Patents by Inventor Nianci WANG

Nianci WANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • QUANTUM CHIP AND FABRICATION METHOD THEREFOR
    Publication number: 20230276719
    Abstract: Disclosed are a quantum chip and a fabrication method therefor. The quantum chip includes a base substrate on which signal transmission lines are formed; and at least one insulating substrate located on the base substrate, where a qubit and a through hole penetrating through the insulating substrate are formed on the insulating substrate, a metal piece is formed in the through hole, and two ends of the metal piece are electrically connected to the signal transmission lines and the qubit, respectively.
    Type: Application
    Filed: April 27, 2023
    Publication date: August 31, 2023
    Applicant: ORIGIN QUANTUM COMPUTING TECHNOLOGY CO., LTD.
    Inventors: Liangliang MA, Wenshu LIU, Jie ZHENG, Nianci WANG, Bing YOU