red color by human eyes. The green color filters are adapted such that they do not transmit the first component of light or transmit a minimal amount of the first component of light so as to prevent a distortion or shift of a CIE coordinate of a filtered green light by the first component of light.

Abstract: Aspects of the invention include a display device including a liquid crystal display (LCD) panel comprising a plurality of blue color filters, a plurality of green color filters, and a plurality of red color filters; and a light source configured to provide light to the LCD panel. The light has a spectrum with a blue component, a green component and a red component. In one embodiment, the blue component has at least one peak wavelength in between 465 nm to 495 nm. In another embodiment, the blue component has an intensity being broadly distributed over a wavelength range of 430 nm to 495 nm. The plurality of green color filters has a transmission cut off wavelength being 480 nm or greater than 480 nm. The plurality of blue color filters has a transmission cut off wavelength being no greater than 500 nm.

Abstract: Aspects of the invention include a display device including a liquid crystal display (LCD) panel comprising a plurality of blue color filters, a plurality of green color filters, and a plurality of red color filters; and a light source configured to provide light to the LCD panel. The light has a spectrum with a blue component, a green component and a red component. In one embodiment, the blue component has at least one peak wavelength in between 465 nm to 495 nm. In another embodiment, the blue component has an intensity being broadly distributed over a wavelength range of 430 nm to 495 nm. The plurality of green color filters has a transmission cut off wavelength being 480 nm or greater than 480 nm. The plurality of blue color filters has a transmission cut off wavelength being no greater than 500 nm.

Abstract: Aspects of the invention include a multi-functional optical unit, panel lighting systems and display systems having the multi-functional optical unit. The multi-functional optical unit formed in a single-layered or multi-layered structure includes primary fillers and assisted fillers. The primary fillers include wavelength conversion materials adapted to function as at least one of mixing light, converting light, and trapping/guiding primary light. The assisted fillers are hybrids of fillers of sizes, shapes, and porosities having elongated shapes, fumed structures, or aspherical shapes for improving light trapping and propagating in an x-y plane direction of the multi-functional optical unit and light scattering/mixing. The multi-functional optical unit has a plurality of microstructures with a cross-section of a triangle, trapezium, trapezoid, square, curved, or rectangular shape to improve angular color uniformity, formed on one of its top and bottom surfaces.

Abstract: A package body for a semiconductor device includes a lead frame, an insulating package, and a reflective coating layer. The lead frame has a first electrode and a second electrode separated from each other. The insulating package provides a housing structure and forming a package cavity therein. The package cavity has a reflective side surface formed by the insulating package. The reflective coating layer partially covers the first electrode and the second electrode and forms a reflective bottom surface of the package cavity. Each of the first electrode and the second electrode may have an angled cut. The insulating package may be made of a binder-filler composite containing white pigments. The package body may be an all diffusive integrated reflecting surfaces (AR-IRS) package body, and may be used in an encapsulant-free semiconductor package.

Abstract: A package body for a semiconductor device includes a lead frame, an insulating package, and a reflective coating layer. The lead frame has a first electrode and a second electrode separated from each other. The insulating package provides a housing structure and forming a package cavity therein. The package cavity has a reflective side surface formed by the insulating package. The reflective coating layer partially covers the first electrode and the second electrode and forms a reflective bottom surface of the package cavity. Each of the first electrode and the second electrode may have an angled cut. The insulating package may be made of a binder-filler composite containing white pigments. The package body may be an all diffusive integrated reflecting surfaces (AR-IRS) package body, and may be used in an encapsulant-free semiconductor package.

Abstract: The present disclosure includes an optical component including one or more microstructures configured to diffuse light incident thereto from within the optical component. The microstructures are provided at least on a light input surface of the optical component provided in a bottom cavity of its body.

Abstract: The present disclosure includes an optical component including one or more microstructures configured to diffuse light incident thereto from within the optical component. The microstructures are provided at least on a light input surface of the optical component provided in a bottom cavity of its body.

Abstract: The present disclosure includes an optical component including one or more textured surfaces configured to diffuse light incident thereto from within the optical component. The optical component includes textured surfaces at least along a top periphery of its body.

Abstract: The present disclosure includes an optical component including one or more textured surfaces configured to diffuse light incident thereto from within the optical component. The optical component includes textured surfaces at least along a top periphery of its body.

Abstract: The present disclosure includes an optical component including one or more microstructures configured to diffuse light incident thereto from within the optical component. The microstructures are provided at least on a light input surface of the optical component provided in a bottom cavity of its body.

Abstract: The disclosure herein provides photon conversion, extraction and distribution structures, devices, and methods for light emitting devices. The structures, devices, and methods described herein can improve the efficiency and/or light distribution of light emitting devices.

Abstract: The disclosure herein provides photon enhancement guiding structures, devices, and methods for light emitting devices. The structures, devices, and methods described herein can improve the efficiency and/or light distribution of light emitting devices.

Abstract: An LED leadframe package with surface tension function to enable the production of LED package with convex lens shape by using dispensing method is disclosed. The LED leadframe package of the invention is a PPA supported package house for LED packaging with metal base, four identical metal electrodes, and PPA plastic to fix the metal electrodes and the heat dissipation base together, four ring-alike structures with a sharp edge and with a tilted inner surface, and three ring-alike grooves formed between sharp edge ring-alike structures.

Abstract: A lamp cover containing phosphor for providing white light emission is disclosed. The lamp cover is comprised of a light-partial-reflective cap structure providing the outer surface of the lamp cover, wherein the light-partial-reflective cap structure is composed of a plurality of light transparent layers and a plurality of vacuum layers that are stacked in an alternating manner from outside to inside, a supporting transparent cap structure providing the inner surface of the lamp cover, and a phosphor mixed structure mechanically supported by the outer surface of the supporting transparent cap structure, wherein the outer surface of the phosphor mixed structure is adjacent to the most inner vacuum layer of the light-partial-reflective cap structure. Once the lamp cover is combined with a phosphor exciting light source, the light-partial-reflective cap structure partially prevents phosphor exciting light from escaping from the lamp cover by using Fresnel reflection.

Abstract: An LED leadframe package with surface tension function to enable the production of LED package with convex lens shape by using dispensing method is disclosed. The LED leadframe package of the invention is a PPA supported package house for LED packaging with metal base, four identical metal electrodes, and PPA plastic to fix the metal electrodes and the heat dissipation base together, four ring-alike structures with a sharp edge and with a tilted inner surface, and three ring-alike grooves formed between sharp edge ring-alike structures.

Abstract: A white light emitting diode (LED) package with multilayered encapsulation structure and the packaging methods are disclosed. The white LED package structure includes metal electrodes, a heat dissipation base, a PPA plastic for fixing the electrodes and the heat dissipation base together, at least one LED die, a die attaching material, gold wires for electrically connecting the LED die to the electrodes, a first type of silicone encapsulant, a second type of silicone encapsulant, and a phosphor containing layer. The invention utilizes a low-refractive index silicone (the second type of silicone encapsulant) to separate the phosphor containing layer away from the first type of silicone, which covers the LED die, to prevent/reduce emitted light going backward and hitting the LED die.

Abstract: An LED lamp cover structure containing luminescent material and its fabrication methods are described. The LED lamp cover is comprised of a first lens cap providing the outer surface of the lamp cover, a second lens cap providing the inner surface of the lamp cover, and an encapsulating layer sandwiched between the lens cap providing the outer surface of the lamp cover and the lens cap providing the inner surface of the lamp cover, which is mixed with luminescent material for wavelength conversion.

Abstract: The present invention discloses a high power light emitting device using a high extraction efficiency photon-guiding structure for producing high-efficiency white light output with large viewing angle and large amount of light emitted from the side surfaces so that they can provide different light patterns for different applications such as street lighting, parking lighting, tunnel lighting, and etc., as they are used with a reflector. The emitter consists of a leadframe package or chip-on-board substrate, plurality of LED chips, silicone encapsulation material containing phosphor materials to convert short wavelength LED-emanated light to longer wavelength of light, a photon-guiding structure that enhances the efficiency of the LED package and provides light output with large viewing angle.

Abstract: An LED lamp cover structure containing luminescent material, its fabrication methods, and an LED package using the LED lamp cover are disclosed. The LED lamp cover is comprised of a first lens cap providing the outer surface of the lamp cover, a second lens cap providing the inner surface of the lamp cover, and an encapsulating layer sandwiched between the first and second lens caps. The lamp cover of the invention covering a color LED package such as blue color can provide white light output.