Patents by Inventor Ngwe Cheong
Ngwe Cheong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 6919935Abstract: The invention relates to the formation of arrays of thin film transistors (TFT's) on silicon substrates and the dicing and tiling of such substrates for transfer to a common module body. TFT's activate display electrodes formed adjacent the transistors after the tiles have been transferred.Type: GrantFiled: July 15, 2003Date of Patent: July 19, 2005Assignee: Kopin CorporationInventors: Duy-Phach Vu, Brenda D. Dingle, Jason E. Dingle, Ngwe Cheong
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Publication number: 20040070697Abstract: The invention relates to the formation of arrays of thin film transistors (TFT's) on silicon substrates and the dicing and tiling of such substrates for transfer to a common module body. TFT's activate display electrodes formed adjacent the transistors after the tiles have been transferred.Type: ApplicationFiled: July 15, 2003Publication date: April 15, 2004Applicant: Kopin CorporationInventors: Duy-Phach Vu, Brenda D. Dingle, Jason E. Dingle, Ngwe Cheong
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Patent number: 6627953Abstract: The invention relates to device processing, packaging and interconnects that will yield integrated electronic circuitry of higher density and complexity than can be obtained by using conventional multi-chip modules. Processes include the formation of complex multi-function circuitry on common module substrates using circuit tiles of silicon thin-films which are transferred, interconnected and packaged. Circuit modules using integrated transfer/interconnect processes compatible with extremely high density and complexity provide large-area active-matrix displays with on-board drivers and logic in a complete glass-based modules. Other applications are contemplated, such as, displays, microprocessor and memory devices, and communication circuits with optical input and output.Type: GrantFiled: June 13, 2000Date of Patent: September 30, 2003Assignee: Kopin CorporationInventors: Duy-Phach Vu, Brenda Dingle, Ngwe Cheong
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Patent number: 6593978Abstract: The invention relates to the formation of arrays of thin film transistors (TFT's) on silicon substrates and the dicing and tiling of such substrates for transfer to a common module body. TFT's activate display electrodes formed adjacent the transistors after the tiles have been transferred.Type: GrantFiled: December 16, 1999Date of Patent: July 15, 2003Assignee: Kopin CorporationInventors: Duy-Phach Vu, Brenda D. Dingle, Jason E. Dingle, Ngwe Cheong
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Patent number: 6521940Abstract: The invention relates to device processing, packaging and interconnects that will yield integrated electronic circuitry of higher density and complexity than can be obtained by using conventional multi-chip modules. Processes include the formation of complex multi-function circuitry on common module substrates using circuit tiles of silicon thin-films which are transferred, interconnected and packaged. Circuit modules using integrated transfer/interconnect processes compatible with extremely high density and complexity provide large-area active-matrix displays with on-board drivers and logic in a complete glass-based modules. Other applications are contemplated, such as, displays, microprocessor and memory devices, and communication circuits with optical input and output.Type: GrantFiled: August 30, 2000Date of Patent: February 18, 2003Assignee: Kopin CorporationInventors: Duy-Phach Vu, Brenda Dingle, Ngwe Cheong
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Patent number: 6486929Abstract: The invention relates to the formation of arrays of thin film transistors (TFT's) on silicon substrates and the dicing and tiling of such substrates for transfer to a common module body. TFT's activate display electrodes formed adjacent the transistors after the tiles have been transferred.Type: GrantFiled: May 21, 1998Date of Patent: November 26, 2002Assignee: Kopin CorporationInventors: Duy-Phach Vu, Brenda D. Dingle, Jason E. Dingle, Ngwe Cheong
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Patent number: 6424020Abstract: The invention relates to device processing, packaging and interconnects that will yield integrated electronic circuitry of higher density and complexity than can be obtained by using conventional multi-chip modules. Processes include the formation of complex multi-function circuitry on common module substrates using circuit tiles of silicon thin-films which are transferred, interconnected and packaged. Circuit modules using integrated transfer/interconnect processes compatible with extremely high density and complexity provide large-area active-matrix displays with on-board drivers and logic in a complete glass-based modules. Other applications are contemplated, such as, displays, microprocessor and memory devices, and communication circuits with optical input and output.Type: GrantFiled: December 29, 1997Date of Patent: July 23, 2002Assignee: Kopin CorporationInventors: Duy-Pach Vu, Brenda Dingle, Ngwe Cheong
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Publication number: 20010040644Abstract: The invention relates to the formation of arrays of thin film transistors (TFT's) on silicon substrates and the dicing and tiling of such substrates for transfer to a common module body. TFT's activate display electrodes formed adjacent the transistors after the tiles have been transferred.Type: ApplicationFiled: December 16, 1999Publication date: November 15, 2001Inventors: DUY-PHACH VU, BRENDA D. DINGLE, JASON E. DINGLE, NGWE CHEONG
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Patent number: 6143582Abstract: The invention relates to device processing, packaging and interconnects that will yield integrated electronic circuitry of higher density and complexity than can be obtained by using conventional multi-chip modules. Processes include the formation of complex multi-function circuitry on common module substrates using circuit tiles of silicon thin-films which are transferred, interconnected and packaged. Circuit modules using integrated transfer/interconnect processes compatible with extremely high density and complexity provide large-area active-matrix displays with on-board drivers and logic in a complete glass-based modules. Other applications are contemplated, such as, displays, microprocessor and memory devices, and communication circuits with optical input and output.Type: GrantFiled: February 12, 1999Date of Patent: November 7, 2000Assignee: Kopin CorporationInventors: Duy-Phach Vu, Brenda Dingle, Ngwe Cheong
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Patent number: 5757445Abstract: The invention relates to the formation of arrays of thin film transistors (TFT's) on silicon substrates and the dicing and tiling of such substrates for transfer to a common module body. TFT's activate display electrodes formed adjacent the transistors after the tiles have been transferred.Type: GrantFiled: December 27, 1995Date of Patent: May 26, 1998Assignee: Kopin CorporationInventors: Duy-Phach Vu, Brenda D. Dingle, Jason E. Dingle, Ngwe Cheong
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Patent number: 5702963Abstract: The invention relates to device processing, packaging and interconnects that will yield integrated electronic circuitry of higher density and complexity than can be obtained by using conventional multi-chip modules. Processes include the formation of complex multi-function circuitry on common module substrates Using circuit tiles of silicon thin-films which are transferred, interconnected and packaged. Circuit modules using integrated transfer/interconnect processes compatible with extremely high density and complexity provide large-area active-matrix displays with on-board drivers and logic in a complete glass-based modules. Other applications are contemplated, such as, displays, microprocessor and memory devices, and communication circuits with optical input and output.Type: GrantFiled: November 2, 1994Date of Patent: December 30, 1997Assignee: Kopin CorporationInventors: Duy-Pach Vu, Brenda Dingle, Ngwe Cheong
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Polysilicon transistors formed on an insulation layer which is adjacent to a liquid crystal material
Patent number: 5499124Abstract: The invention relates to the formation of arrays of thin film transistors (TFT's) on silicon substrates and the dicing and tiling of such substrates for transfer to a common module body. TFT's activate display electrodes formed adjacent the transistors after the tiles have been transferred.Type: GrantFiled: May 8, 1995Date of Patent: March 12, 1996Inventors: Duy-Phach Vu, Brenda D. Dingle, Jason E. Dingle, Ngwe Cheong -
Patent number: 5376561Abstract: The invention relates to device processing, packaging and interconnects that will yield integrated electronic circuitry of higher density and complexity than can be obtained by using conventional multi-chip modules. Processes include the formation of complex multi-function circuitry on common module substrates using circuit tiles of silicon thin-films which are transferred, interconnected and packaged. Circuit modules using integrated transfer/interconnect processes compatible with extremely high density and complexity provide large-area active-matrix displays with on-board drivers and logic in a complete glass-based modules. Other applications are contemplated, such as, displays, microprocessor and memory devices, and communication circuits with optical input and output.Type: GrantFiled: April 24, 1992Date of Patent: December 27, 1994Assignee: Kopin CorporationInventors: Duv-Pach Vu, Brenda Dingle, Ngwe Cheong
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Patent number: 5377031Abstract: The invention relates to the formation of arrays of thin film transistors (TFT's) on silicon substrates and the dicing and tiling of such substrates for transfer to a common module body. TFT's activate display electrodes formed adjacent the transistors after the tiles have been transferred. The invention can be used in a liquid crystal display and may include one or more light shielding layers.Type: GrantFiled: August 18, 1993Date of Patent: December 27, 1994Assignee: Kopin CorporationInventors: Duy-Phach Vu, Brenda D. Dingle, Jason E. Dingle, Ngwe Cheong
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Patent number: 5256562Abstract: The invention relates to the formation of arrays of thin film transistors (TFT's) on silicon substrates and the dicing and tiling of such substrates for transfer to a common module body.Type: GrantFiled: November 4, 1992Date of Patent: October 26, 1993Assignee: Kopin CorporationInventors: Duy-Phach Vu, Brenda D. Dingle, Jason E. Dingle, Ngwe Cheong