Abstract: Improved Sealed Expansion Module is an enclosure for housing electronics, such as circuit boards, POTS/VDSL cables having connectors, a fiber cable having a connector and a power cable having a connector. The preferred embodiment of Improved Sealed Expansion Module is comprised of at least some of the following: an enclosure having two internally undivided chambers (upper and lower), an access hatch attached with captive fasteners to the lower chamber of the enclosure, circuit boards located in the upper chamber of the enclosure, a surge protector and POTS/VDSL, fiber and power cables with connectors within the lower chamber of the enclosure, and a plurality of openings on the bottom of the lower chamber for POTS/VDSL interconnection cables, fiber interconnection cables, power interconnection cables at customer sites.

Abstract: A multi-dwelling unit (MDU) module is configured for providing telephony communicating services and non-telephony services. The MDU module includes a motherboard and a plurality of service units connected to the motherboard. Each one of said service units and the motherboard are jointly configured for providing non-telephony service and telephony service to a plurality of service subscribers. The motherboard is configured for providing overload power management to limit power consumption associated with said telephony services during an overload condition and for providing lifeline power management to limit power consumption associated with said non-telephony services during a power outage condition. The MDU module optionally includes lightning primary surge protection blocks configured for being connected to the service units.

Abstract: Improved Sealed Expansion Module is an enclosure for housing electronics, such as circuit boards, POTS/VDSL cables having connectors, a fiber cable having a connector and a power cable having a connector. The preferred embodiment of Improved Sealed Expansion Module is comprised of at least some of the following: an enclosure having two internally undivided chambers (upper and lower), an access hatch attached with captive fasteners to the lower chamber of the enclosure, circuit boards located in the upper chamber of the enclosure, a surge protector and POTS/VDSL, fiber and power cables with connectors within the lower chamber of the enclosure, and a plurality of openings on the bottom of the lower chamber for POTS/VDSL interconnection cables, fiber interconnection cables, power interconnection cables at customer sites.

Abstract: A cabinet for electronics equipment, comprising: a compartment for installing the electronics equipment; a door for accessing the compartment; an outer duct mounted on an outer surface of the door for directing exterior air around a heat exchanger core mounted in the door, the heat exchanger core for transferring heat from interior air in the compartment to the exterior air to thereby cool the interior air; an exhaust duct extending over a top surface of the compartment and pneumatically coupling with the outer duct when the door is in a closed position, the exhaust duct for exhausting the exterior air and for reducing solar loading on the top surface by transferring heat absorbed by the exhaust duct to the exterior air passing therethrough; and, one or more fans for forcing the exterior air in through the outer duct, around the heat exchanger core, and out through the exhaust duct, the one or more fans being mounted between the outer duct and the exhaust duct to thereby attenuate noise emitted by the one or

Abstract: An electromagnetic interference and compatibility (EMI/EMC) shielding enclosure for a printed circuit board (PCB) or other electronic components has a conductive plastic top housing portion and a conductive bottom housing portion. The top housing portion has projecting fingers integral therewith. The bottom housing portion has an inner surface with walls projecting therefrom for substantially encompassing the PCB. When the enclosure is assembled, the PCB is located between the top housing portion and the bottom housing portion, the fingers from the top housing portion surround at least a major portion of the PCB and the fingers physically contact the bottom housing portion or are sufficiently close for capacitive coupling.