Abstract: Examples of computing devices including a processor, memory, and a display device housed within the same enclosure are described. In examples, the display device, which may include a cover glass, may be attached to the enclosure using a multilayer adhesive member, the multilayer adhesive including a first adhesive layer and a second adhesive layer disposed on opposite sides of a foam layer. The first and/or second adhesive layers may include two or more layers of a pressure sensitive adhesive (PSA), which may be separated using one or more adhesive carrier films. In examples, the first and/or second adhesive layers may include a low tack (e.g. removable) PSA for adhering to surfaces of the display and enclosure and for facilitation removal and re-workability of the adhesive joint.

Abstract: An apparatus for providing power to an electronic device may include a power input configured to receive an input voltage from a power supply, and a rectifier operatively connected to the power input and configured to convert the input voltage to a first voltage. The rectifier may further be configured to transmit the first voltage to a first power output operatively connected to the rectifier. The apparatus may further include a power converter operatively connected to the rectifier and configured to convert the first voltage to a second voltage different than the first voltage and a first relay operatively connected to the rectifier to selectively prevent the first voltage from being transmitted through the first power output. The power converter may further be configured to transmit the second voltage to a second power output operatively connected to the power converter.

Abstract: An electronic device housing may contain a display module. The display module may contain layers of material such as a color filter layer and a thin-film transistor layer. These layers of material may be mounted in a display module chassis. A cover glass may cover the display module. The housing may have springs that mate with corresponding holes in the chassis of the display module to hold the display module in place within the housing. The springs may flex about a flex axis that is perpendicular to a planar rear housing surface and the planar layers of the display module. A disassembly tool may be inserted into a gap between the cover glass and housing sidewalls. When the disassembly tool is rotated, a fin on the tool may press against an engagement structure in the spring and may release the spring from the display module.

Abstract: An apparatus for providing power to an electronic device may include a power input configured to receive an input voltage from a power supply, and a rectifier operatively connected to the power input and configured to convert the input voltage to a first voltage. The rectifier may further be configured to transmit the first voltage to a first power output operatively connected to the rectifier. The apparatus may further include a power converter operatively connected to the rectifier and configured to convert the first voltage to a second voltage different than the first voltage and a first relay operatively connected to the rectifier to selectively prevent the first voltage from being transmitted through the first power output. The power converter may further be configured to transmit the second voltage to a second power output operatively connected to the power converter.

Abstract: An electronic device housing may contain a display module. The display module may contain layers of material such as a color filter layer and a thin-film transistor layer. These layers of material may be mounted in a display module chassis. A cover glass may cover the display module. The housing may have springs that mate with corresponding holes in the chassis of the display module to hold the display module in place within the housing. The springs may flex about a flex axis that is perpendicular to a planar rear housing surface and the planar layers of the display module. A disassembly tool may be inserted into a gap between the cover glass and housing sidewalls. When the disassembly tool is rotated, a fin on the tool may press against an engagement structure in the spring and may release the spring from the display module.