Patents by Inventor Nguyen Tien Son

Nguyen Tien Son has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7018597
    Abstract: The purpose of the invention is to provide a high resistivity silicon carbide substrate with electrical properties and structural quality suitable for subsequent device manufacturing, such as for example high frequency devices, so that the devices can exhibit stable and linear characteristics and to provide a high resistivity silicon carbide substrate having a low density of structural defects and a substantially controlled uniform radial distribution of its resistivity.
    Type: Grant
    Filed: October 28, 2002
    Date of Patent: March 28, 2006
    Assignee: Norstel AB
    Inventors: Alexandre Ellison, Nguyen Tien Son, Björn Magnusson, Erik Janzén
  • Publication number: 20030079676
    Abstract: The purpose of the invention is to provide a high resistivity silicon carbide substrate with electrical properties and structural quality suitable for subsequent device manufacturing, such as for example high frequency devices, so that the devices can exhibit stable and linear characteristics and to provide a high resistivity silicon carbide substrate having a low density of structural defects and a substantially controlled uniform radial distribution of its resistivity. (FIG. 2).
    Type: Application
    Filed: October 28, 2002
    Publication date: May 1, 2003
    Inventors: Alexandre Ellison, Nguyen Tien Son, Bjorn Magnusson, Erik Janzen