Patents by Inventor Nicholas A. Stacey

Nicholas A. Stacey has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • STRESS MITIGATION ARCHITECTURES FOR GLASS CORE SUBSTRATES
    Publication number: 20250112140
    Abstract: Embodiments disclosed herein include package substrates with a glass core. In an embodiment, an apparatus comprises a core with a first width, and the core comprises a glass layer. In an embodiment, a via is provided through a thickness of the core, where the via is electrically conductive. In an embodiment, a first layer is provided over the core, where the first layer comprises a second width that is smaller than the first width. In an embodiment, a second layer is provided under the core, where the second layer comprises a third width that is smaller than the first width.
    Type: Application
    Filed: September 28, 2023
    Publication date: April 3, 2025
    Inventors: Rahul BHURE, Mitchell PAGE, Joseph PEOPLES, Jieying KONG, Nicholas S. HAEHN, Astitva TRIPATHI, Bainye Francoise ANGOUA, Yosef KORNBLUTH, Daniel ROSALES-YEOMANS, Joshua STACEY, Aaditya Anand CANDADAI, Yonggang Yong LI, Tchefor NDUKUM, Scott COATNEY, Gang DUAN, Jesse JONES, Srinivas Venkata Ramanuja PIETAMBARAM, Dilan SENEVIRATNE, Matthew ANDERSON
  • GLASS CORE PROTECTION USING PERIPHERAL BUFFER LAYERS
    Publication number: 20250112136
    Abstract: Embodiments disclosed herein include apparatuses with glass core package substrates. In an embodiment, an apparatus comprises a substrate with a first surface and a second surface opposite from the first surface. A sidewall is between the first surface and the second surface, and the substrate comprises a glass layer. In an embodiment, a via is provided through the substrate between the first surface and the second surface, and the via is electrically conductive. In an embodiment, a layer in contact with the sidewall of the substrate surrounds a perimeter of the substrate.
    Type: Application
    Filed: September 29, 2023
    Publication date: April 3, 2025
    Inventors: Bohan SHAN, Jesse JONES, Zhixin XIE, Bai NIE, Shaojiang CHEN, Joshua STACEY, Mitchell PAGE, Brandon C. MARIN, Jeremy D. ECTON, Nicholas S. HAEHN, Astitva TRIPATHI, Yuqin LI, Edvin CETEGEN, Jason M. GAMBA, Jacob VEHONSKY, Jianyong MO, Makoyi WATSON, Shripad GOKHALE, Mine KAYA, Kartik SRINIVASAN, Haobo CHEN, Ziyin LIN, Kyle ARRINGTON, Jose WAIMIN, Ryan CARRAZZONE, Hongxia FENG, Srinivas Venkata Ramanuja PIETAMBARAM, Gang DUAN, Dingying David XU, Hiroki TANAKA, Ashay DANI, Praveen SREERAMAGIRI, Yi LI, Ibrahim EL KHATIB, Aaron GARELICK, Robin MCREE, Hassan AJAMI, Yekan WANG, Andrew JIMENEZ, Jung Kyu HAN, Hanyu SONG, Yonggang Yong LI, Mahdi MOHAMMADIGHALENI, Whitney BRYKS, Shuqi LAI, Jieying KONG, Thomas HEATON, Dilan SENEVIRATNE, Yiqun BAI, Bin MU, Mohit GUPTA, Xiaoying GUO
  • THROUGH-GLASS VIA LINERS FOR INTEGRATED CIRCUIT DEVICE PACKAGES
    Publication number: 20250112163
    Abstract: An IC die package includes a substrate comprising glass and a plurality of holes extending through the glass. A via metallization is present within the holes. A liner is between the via metallization and the glass. The liner can comprise a beta-titanium alloy layer, polymer hydrogel layer and an MXene seed layer, an organic material layer and a metal layer, or an organic material layer between first and second metal layers. A polymer layer may be formed by electrodeposition of charged nanoparticles.
    Type: Application
    Filed: September 29, 2023
    Publication date: April 3, 2025
    Applicant: Intel Corporation
    Inventors: Pratyush Mishra, Pratyasha Mohapatra, Srinivas Pietambaram, Whitney Bryks, Mahdi Mohammadighaleni, Joshua Stacey, Travis Palmer, Yosef Kornbluth, Kuang Liu, Astitva Tripathi, Yuqin Li, Rengarajan Shanmugam, Xing Sun, Brian Balch, Darko Grujicic, Jieying Kong, Nicholas Haehn, Jacob Vehonsky, Mitchell Page, Vincent Obiozo Eze, Daniel Wandera, Sameer Paital, Gang Duan
  • MICROELECTRONIC ASSEMBLIES WITH EDGE STRESS REDUCTION IN GLASS CORES
    Publication number: 20250112175
    Abstract: Various techniques for edge stress reduction in glass cores and related devices and methods are disclosed. In one example, a microelectronic assembly includes a glass core having a bottom surface, a top surface opposite the bottom surface, and one or more sidewalls extending between the bottom surface and the top surface, and further includes a panel of an organic material, wherein the glass core is embedded within the panel. In another example, a microelectronic assembly includes a glass core as in the first example, where an angle between a portion of an individual sidewall and one of the bottom surface or the top surface is greater than 90 degrees. In yet another example, a microelectronic assembly includes a glass core as in the first example, and further includes a pattern of a material on one of the one or more sidewalls.
    Type: Application
    Filed: September 29, 2023
    Publication date: April 3, 2025
    Applicant: Intel Corporation
    Inventors: Brandon C. Marin, Jesse C. Jones, Yosef Kornbluth, Mitchell Page, Soham Agarwal, Fanyi Zhu, Shuren Qu, Hanyu Song, Srinivas V. Pietambaram, Yonggang Li, Bai Nie, Nicholas Haehn, Astitva Tripathi, Mohamed R. Saber, Sheng Li, Pratyush Mishra, Benjamin T. Duong, Kari Hernandez, Praveen Sreeramagiri, Yi Li, Ibrahim El Khatib, Whitney Bryks, Mahdi Mohammadighaleni, Joshua Stacey, Travis Palmer, Gang Duan, Jeremy Ecton, Suddhasattwa Nad, Haobo Chen, Robin Shea McRee, Mohammad Mamunur Rahman
  • Micro-conformal templates for nanoimprint lithography
    Patent number: 8616873
    Abstract: A micro-conformal nanoimprint lithography template includes a backing layer and a nanopatterned layer adhered to the backing layer. The elastic modulus of the backing layer exceeds the elastic modulus of the nanopatterned layer. The micro-conformal nanoimprint lithography template can be used to form a patterned layer from an imprint resist on a substrate, the substrate having a micron-scale defect, such that an excluded distance from an exterior surface of the micron-scale defect to the patterned layer formed by the nanoimprint lithography template is less than a height of the defect. The nanoimprint lithography template can be used to form multiple imprints with no reduction in feature fidelity.
    Type: Grant
    Filed: January 26, 2011
    Date of Patent: December 31, 2013
    Assignee: Molecular Imprints, Inc.
    Inventors: Michael N. Miller, Frank Y. Xu, Nicholas A. Stacey
  • Materials for imprint lithography
    Patent number: 8076386
    Abstract: The present invention is directed to a material for use in imprint lithography that features a composition having a viscosity associated therewith and including a surfactant, a polymerizable component, and an initiator responsive to a stimuli to vary the viscosity in response thereto, with the composition, in a liquid state, having the viscosity being lower than about 100 centipoises, a vapor pressure of less than about 20 Torr, and in a solid cured state a tensile modulus of greater than about 100 MPa, a break stress of greater than about 3 MPa and an elongation at break of greater than about 2%.
    Type: Grant
    Filed: February 23, 2004
    Date of Patent: December 13, 2011
    Assignees: Molecular Imprints, Inc., Board of Regents, The University of Texas
    Inventors: Frank Y. Xu, Michael P. C. Watts, Nicholas A. Stacey
  • Micro-Conformal Templates for Nanoimprint Lithography
    Publication number: 20110183027
    Abstract: A micro-conformal nanoimprint lithography template includes a backing layer and a nanopatterned layer adhered to the backing layer. The elastic modulus of the backing layer exceeds the elastic modulus of the nanopatterned layer. The micro-conformal nanoimprint lithography template can be used to form a patterned layer from an imprint resist on a substrate, the substrate having a micron-scale defect, such that an excluded distance from an exterior surface of the micron-scale defect to the patterned layer formed by the nanoimprint lithography template is less than a height of the defect. The nanoimprint lithography template can be used to form multiple imprints with no reduction in feature fidelity.
    Type: Application
    Filed: January 26, 2011
    Publication date: July 28, 2011
    Applicant: MOLECULAR IMPRINTS, INC.
    Inventors: Michael N. Miller, Frank Y. Xu, Nicholas A. Stacey
  • Method to provide a layer with uniform etch characteristics
    Patent number: 7939131
    Abstract: The present invention includes a method and a composition to form a layer on a substrate having uniform etch characteristics. To that end, the method includes controlling variations in the characteristics of a solid layer, such etch characteristics over the area of the solid layer as a function of the relative rates of evaporation of the liquid components that comprise the composition from which the solid layer is formed.
    Type: Grant
    Filed: August 16, 2004
    Date of Patent: May 10, 2011
    Assignee: Molecular Imprints, Inc.
    Inventors: Frank Y. Xu, Christopher J. Mackay, Pankaj B. Lad, Ian M. McMackin, Van N. Truskett, Wesley D. Martin, Edward B. Fletcher, David C. Wang, Nicholas A. Stacey, Michael P. C. Watts
  • Compositions for dark-field polymerization and method of using the same for imprint lithography processes
    Patent number: 7906060
    Abstract: The present invention provides a composition and a method of using the same to form a pattern on a substrate using imprint lithography employing dark-field polymerization. To that end, the composition includes a bis vinyl ether component, and an initiator component that produces an acid in response to radiation. The bis vinyl ether component is reactive to the acid and polymerizes in response thereto.
    Type: Grant
    Filed: April 18, 2008
    Date of Patent: March 15, 2011
    Assignee: Board of Regents, The University of Texas System
    Inventors: Carlton Grant Willson, Nicholas A. Stacey
  • Bifurcated contact printing technique
    Patent number: 7906058
    Abstract: A method for spreading a conformable material between a substrate and a template having a mold. The method comprises positioning the mold to be in superimposition with the substrate defining a volume therebetween. A first sub-portion of the volume is charged with the conformable material through capillary action between the conformable material and one of the mold and the substrate. A second sub-portion of the volume is filled with the conformable material by creating a deformation in the mold.
    Type: Grant
    Filed: December 16, 2005
    Date of Patent: March 15, 2011
    Assignee: Molecular Imprints, Inc.
    Inventors: Mahadevan GanapathiSubramanian, Byung-Jin Choi, Michael N. Miller, Nicholas A. Stacey, Michael P. C. Watts
  • Technique for separating a mold from solidified imprinting material
    Patent number: 7803308
    Abstract: The present invention provides a method for separating a mold from solidified imprinting material that includes creating deformation in the template in which the mold is included. The deformation is sufficient to create a returning force that is greater than an adhesion forced between the solidified imprinting material and the mold. For example, the deformation may result from a pressure differential created between the mold and a side of the template disposed opposite to the mold. In this manner, the distortion may be undulations in the template of sufficient magnitude to contact a substrate upon which the solidified imprinting material is disposed.
    Type: Grant
    Filed: December 1, 2005
    Date of Patent: September 28, 2010
    Assignee: Molecular Imprints, Inc.
    Inventors: Mahadevan GanapathiSubramanian, Byung-Jin Choi, Michael N. Miller, Nicholas A. Stacey
  • Substrate Patterning
    Publication number: 20100112310
    Abstract: Systems and methods for providing identification patterns on substrates are described.
    Type: Application
    Filed: October 28, 2009
    Publication date: May 6, 2010
    Applicant: Molecular Imprints, Inc.
    Inventors: Van Nguyen Truskett, Gerard M. Schmid, Michael N. Miller, Douglas J. Resnick, Benjamin G. Eynon, JR., Byung-Jin Choi, Kosta S. Selinidis, Sidlgata V. Sreenivasan, Nicholas A. Stacey
  • Self-aligned process for fabricating imprint templates containing variously etched features
    Patent number: 7547398
    Abstract: A process that enables coplanarization of the structures that have been created in multiple independent etch steps. The various etches are performed independently by selectively exposing only certain patterns to particular etching conditions. After these structures have been created, it is possible that the various structures will exist at different planes/elevations relative to the template surface. The elevations of the various structures may be adjusted independently by selectively exposing “higher” structures to an anisotropic etch that reduces the overall elevation of the structures, while preserving the structural topography.
    Type: Grant
    Filed: March 29, 2007
    Date of Patent: June 16, 2009
    Assignee: Molecular Imprints, Inc.
    Inventors: Gerard M. Schmid, Nicholas A Stacey, Douglas J. Resnick, Ronald D. Voisin, Lawrence J. Myron
  • Method of creating a turbulent flow of fluid between a mold and a substrate
    Patent number: 7531025
    Abstract: The present invention is directed toward a method of controlling a turbulent flow of a fluid between a substrate and a template, and more specifically, controlling a turbulent flow of a fluid between droplets disposed on a substrate and a template. To that end, the method further comprises the ingression and egression of the fluid through a first and second aperture, and in a further embodiment, a plurality of apertures, to create such a turbulent flow of the fluid.
    Type: Grant
    Filed: July 23, 2004
    Date of Patent: May 12, 2009
    Assignees: Molecular Imprints, Inc., Board of Regents, University of Texas System
    Inventors: Ian M. McMackin, Nicholas A. Stacey, Daniel A. Babbs, Duane J. Voth, Mathew P. C. Watts, Van N. Truskett, Frank Y. Xu, Ronald D. Voisin, Pankaj B. Lad
  • Imprint Fluid Control
    Publication number: 20080303187
    Abstract: An imprint lithography template with an active area arranged to receive imprinting material during an imprint lithography process and a non-active area adjacent the active area is described. At least a portion of the non-active area is treated to inhibit flow of the imprinting material from the active area to the non-active area during the imprint lithography process.
    Type: Application
    Filed: December 28, 2007
    Publication date: December 11, 2008
    Applicant: MOLECULAR IMPRINTS, INC.
    Inventors: Nicholas A. Stacey, Edward Brian Fletcher, Michael N. Miller, Michael P.C. Watts
  • Compositions for Dark-Field Polymerization and Method of Using the Same for Imprint Lithography Processes
    Publication number: 20080230959
    Abstract: The present invention provides a composition and a method of using the same to form a pattern on a substrate using imprint lithography employing dark-field polymerization. To that end, the composition includes a bis vinyl ether component, and an initiator component that produces an acid in response to radiation. The bis vinyl ether component is reactive to the acid and polymerizes in response thereto.
    Type: Application
    Filed: April 18, 2008
    Publication date: September 25, 2008
    Applicant: Board of Regents, University of Texas System
    Inventors: C. Grant Willson, Nicholas A. Stacey
  • Compositions for dark-field polymerization and method of using the same for imprint lithography processes
    Patent number: 7365103
    Abstract: A composition is provided and a method of using the same to form a pattern on a substrate using imprint lithography employing dark-field polymerization is disclosed. The composition includes a polymerizable bisvinylether and an initiator that produces an acid in response to radiation.
    Type: Grant
    Filed: December 12, 2002
    Date of Patent: April 29, 2008
    Assignee: Board of Regents, The University of Texas System
    Inventors: C. Grant Willson, Nicholas A. Stacey
  • Self-Aligned Process for Fabricating Imprint Templates Containing Variously Etched Features
    Publication number: 20070243655
    Abstract: A process that enables coplanarization of the structures that have been created in multiple independent etch steps. The various etches are performed independently by selectively exposing only certain patterns to particular etching conditions. After these structures have been created, it is possible that the various structures will exist at different planes/elevations relative to the template surface. The elevations of the various structures may be adjusted independently by selectively exposing “higher” structures to an anisotropic etch that reduces the overall elevation of the structures, while preserving the structural topography.
    Type: Application
    Filed: March 29, 2007
    Publication date: October 18, 2007
    Applicant: MOLECULAR IMPRINTS, INC.
    Inventors: Gerard M. Schmid, Nicholas A. Stacey, Douglas J. Resnick, Ronald D. Voisin, Lawrence J. Myron
  • Composition to provide a layer with uniform etch characteristics
    Patent number: 7282550
    Abstract: The present invention includes a composition to form a layer on a substrate having uniform etch characteristics. To that end, the composition has a plurality of components, a subset of which has substantially similar rates of evaporation for an interval of time.
    Type: Grant
    Filed: August 16, 2004
    Date of Patent: October 16, 2007
    Assignee: Molecular Imprints, Inc.
    Inventors: Frank Y. Xu, Nicholas A. Stacey
  • System for creating a turbulent flow of fluid between a mold and a substrate
    Patent number: 7270533
    Abstract: The present invention is directed toward a system for introducing a flow of a fluid between a mold, disposed on a template, and a substrate, the system including, a fluid supply system; and a chuck body having a baffle and first and second apertures, the first and second apertures disposed between the baffle and the template, with the first and second apertures in fluid communication with the fluid supply system to produce a turbulent flow of the fluid between the mold and said substrate.
    Type: Grant
    Filed: July 23, 2004
    Date of Patent: September 18, 2007
    Assignees: University of Texas System, Board of Regents, Molecular Imprints, Inc.
    Inventors: Ian M. McMackin, Nicholas A. Stacey, Daniel A. Babbs, Duane J. Voth, Mathew P. C. Watts, Van N. Truskett, Frank Y. Xu, Ronald D. Voisin, Pankaj B. Lad