Abstract: Process for forming a polymeric layer on a substrate comprises placing a substrate to be coated in a mold having a removable lid, injecting a liquid monomer into the mold and into contact with the surface of the substrate to be coated, holding the substrate in place in said mold prior to curing said monomer, radiation curing the liquid monomer, releasing the hold on said substrate prior to significant shrinkage of the curing liquid monomer, and venting said mold to atmospheric pressure at the portion of the mold remote from the surface of the substrate being coated and prior to significant shrinkage of said liquid monomer whereby the substrate moves toward the removable lid. Thereafter, the substrate, which now has a polymeric layer affixed thereto, is removed from the mold.

Abstract: A polymer coated information storage device, such as a disc, is disclosed. A coating composition for preparing such polymeric coating comprises certain esters of beta-acryloxypropionic acid with certain diacrylates. The coating composition also comprises under certain circumstances, a photoinitiator.

Abstract: Process for forming an optically transparent polymeric protective layer for an information disc. The disc is placed in a stationary horizontal position and a liquid radiation curable coating is applied to the surface of the disc from an applicator disposed above the disc. Coating of the disc is accomplished by equally spaced sequential movement of an applicator which is on a plane parallel to the surface of the stationary disc. The liquid coating is then allowed to spread evenly across the disc surface and is thereafter cured by means of radiation.

Abstract: There are disclosed radiation curable compositions containing (a) about 5-95% by weight of at least one .beta.-cyanoethoxyalkyl acrylate, (b) about 1-90% by weight of a photopolymerizable acrylated polymer or oil, and (c) from 0 to about 5% by weight of a photoinitiator. The compositions are useful in providing 100% solids coatings and adhesive compositions which are capable upon exposure to radiation, and which are useful in a variety of applications such as for coating textiles and fabrics, for producing pressure sensitive adhesives, and for producing laminating adhesives.

Abstract: The present invention relates to an improved transfer molding method for encapsulating semiconductor, electrical and optical devices with epoxy or other thermoset resins wherein liner film is provided over the surfaces of the package cavities, runners, and pot prior to inserting the preform tablet in the pot and the devices in the package cavities.