Patents by Inventor Nhi Doan

Nhi Doan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Devices with three-dimensional structures and support elements to increase adhesion to substrates
    Patent number: 11276658
    Abstract: Methods of forming supports for 3D structures on semiconductor structures comprise forming the supports from photodefinable materials by deposition, selective exposure and curing. Semiconductor dice including 3D structures having associated supports, and semiconductor devices are also disclosed.
    Type: Grant
    Filed: August 6, 2020
    Date of Patent: March 15, 2022
    Assignee: Micron Technology, Inc.
    Inventors: Christopher J. Gambee, Nhi Doan, Chandra S. Tiwari, Owen R. Fay, Ying Chen
  • DEVICES THREE-DIMENSIONAL STRUCTURES TO SUBSTRATES
    Publication number: 20200365542
    Abstract: Methods of forming supports for 3D structures on semiconductor structures comprise forming the supports from photodefinable materials by deposition, selective exposure and curing. Semiconductor dice including 3D structures having associated supports, and semiconductor devices are also disclosed.
    Type: Application
    Filed: August 6, 2020
    Publication date: November 19, 2020
    Applicant: Micron Technology, Inc.
    Inventors: Christopher J. Gambee, Nhi Doan, Chandra S. Tiwari, Owen R. Fay, Ying Chen
  • Methods for enhancing adhesion of three-dimensional structures to substrates
    Patent number: 10790251
    Abstract: Methods of forming supports for 3D structures on semiconductor structures comprise forming the supports from photodefinable materials by deposition, selective exposure and curing. Semiconductor dice including 3D structures having associated supports, and semiconductor devices are also disclosed.
    Type: Grant
    Filed: June 20, 2018
    Date of Patent: September 29, 2020
    Assignee: Micron Technology, Inc.
    Inventors: Christopher J. Gambee, Nhi Doan, Chandra S. Tiwari, Owen R. Fay, Ying Chen
  • METHODS FOR ENHANCING ADHESION OF THREE-DIMENIONAL STRUCTURES TO SUBSTRATES, AND RELATED ASSEMBLIES AND SYSTEMS
    Publication number: 20190393176
    Abstract: Methods of forming supports for 3D structures on semiconductor structures comprise forming the supports from photodefinable materials by deposition, selective exposure and curing. Semiconductor dice including 3D structures having associated supports, and semiconductor devices are also disclosed.
    Type: Application
    Filed: June 20, 2018
    Publication date: December 26, 2019
    Inventors: Christopher J. Gambee, Nhi Doan, Chandra S. Tiwari, Owen R. Fay, Ying Chen