Patents by Inventor Nicholas A. Soos

Nicholas A. Soos has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Removal of coating from periphery of a semiconductor wafer
    Patent number: 4510176
    Abstract: The specification describes techniques for removing the edge bead region from a coated semiconductor wafer by directing a jet of solvent at the wafer periphery while the wafer is spinning. The flow patterns of debris resulting from this removal are controlled to prevent contamination of the chip sites on the wafer.
    Type: Grant
    Filed: September 26, 1983
    Date of Patent: April 9, 1985
    Assignee: AT&T Bell Laboratories
    Inventors: John D. Cuthbert, Nicholas A. Soos
  • Encapsulation of circuits
    Patent number: 4163072
    Abstract: Disclosed is a technique for the protection of micro-electronic circuits. A room temperature vulcanizing silicone rubber is applied over the circuit. While the rubber is in an uncured state, a solvent-resistant cover coating is applied thereon. The resulting structure is then treated so that both layers cure simultaneously. The resulting dual layer provides protection against contaminants and solvents used in the circuit fabrication. In addition, mechanical protection is provided for crossovers and circuit chips.
    Type: Grant
    Filed: June 7, 1977
    Date of Patent: July 31, 1979
    Assignee: Bell Telephone Laboratories, Incorporated
    Inventor: Nicholas A. Soos