Patents by Inventor Nic Rossi

Nic Rossi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Systems and Methods of Tamper Proof Packaging of a Semiconductor Device
    Publication number: 20100213590
    Abstract: A barrier layer can be attached in a semiconductor package to one or more sensitive devices. The barrier layer can be used to obstruct tampering by a malicious agent attempting to access sensitive information on the sensitive device. The barrier layer can cause the sensitive device to become inoperable if physically tampered. Additional other aspects of the protective packaging provide protection against x-ray and thermal probing as well as chemical and electrical tampering attempts.
    Type: Application
    Filed: February 25, 2010
    Publication date: August 26, 2010
    Applicant: CONEXANT SYSTEMS, INC.
    Inventors: Robert W. Warren, Hyun Jung Lee, Nic Rossi