Patents by Inventor Nian Liu

Nian Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240145730
    Abstract: An exemplary embodiment of the present disclosure provides an electrochemical device comprising a tube having an outer surface defining an interior volume of the tube; a first hollow fiber positioned in the interior volume of the tube, the first hollow fiber comprising: a first membrane defining an interior volume of the first hollow fiber; one or more first electrodes positioned in the interior volume of the first hollow fiber; and at least a first portion of a first electrolyte fluid positioned in the interior volume of the first hollow fiber; one or more second electrodes positioned in the interior volume of the tube and outside of the interior volume of the first hollow fiber; and a second electrolyte fluid positioned in the interior volume of the tube and outside of the interior volume of the first hollow fiber. Also disclosed herein are methods of making an electrochemical device.
    Type: Application
    Filed: October 14, 2020
    Publication date: May 2, 2024
    Inventors: Nian Liu, Yutong Wu
  • Patent number: 11973101
    Abstract: An image-sensor device is provided. The image-sensor device includes a semiconductor substrate and a radiation-sensing region in the semiconductor substrate. The image-sensor device also includes a doped isolation region in the semiconductor substrate and a dielectric film extending into the doped isolation region from a surface of the semiconductor substrate. A portion of the doped isolation region is between the dielectric film and the radiation-sensing region.
    Type: Grant
    Filed: May 23, 2022
    Date of Patent: April 30, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Jeng-Shyan Lin, Dun-Nian Yaung, Jen-Cheng Liu, Feng-Chi Hung
  • Publication number: 20240131612
    Abstract: Disclosed are a special tooling and method for electron beam welding of a cavity body and a beam tube of a superconducting niobium cavity. The special tooling includes a first clamping device for fixing a flange and a second clamping device for fixing a semi-cavity body, wherein the first clamping device and the second clamping device are fixedly connected. A pressing ring of the first clamping device is disposed around a beam tube of a superconducting niobium cavity and cooperates with a base plate to clamp and fix the flange. The second clamping device includes clamping arms evenly distributed along a circumference of the semi-cavity body, and each clamping arm includes a second pressing plate axially disposed along the beam tube and a pressing block that is disposed on an end portion of the second pressing plate and fixes an edge of the semi-cavity body.
    Type: Application
    Filed: October 18, 2023
    Publication date: April 25, 2024
    Inventors: Jianguo Ma, Wei Wen, Zhihong Liu, Jia Tao, Zhenfei Liu, Liming Peng, Nian Liu, Jiefeng Wu
  • Publication number: 20240115713
    Abstract: Disclosed are a polyethylene glycol conjugate drug, and a preparation method therefor and the use thereof. Specifically, the present invention relates to a polyethylene glycol conjugate drug represented by formula A or a pharmaceutically acceptable salt thereof, a method for preparing the polyethylene glycol conjugate drug or the pharmaceutically acceptable salt thereof, an intermediate for preparing the polyethylene glycol conjugate drug or the pharmaceutically acceptable salt thereof, a pharmaceutical composition comprising the polyethylene glycol conjugate drug or the pharmaceutically acceptable salt thereof, and the use of the polyethylene glycol conjugate drug or the pharmaceutically acceptable salt thereof in the preparation of a drug.
    Type: Application
    Filed: July 21, 2021
    Publication date: April 11, 2024
    Inventors: Gaoquan LI, Nian LIU, Yongchen PENG, Xiafan ZENG, Gang MEI, Sheng GUAN, Yang GAO, Shuai YANG, Yifeng YIN, Jie LOU, Huiyu CHEN, Kun QIAN, Yusong WEI, Qian ZHANG, Dajun LI, Xiaoling DING, Xiangwei YANG, Liqun HUANG, Xi LIU, Liwei LIU, Zhenwei LI, Kaixiong HU, Hua LIU, Tao TU
  • Patent number: 11955428
    Abstract: A semiconductor structure includes a substrate, a conductive via and a first insulation layer. The conductive via is through the substrate. The first insulation layer is between the substrate and the conductive via. A first surface of the first insulation layer facing the substrate and a second surface of the first insulation layer facing the conductive via are extended along different directions.
    Type: Grant
    Filed: February 6, 2021
    Date of Patent: April 9, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Hsin-Hung Chen, Min-Feng Kao, Hsing-Chih Lin, Jen-Cheng Liu, Dun-Nian Yaung
  • Publication number: 20240102256
    Abstract: A foldable windproof unit, a large-span windproof net structure thereof, and a windproof method are disclosed. The foldable windproof unit comprises a flexible windproof net, towers arranged at intervals, and a load-bearing rope erected on the two towers. The tower on one side is provided with a horizontal pulley assembly, and the tower on the other side is provided with two vertical pulleys. The top edge of the flexible windproof net is slidably connected to the load-bearing rope by means of a plurality of hanging structures. The foldable windproof unit further comprises a traction rope, the traction rope is arranged on the horizontal pulley assembly in a sleeving manner, and the two free ends of the traction rope extend to respectively bypass the two vertical pulleys and are connected to winding mechanism. The hanging structure close to the tower on one side is fixedly connected to the traction rope.
    Type: Application
    Filed: November 29, 2022
    Publication date: March 28, 2024
    Applicant: SHIJIAZHUANG TIEDAO UNIVERSITY
    Inventors: Qingkuan LIU, Xiaobing CHAI, Yifei SUN, Zhen LI, Xi WANG, Nian LIU, Yangxue WANG, Xing CHANG, Saifei FU
  • Patent number: 11942368
    Abstract: Methods and devices of having an enclosure structure formed in a multi-layer interconnect and a through-silicon-via (TSV) extending through the enclosure structure. In some implementations, a protection layer is formed between the enclosure structure and the TSV.
    Type: Grant
    Filed: September 2, 2021
    Date of Patent: March 26, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Min-Feng Kao, Hsing-Chih Lin, Jen-Cheng Liu, Dun-Nian Yaung
  • Publication number: 20240097121
    Abstract: The present invention relates to a negative electrode material comprising a hydrogen storage alloy and a coating layer on a surface of the hydrogen storage alloy. Based on the mass of the negative electrode active material, a content of the coating layer is no less than 2 wt %. The coating layer comprises a component shown by a general formula LnFx, wherein Ln is one element selected from the group consisting of La, Ce, Pr, Nd, Pm, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, Lu, Y, and Sc. The present invention also relates to a preparation method for the above-described negative electrode material. The present invention also relates to a nickel-metal hydride secondary battery using this negative electrode material.
    Type: Application
    Filed: October 11, 2022
    Publication date: March 21, 2024
    Inventors: Jean NEI, Zhitao CHEN, Nian LIU, Mingde WANG, Shuang ZHANG
  • Publication number: 20240096784
    Abstract: Some embodiments of the present disclosure relate to an integrated chip including an extended via that spans a combined height of a wire and a via and that has a smaller footprint than the wire. The extended via may replace a wire and an adjoining via at locations where the sizing and the spacing of the wire are reaching lower limits. Because the extended via has a smaller footprint than the wire, replacing the wire and the adjoining via with the extended via relaxes spacing and allows the size of the pixel to be further reduced. The extended via finds application for capacitor arrays used for pixel circuits.
    Type: Application
    Filed: January 3, 2023
    Publication date: March 21, 2024
    Inventors: Meng-Hsien Lin, Hsing-Chih Lin, Ming-Tsong Wang, Min-Feng Kao, Kuan-Hua Lin, Jen-Cheng Liu, Dun-Nian Yaung, Ko Chun Liu
  • Patent number: 11924255
    Abstract: This application discloses data transmission that includes: dividing to-be-transmitted content into a plurality of data units at a session layer; transmitting the data units to the target terminal device by using a first transmission channel as a responsible channel of the to-be-transmitted content; distributing, by the session layer in a case that the session layer switches the responsible channel of the to-be-transmitted content from the first transmission channel to a second transmission channel with a different transmission protocol, the data units to the second transmission channel; and transmitting the data units distributed by the session layer to the target terminal device through the second transmission channel. In data transmission in this application, the session layer controls switching of the channels and distribution of the data units, so that the transmission sequence is free from constraints of protocols and the degree of freedom in data transmission is increased.
    Type: Grant
    Filed: April 27, 2023
    Date of Patent: March 5, 2024
    Assignee: Tencent Technology (Shenzhen) Company Limited
    Inventors: Rui Han, Honghao Liu, Jianjun Xiao, Fucai Zhang, Nian Wen
  • Patent number: 11923397
    Abstract: The present invention discloses a micro light emitting diode display substrate and a manufacturing method thereof. The substrate includes an underlay substrate, a thin film transistor and a micro light emitting diode disposed on a top surface of the underlay substrate and connected to each other, a first metal film layer disposed on a bottom surface of the underlay substrate and at least formed with fanout circuit pattern and a side printed bonding pad. The fanout circuit pattern is connected to the side printed bonding pad, the side printed bonding pad is connected to the thin film transistor through a side wire such that after the display substrate is assembled with a bezel, a top surface display pixel region can maximally approach the bezel, to achieve bezel-less effect.
    Type: Grant
    Filed: October 20, 2020
    Date of Patent: March 5, 2024
    Assignee: SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD.
    Inventors: Macai Lu, Yong Fan, Minggang Liu, Nian Liu, Jiangbo Yao
  • Patent number: 11915977
    Abstract: A stacked integrated circuit (IC) device and a method are disclosed. The stacked IC device includes a first semiconductor element. The first substrate includes a dielectric block in the first substrate; and a plurality of first conductive features formed in first inter-metal dielectric layers over the first substrate. The stacked IC device also includes a second semiconductor element bonded on the first semiconductor element. The second semiconductor element includes a second substrate and a plurality of second conductive features formed in second inter-metal dielectric layers over the second substrate. The stacked IC device also includes a conductive deep-interconnection-plug coupled between the first conductive features and the second conductive features. The conductive deep-interconnection-plug is isolated by dielectric block, the first inter-metal-dielectric layers and the second inter-metal-dielectric layers.
    Type: Grant
    Filed: April 12, 2021
    Date of Patent: February 27, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Shu-Ting Tsai, Jeng-Shyan Lin, Dun-Nian Yaung, Jen-Cheng Liu, Feng-Chi Hung, Chih-Hui Huang, Sheng-Chau Chen, Shih Pei Chou, Chia-Chieh Lin
  • Publication number: 20240047537
    Abstract: A thin-film transistor (TFT), a display panel, and a manufacturing method of the display panel are provided. The TFT includes: a gate, a gate insulating layer, an active layer, a first electrode, an interlayer insulating layer, and a second electrode. The interlayer insulating layer is disposed between the first electrode and the active layer. A first via is defined on the interlayer insulating layer. The active layer is connected to the first electrode by the first via. A thickness of the interlayer insulating layer is greater than a thickness of the gate insulating layer. The second electrode is connected to the active layer.
    Type: Application
    Filed: September 29, 2021
    Publication date: February 8, 2024
    Applicant: TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
    Inventors: Macai Lu, Minggang Liu, Nian Liu
  • Publication number: 20240036230
    Abstract: A method of millimeter-wave human body security checking based on double standing postures is provided, including: scanning and checking a body of a checked person in a first standing posture by using a millimeter-wave human body security detector, so as to obtain a first millimeter-wave human body image; scanning and checking the body of the same checked person in a second standing posture by using the millimeter-wave human body security detector, so as to obtain a second millimeter-wave human body image, wherein the second standing posture is different from the first standing posture (S10); and determining whether the checked person carries contraband based on at least the first millimeter-wave human body image and the second millimeter-wave human body image (S20).
    Type: Application
    Filed: September 18, 2021
    Publication date: February 1, 2024
    Inventors: Yingkang JIN, Pu WANG, Zheng LI, Mengjiao ZHAO, Jiao LONG, Nian LIU, Zhimin ZHENG
  • Publication number: 20240030223
    Abstract: The present invention relates to a display panel and an electronic display device. A first source of a driving thin film transistor extends and covers a first gate layer, the first source is used to block water vapor, thus to prevent water vapor intrusion from reducing weather resistance of the driving thin film transistor, to improve a service life of the driving thin film transistor, and to prevent a degradation or a failure of display qualities caused by a decline during use of the driving thin film transistor, and to improve display stability of the display panel.
    Type: Application
    Filed: September 26, 2021
    Publication date: January 25, 2024
    Applicant: TCL China Star Optoelectronics Technology Co., Ltd.
    Inventors: Macai LU, Nian LIU
  • Patent number: 11831505
    Abstract: A method and a system of hybrid data-and-model-driven hierarchical network reconfiguration are provided. Taking into account that the optimal operation structure of the power grid may change after a new energy is connected into the power grid in the distribution manner, this method combines the mathematical model of network reconfiguration and clustering with the deep learning model, and uses data recorded by the smart meter, to reconfigure the network in a hybrid data-and-model driving mode. This method proposes a network compression method and a hierarchical decompression method based on deep learning, and improves the efficiency of network reconfiguration by the way of distributed calculation and combination of on-line and off-line calculation.
    Type: Grant
    Filed: July 2, 2021
    Date of Patent: November 28, 2023
    Assignee: North China Electric Power University
    Inventors: Nian Liu, Liudong Chen, Chenchen Li
  • Publication number: 20230362882
    Abstract: Provided is a call response method in the field of terminal technology. The call response method includes receiving a first call indication message and a second call indication message sent by a network device, determining a target state of the terminal device, and responding to the first call indication message or the second call indication message according to the target state to perform the PS call or the CS call.
    Type: Application
    Filed: August 25, 2022
    Publication date: November 9, 2023
    Applicants: SHENZHEN XIAOMI COMMUNICATION TECHNOLOGY co., LTD., BEIJING XIAOMI MOBILE SOFTWARE co., LTD.
    Inventors: Zhi LUO, Cheng WU, Nian LIU, Dexiang JIANG
  • Publication number: 20230348671
    Abstract: A polyethylene glycol conjugate drug synergist, a preparation method therefor, and use thereof, specifically relating to a polyethylene glycol conjugate drug synergist as shown in formula I or a pharmaceutically acceptable salt thereof, a preparation method for the polyethylene glycol conjugate drug synergist or the pharmaceutically acceptable salt thereof, an intermediate for preparing the polyethylent glycol conjugate drug synergist or the pharmaceutically acceptable salt thereof, a composition containing the polyethylene glycol conjugate drug synergist or the pharmaceutically acceptable salt thereof, and use of the polyethylene glycol conjugate drug synergist or the pharmaceutically acceptable salt thereof in preparation of a drug.
    Type: Application
    Filed: July 21, 2021
    Publication date: November 2, 2023
    Inventors: Gaoquan LI, Nian LIU, Xiafan ZENG, Yongchen PENG, Gang MEI, Shuai YANG, Yang GAO, Sheng GUAN, Yifeng YIN, Huiyu CHEN, Jie LOU, Kun QIAN, Xiangwei YANG, Liwei LIU, Zhenwei LI, Kaixiong HU, Hua LIU, Qian ZHANG, Dajun LI, Yusong WEI, Xiaoling DING, Xi LIU, Liqun HUANG, Tao TU
  • Publication number: 20230301792
    Abstract: The present invention discloses a zonal trabecular uni-compartmental tibial plateau containing zirconium-niobium alloy on oxidation layer and preparation method, including following steps: using zirconium niobium alloy powder as raw material, conducting a 3D printing for one-piece molding to obtain an intermediate product of the uni-compartmental tibial plateau, performing hot isostatic pressing and cryogenic oxidation to obtain the uni-compartmental tibial plateau; the lower surface of the semi-tibial plateau support and the surface of the keel plate are both provided with a bone trabeculae; the zonal trabecular uni-compartmental tibial plateau adopts the structure of arranging step distributed bone trabeculaes which can reduce the fretting wear of the interface between the prosthesis and the bone, and reduce the stress shielding effect of the prosthesis on the bone tissue, homogenize the stress of the tibial plateau bone tissue, and improve the initial stability and long-term stability of the uni-compartmen
    Type: Application
    Filed: June 21, 2021
    Publication date: September 28, 2023
    Inventors: Nian LIU, Li LI, Xiankang WANG, Yu CAO, You YANG, Hongxiu ZHOU
  • Publication number: 20230248525
    Abstract: The present invention discloses the zonal trabecular femoral condylar component containing zirconium-niobium alloy on oxidation layer and its preparation method. The preparation method is as follows: using zirconium-niobium alloy powder as a raw material, conducting a 3D printing for one-piece molding, and obtaining intermediate products of the zonal trabecular femoral condylar component containing zirconium-niobium alloy on oxidation layer, after Sinter-HIP, cryogenic cooling and surface oxidation, the zonal trabecular femoral condylar component containing zirconium-niobium alloy on oxidation layer is prepared. Partial of the zonal trabecular femoral condylar component containing zirconium-niobium alloy on oxidation layer is provided with Zonal trabecula.
    Type: Application
    Filed: June 21, 2021
    Publication date: August 10, 2023
    Inventors: Lu LIU, Chaosheng ZHAO, Fang YIN, Hongxiu ZHOU, Nian LIU